Panasonic DMR-EH65EE / DMR-EH65GC / DMR-EH65GCS / DMR-EH65GN Service Manual ▷ View online
Vol. 1
Colour
(S).......................Silver Type
DVD Recorder
ORDER NO.CHM0605031CE
1 Safety Precaution
3
1.1.
General guidelines
3
2 Warning
4
2.1.
Prevention of Electrostatic Discharge (ESD) to
Electrostatic Sensitive (ES) Devices
4
2.2.
Precaution of Laser Diode
5
2.3.
Service caution based on legal restrictions
6
3 Service Navigation
7
3.1.
Service Information
7
3.2.
Caution for DivX
7
4 Specifications
8
5 New Feature
11
5.1.
About DivX
11
5.2.
HDAVI Control (HDMI Link)
16
6 Location of Controls and Components
18
7 Operation Instructions
20
7.1.
Taking out the Disc from DVD-Drive Unit when the Disc
cannot be ejected by OPEN/CLOSE button
20
8 Service Mode
21
8.1.
Self-Diagnosis and Special Mode Setting
21
9 Service Fixture & Tools
30
10 Disassembly and Assembly Instructions
31
10.1. Disassembly Flow Chart
31
10.2. P.C.B. Positions
31
10.3. Top Case
32
10.4. Front Panel
32
10.5. SD Card P.C.B.
32
10.6. RAM/Digital P.C.B. Module
32
10.7. DV Jack P.C.B.
34
10.8. HDD
34
10.9. Rear Panel
35
10.10. Power P.C.B.
36
10.11. Main P.C.B. and Front (L) P.C.B.
37
10.12. Tuner P.C.B.
37
10.13. HDMI P.C.B.
37
11 Measurements and Adjustments
38
11.1. Service Positions
38
11.2. Caution for Replacing Parts
42
11.3. Standard Inspection Specifications after Making Repairs 44
12 Block Diagram
45
12.1. Power Supply Block Diagram
45
12.2. Analog Video Block Diagram
47
12.3. Analog Audio Block Diagram
48
12.4. Analog Timer Block Diagram
49
12.5. HDMI Block Diagram
50
13 Schematic Diagram
51
13.1. Interconnection Schematic Diagram
51
13.2. Power Supply Schematic Diagram
52
13.3. Main Net (1/4) Section (Main P.C.B. (1/4)) Schematic
Diagram (M)
53
13.4. Main Net (2/4) Section (Main P.C.B. (1/4)) Schematic
Diagram (M)
54
13.5. Main Net (3/4) Section (Main P.C.B. (1/4)) Schematic
Diagram (M)
55
13.6. Main Net (4/4) Section (Main P.C.B. (1/4)) Schematic
Diagram (M)
56
13.7. A/V I/O (1/4) Section (Main P.C.B. (2/4)) Schematic
Diagram (AV)
58
13.8. A/V I/O (2/4) Section (Main P.C.B. (2/4)) Schematic
Diagram (AV)
59
13.9. A/V I/O (3/4) Section (Main P.C.B. (2/4)) Schematic
Diagram (AV)
60
13.10. A/V I/O (4/4) Section (Main P.C.B. (2/4)) Schematic
Diagram (AV)
61
13.11. Nicam Decoder Section (Main P.C.B. (3/4)) Schematic
Diagram (DE)
63
13.12. Timer (1/4) Section (Main P.C.B. (4/4)) Schematic
Diagram (T)
64
13.13. Timer (2/4) Section (Main P.C.B. (4/4)) Schematic
Diagram (T)
65
13.14. Timer (3/4) Section (Main P.C.B. (4/4)) Schematic
Diagram (T)
66
13.15. Timer (4/4) Section (Main P.C.B. (4/4)) Schematic
Diagram (T)
67
13.16. HDMI Schematic Diagram
68
13.17. Tuner Pack Schematic Diagram
70
13.18. SD Card Schematic Diagram
71
13.19. Front (L) Schematic Diagram
72
13.20. DV Jack Schematic Diagram
72
14 Printed Circuit Board
73
14.1. Power P.C.B.
73
14.2. Main P.C.B.
74
14.3. HDMI P.C.B.
79
14.4. Tuner P.C.B. and DV Jack P.C.B.
80
14.5. SD Card P.C.B. and Front (L) P.C.B.
81
15 Appendix for Schematic Diagram
83
15.1. Voltage and Waveform Chart
83
16 Parts and Exploded Views
91
16.1. Exploded Views
91
16.2. Replacement Parts List
93
CONTENTS
Page
Page
2
DMR-EH65EE / DMR-EH65GC / DMR-EH65GCS / DMR-EH65GN
1.1.1. Leakage current cold check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1M
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1M
W and 5.2MW.
When the exposed metal does not have a return path to the
chassis, the reading must be
chassis, the reading must be
.
Figure 1
1.1.2. Leakage current hot check
(See Figure 1 .)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5k
W, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
and a good earth ground such as a water pipe, as shown in
Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliampere. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliampere. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
1 Safety Precaution
1.1. General guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
3
DMR-EH65EE / DMR-EH65GC / DMR-EH65GCS / DMR-EH65GN
2 Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive
(ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
Electrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage
an ES device).
an ES device).
4
DMR-EH65EE / DMR-EH65GC / DMR-EH65GCS / DMR-EH65GN