Panasonic KX-DT333UA Service Manual ▷ View online
25
KX-DT333UA/KX-DT333UA-B
4. Hook the Spring on the rib of the Cabinet Cover.
Note:
Confirm that the Hook Ass’y is fixed by the hooks A.
5. Set the Cams as in Fig-C and then put the Cabinet Cover onto the
Stand.
6. Insert the 2 Pivots.
Note:
Confirm the smooth moving of the Cavinet Cover in the direction of
the arrow A.
the arrow A.
26
KX-DT333UA/KX-DT333UA-B
9 Miscellaneous
9.1.
Terminal Guide of the ICs Transistors and Diodes
27
KX-DT333UA/KX-DT333UA-B
9.2.
How To Replace a Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a sol-
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
9.2.1.
Preparation
• PbF (: Pb free) Solder
• Soldering Iron
• Soldering Iron
Tip Temperature of 700
°F ± 20°F (370°C ± 10°C)
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
• Flux
Recommended Flux: Specific Gravity
→ 0.82.
Type
→ RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.3).
9.2.2.
Removal Procedure
1. Put plenty of solder on the IC pins so that the pins can be
completely covered.
Note:
Note:
If the IC pins are not soldered enough, you may give
pressure to the P.C. board when cutting the pins with
a cutter.
pressure to the P.C. board when cutting the pins with
a cutter.
2. Make a few cuts into the joint (between the IC and its
pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC
pins.
When you attach a new IC to the board, remove all solder
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
9.2.3.
Procedure
1. Tack the flat pack IC to the PCB by temporarily soldering
two diagonally opposite pins in the correct positions on
the PCB.
the PCB.
Be certain each pin is located over the correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the sol-
dering iron along the tips of the pins while feeding enough
solder to the tip so that it flows under the pins as they are
heated.
solder to the tip so that it flows under the pins as they are
heated.
9.2.4.
Removing Solder From Between
Pins
Pins
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part
2. With a hot iron, use a sweeping motion along the flat part
of the pin to draw the solder from between the adjacent
pads.
pads.
28
KX-DT333UA/KX-DT333UA-B
10 Schematic Diagram
10.1. Main Board
1/4
2/4
3/4
4/4
(a)
(b)
(c)
(d)
(e)
(f)
(g)
(h)
(i)
(j)
(k)
(m)
(n)
(p)
(q)
(r) (s)
(t)
(u)
(v)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
KX-DT333
UA
/KX-DT333
UA
-B :
MAIN BO
ARD (1/4)
Vref
CC
DE
T
MIC_SEL
BT_TxD
BT_RxD
PCM_IN
PCM_CLK
PCM_OUT
SP_AMP
PCM_SYNC
RSTOUT3
HD_DET
CN4
1
2
CN3
1
2
AG
C87
0.047
C93
Z0.1
C92
6.3V100
D3.3V2
C81 68P
C61 330P
C82
0.1
C62
0.033
AG
C86
1500P
C75
1000P
C91 0.01
A3.3V
16
PCMCLK
29
VDD
4
PIO0
28
GND
CN1
30
VDD
8
RESET
5
PIO1
7
PIO2
15
PCMIN
14
PCMOUT
6
PIO3
27
GND
D3.3V2
DG
C105 Z0.1
IC8
5
A
1
COM
6
Y2
7
Y1
A3.3V
IC8
8
4
2
3
DG
D3.3V2
AG
AG
AG
IC7
1
SHUTDOWN
2
BYPASS
3
+IN
4
-IN
5
Vo1
6
VDD
7
GND
8
Vo2
AG
AG
C94
100P
AG
AG
9
UART_TX
10
UART_RX
13
PCMSYNC
C76
1
C39 Z0.1
C67 Z0.1
MIC3
SP3-
MIC2
SP2
MIC1
SP1
SP3+
C89
N
C
D3.3V2
C77
NC
C65 0.01
IC10
5
3
Q6
E
C
B
IC12
NC
1
2
3
4
5
6
7
8
C99 NC
C79
NC
A3.3V
C80
NC
C73
0.1
AG
AG
RA6
NC
1 2 3
4
5
6
7
8
AG
A3.3V
CN2
1
2
3
CN2
4
5
C74 0.01
C64
6.3V100
A3.3V
AG
AG1
C68
1500P
Q7
E
C
B
A3.3V
C84 Z0.1
AG
D3.3V2
C97
100P
C95
100P
R85 33K
R112
NC
R77 10K
R67
33
R95
220K
R87
15K
R92
NC
R94 NC
R82
22K
R61 220K
R88
22K
R64 2.2K
R62
15K
R80
820K
R79
0
R90 3.3
[2125]
R91
NC
R75
150
R115 47K
R81 560K
R78 1K
R63 470
R76
1K
R84 2.2K
R69 33K
R86 33K
R89
NC
R74
270K
R68 33K
R93
NC
R65 47k
R66
220
C85 0.01
C72 0.01
C66 0.01
R83
56
C88
220P
DG
C120
0.01
C98
1000P
C78 0.01
SP
MIC
to LCD board
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