DOWNLOAD Panasonic KX-TU301RUME Service Manual ↓ Size: 1.99 MB | Pages: 46 in PDF or view online for FREE

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• Repair service shall be provided in accordance with repair technology information such as technical guides so as to

prevent fires, injury or electric shock, which can be caused by improper repair work.

1. When repair services are provided, neither the products nor their parts or members shall be remodeled. 
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced. 
3. FASTON terminals shall be plugged straight in and unplugged straight out. 

• ICs and LSIs are vulnerable to static electricity.

1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.

1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.

• PbF solder has a melting point that is 50 

°F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with 

temperature control and adjust it to 700 

°F ± 20 °F (370 °C ± 10 °C). 

• Exercise care while using higher temperature soldering irons.: 

Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 

°F (600 °C).

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See the figure below).

Component

Component 
pin

solder

Remove all of the
excess solder

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There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer’s
specific instructions for the melting points of their products and any precautions for using their product with other materials. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.

When discarding P.C.Board, delete all personal information such as telephone directory and caller list of scrap P.C.Board. 

0.3 mm X 100 g

0.6 mm X 100 g

1.0 mm X 100 g

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• Design and specifications are subject to change without notice.

Standard:
Frequency band:
Tx Frequency range:
Rx Frequency range:
Tx / Rx separation:
Number of RF channels:
Output power:
Duplex procedure:
Channel spacing:
Bit rate:
Modulation:
Connection:

Audio:

SIM card type:
Power source:

Dual-band GSM 900/1800 MHz

45 MHz
174

95 MHz
374

FDD - TDMA (Frequency Division Duplex - Time Division Multiple Access
200 kHz
270.833 kbit/s
GMSK (Gaussian filtered Minimum Shift Keying)
8 Ch/TDMA

Battery: 

Li-Ion 3.7 V/940 mAh

Antenna:

Internal

1.8 V/3 V

Half Rate, Full Rate, Enhanced Full Rate (HR/FR/EFR)
Adaptive Multi-rate - Narrow Band (AMR-NB)

900 MHz EGSM 900

1800 MHz DCS 1800

880-915 MHz

1,710 - 1,785 MHz

925 - 960 MHz

1,805 - 1,880 MHz

Class 4 (2W)

Class 1 (1W)

 

 

   

 

 

Power consumption(Charger):

Operating/Charging conditions:
Dimensions(Charger):
Dimensions(Handset):
Mass(weight)(Charger):
Mass(weight)(Handset):

220-240 V AC, 50/60 Hz
Standby: Approx. 0.2 W
Maximum: Approx. 4.0 W

0

°C–40°C, 20%–80% relative air humidity (dry) Charging: 5 ˚C – 40 ˚C 

Approx. 63 mm x 68 mm x 45 mm
Approx. 49 mm x 20 mm x 128 mm
Approx. 50 g
Approx. 130 g

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FLASH

IC2

32M bit

26MHz 
Crystal
X1

32KHz 
Crystal 
X2

TFT-LCD
(128 x160)

POW

Jack

Litium-ion
Battery

KeyPAD

Key
LED

LCD LED

SIM Card

SRAM

IC3

1M bit

MIC

RECEIVER

SPEAKER

SPI

BACKLIGHT

KEY

SIM

16bit

16bit

VBAT

POWON  SW

PWON

Headset Jack

LED
Power IC (IC3)

W_LED_DRV

Tx Module

(PA+SW)

Rx

SAW

Matching

Matching

Antenna

Tx (900)

Tx (1800)

Rx(900)

Rx(1800)

PMB7880 (ULC2)

MIC

EPP

SP

HS_MIC

Torch
LED

Charger
Control
IC (IC2)

LDO
IC1

KeyLock  SW

KeyLock

Vibrator

LDO
IC4

VIB

Charger
Termina

AC Adapter
(PNLV226)

CHARGER

Thermistor
CF1

M0

Bell
LED

HS_SP

HS_DET
     (M2)

7   11

6

15

41

17    26

29    32

28

53

63

34

44

39,40

46,47

35,36,58,59

48,49

2    4,52

KX-TU301 BLOCK DIAGRAM (HANDSET)