DOWNLOAD Panasonic KX-A405CE Service Manual ↓ Size: 727.41 KB | Pages: 34 in PDF or view online for FREE

ORDER NO. KMS1101802CE

(for Europe, Asia, Middle Near East, Russia and Africa)

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1 Safety Precautions -----------------------------------------------3

1.1. For Service Technicians ----------------------------------3

2 Warning --------------------------------------------------------------3

2.1. About Lead Free Solder (PbF: Pb free) --------------3

2.1.1. Suggested PbF Solder -------------------------------4
2.1.2. Information for Users on Collection and

Disposal of Old Equipment and used
Batteries -------------------------------------------------4

2.2. Discarding of P. C. Board --------------------------------4

3 Specifications ------------------------------------------------------5
4 Technical Descriptions------------------------------------------6

4.1. Block Diagram (Main) -------------------------------------6
4.2. Block Diagram (RF Part) ---------------------------------6
4.3. Circuit Operation -------------------------------------------7

4.3.1. BBIC (Base Band IC: IC501) -----------------------7
4.3.2. EEPROM (IC611) -------------------------------------7
4.3.3. Power Supply Circuit ---------------------------------8
4.3.4. RF Signal Route ---------------------------------------8

5 Location of Controls and Components--------------------9
6 Installation Instructions-----------------------------------------9

6.1. Registering a Repeater -----------------------------------9
6.2. Deregistering a Repeater --------------------------------9

7 Troubleshooting Guide---------------------------------------- 10

7.1. Flow Chart ------------------------------------------------- 10

7.1.1. Flow Chart--------------------------------------------- 10
7.1.2. Check Table for repeater operation ------------- 11

7.2. Check Power ---------------------------------------------- 12
7.3. Check Link ------------------------------------------------- 13
7.4. Check the RF part---------------------------------------- 14

8 Disassembly and Assembly Instructions--------------- 15

8.1. Disassembly Instructions------------------------------- 15

9 Measurements and Adjustments -------------------------- 16

9.1. Equipment Required------------------------------------- 16
9.2. The Setting Method of JIG----------------------------- 16

9.2.1. Connections ------------------------------------------ 16
9.2.2. Commands-------------------------------------------- 17

9.3. Adjustment Standard  ----------------------------------- 18

9.3.1. Bottom View ------------------------------------------ 18

9.4. Clock adjustment after crystal replacement ------- 19
9.5. Frequency Table------------------------------------------ 19

10 Miscellaneous ---------------------------------------------------- 20

10.1. How to Replace the Flat Package IC --------------- 20

10.1.1. Preparation-------------------------------------------- 20
10.1.2. How to Remove the IC ----------------------------- 20
10.1.3. How to Install the IC -------------------------------- 20
10.1.4. How to Remove a Solder Bridge ---------------- 20

10.2. How to Replace the LLP (Leadless Leadframe

Package) IC and IC ground plate -------------------- 21

10.2.1. Preparation-------------------------------------------- 21
10.2.2. Caution------------------------------------------------- 21
10.2.3. How to Remove the IC ----------------------------- 21
10.2.4. How to Install the IC -------------------------------- 21
10.2.5. How to Remove a Solder Bridge (Doesn't

apply to IC ground plate.) ------------------------- 22

10.3. Terminal Guide of the ICs, Transistors and

Diodes------------------------------------------------------- 23

11 Schematic Diagram--------------------------------------------- 25

11.1. For Schematic Diagram -------------------------------- 25

11.2. Schematic Diagram  ------------------------------------ 26

12 Printed Circuit Board------------------------------------------ 29

12.1. Component View----------------------------------------- 29
12.2. Bottom View----------------------------------------------- 30

13 Exploded View and Replacement Parts List----------- 31

13.1. Cabinet and Electrical Parts -------------------------- 31
13.2. Accessories and Packing Materials----------------- 32
13.3. Replacement Parts List -------------------------------- 33

13.3.1. Cabinet and Electrical Parts --------------------- 33
13.3.2. Accessories and Packing Materials ------------ 33
13.3.3. Main P.C. Board Parts ----------------------------- 33
13.3.4. Fixtures and Tools ---------------------------------- 34

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• Repair service shall be provided in accordance with repair technology information such as service manual so as to

prevent fires, injury or electric shock, which can be caused by improper repair work.

1. When repair services are provided, neither the products nor their parts or members shall be remodeled. 
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced. 
3. FASTON terminals shall be plugged straight in and unplugged straight out. 

• ICs and LSIs are vulnerable to static electricity.

1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.

• PbF solder has a melting point that is 50 

°F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with

temperature control and adjust it to 700 

°F ± 20 °F (370 °C ± 10 °C).

• Exercise care while using higher temperature soldering irons.: 

Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 

°F (600 °C).

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See the figure below).

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There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other
materials. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.

When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.