Panasonic VL-GD001RU Service Manual ▷ View online
VL-GD001RU
DECT Adaptor
(for Russia)
(for Ukraine)
Voice Intercom System
ORDER NO. KM40509878CE
1
ABOUT LEAD FREE SOLDER (PbF: Pb free)
3
1.1.
Suggested PbF Solder
3
1.2.
How to Recognize that Pb Free Solder is Used
4
2
FOR SERVICE TECHNICIANS
4
3
CAUTION
4
4
OPERATING INSTRUCTIONS
5
4.1.
Compatible models
5
4.2.
Location of Controls
6
4.3.
Before installation
6
4.4.
For best performance
7
4.5.
Connections
8
4.6.
Registering the DECT Adaptor to a Base Unit
9
4.7.
Troubleshooting
9
5
DISASSEMBLY INSTRUCTIONS
10
6
TROUBLESHOOTING FLOWCHART
11
6.1.
Power Supply
12
6.2.
LED Circuit
13
6.3.
Check Link
14
6.4.
Receiving the Call Button on the Doorphone
17
6.5.
Transmission with Doorphone
21
6.6.
Door Key Reception
23
6.7.
Around RF
24
6.8.
EEPROM Trouble
26
6.9.
How to Adjust the Doorphone Volume
28
7
TROUBLESHOOTING BY SYMPTOM
29
7.1.
Check Point
29
7.2.
The Setting Method of JIG
31
7.3.
How to read ID
33
7.4.
How to Confirm Download and Checksum
34
7.5.
Adjustment Standard
37
7.6.
Adjustment Value
38
8
THINGS TO DO AFTER REPLACING IC
39
9
RF SPECIFICATION
39
10 BLOCK DIAGRAM
40
11 CIRCUIT OPERATION
41
11.1. Outline
41
11.2. Power Supply Circuit
42
11.3. Incoming Detection Circuit
43
11.4. Back Tone Sending-out Circuit
43
11.5. Voice Path Formation Circuit
43
11.6. Door Opener
43
11.7. Transmitter/Receiver
43
12 SIGNAL ROUTE
44
13 CPU DATA
45
13.1. IC1 (BBIC)
45
14 EEPROM LAYOUT
47
14.1. Scope
47
14.2. Introduction
47
14.3. EEPROM contents
47
15 HOW TO REPLACE THE FLAT PACKAGE IC
51
15.1. PREPARATION
51
15.2. FLAT PACKAGE IC REMOVAL PROCEDURE
51
15.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
52
15.4. BRIDGE MODIFICATION PROCEDURE
52
16 CABINET AND ELECTRICAL PARTS
53
17 ACCESSORIES AND PACKING MATERIALS
54
18 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
55
19 REPLACEMENT PARTS LIST
56
19.1. Cabinet and Electrical Parts
56
19.2. Main P.C.Board Parts
56
19.3. Accessories and Packing Materials
58
19.4. Fixtures and Tools
58
20 FOR SCHEMATIC DIAGRAM
59
21 SCHEMATIC DIAGRAM
60
22 CIRCUIT BOARD (MAIN)
63
22.1. Component View
63
22.2. Flow Solder Side View
64
Note:
Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You can
download and refer to the original Operating Instructions on TSN Server for further information.
download and refer to the original Operating Instructions on TSN Server for further information.
CONTENTS
Page
Page
2
VL-GD001RU
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
•
PbF solder has a melting point that is 50°F ~ 70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
•
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
•
If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
and be sure that any remaining is melted prior to applying the Pb solder.
•
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
3
VL-GD001RU
1.2. How to Recognize that Pb Free Solder is Used
(Example: Main P.C.B.)
RLY1
1
10
CN6
32
27
26
17
16
11
21
80
61
60
41
40
1
28
1
4
15
14
RLY2
CN1
PbF
X2
IC1
IC2
Marked
(Component View)
Note:
The location of the “PbF” mark is subject to change without notice.
2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic parts boxes with aluminum foil and ground them.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
3 CAUTION
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
4
VL-GD001RU