DOWNLOAD Panasonic BB-HCM547CE Service Manual ↓ Size: 5.24 MB | Pages: 102 in PDF or view online for FREE

 Order No.KMS0808507CE

(for Europe, Asia, Oceania, Middle Near East, Russia, 
Africa, and Latin America) 

2

PAGE

PAGE

1 Warning --------------------------------------------------------------3

1.1. Battery Caution ---------------------------------------------3
1.2. Information for Users on Collection and

Disposal Old Equipment and used Batteries--------3

1.3. About Lead Free Solder (PbF: Pb free) --------------4
1.4. For Service Technicians ----------------------------------5
1.5. Trademarks --------------------------------------------------5

2 Specifications ------------------------------------------------------6
3 Features --------------------------------------------------------------8
4 Technical Descriptions------------------------------------------9

4.1. CPU Peripheral Block-------------------------------------9
4.2. Camera Block (Image signal processing,

LENS control) --------------------------------------------- 11

4.3. Image Compression Block ----------------------------- 14
4.4. Audio Block ------------------------------------------------ 15
4.5. LAN Block -------------------------------------------------- 16
4.6. Pan and Tilt Motor Control Circuit-------------------- 17
4.7. Power Supply Block ------------------------------------- 18
4.8. PoE Block -------------------------------------------------- 19
4.9. Others ------------------------------------------------------- 20

5 Location of Controls and Components------------------ 21
6 Installation Instructions--------------------------------------- 22

6.1. Installation Guide----------------------------------------- 22
6.2. Setup Guide ----------------------------------------------- 27

7 Troubleshooting Guide---------------------------------------- 29

7.1. Basic Operation------------------------------------------- 29
7.2. Other Function Check----------------------------------- 30
7.3. Power Supply Block Check---------------------------- 31
7.4. CPU Peripheral Block Check ------------------------- 32
7.5. LVDS Block Check--------------------------------------- 33
7.6. Image Block Check -------------------------------------- 34
7.7. Audio Block Check--------------------------------------- 35
7.8. LAN Block Check----------------------------------------- 36
7.9. Motor Block Check--------------------------------------- 37

7.10. Lens Block Check ---------------------------------------- 38

7.11. I/O Terminal Check -------------------------------------- 40

7.12. SD Card Block Check----------------------------------- 41
7.13. RTC Circuit Check --------------------------------------- 42
7.14. LED Circuit Check --------------------------------------- 43
7.15. Diagnosis NG Check ------------------------------------ 44
7.16. Version Upgrade Check -------------------------------- 45
7.17. Resetting the Camera----------------------------------- 46
7.18. Updating the Camera’s Firmware -------------------- 47
7.19. Restoring Settings from a Configuration File------ 47
7.20. How to Change MAC Address Label---------------- 48
7.21. How to Replace a Flat Package IC ------------------ 49

8 Disassembly and Assembly Instructions--------------- 50

8.1. Disassembly Instructions------------------------------- 50

9 Block Diagram --------------------------------------------------- 56

10 Schematic Diagram--------------------------------------------- 57

10.1. For The Schematic Diagram -------------------------- 57
10.2. Schematic Diagram-------------------------------------- 58
10.3. Waveform -------------------------------------------------- 75

11 Printed Circuit Board ------------------------------------------ 81

11.1. Main Board (Component View) ----------------------- 81
11.2. Main Board (Bottom View) ----------------------------- 82
11.3. Video Board (Component  View) --------------------- 83
11.4. Video Board (Bottom  View) --------------------------- 83

11.5. Lens Board (Component  View)---------------------- 84
11.6. Lens Board (Bottom  View)---------------------------- 84
11.7. Tilt Board (Component  View) ------------------------ 85
11.8. Tilt Board (Bottom  View) ------------------------------ 85
11.9. IO Board (Component  View) ------------------------- 87

11.10. IO Board (Bottom  View) ------------------------------- 88

11.11. LED Board (Component  View) ---------------------- 89

11.12. LED Board (Bottom  View) ---------------------------- 89

12 Appendix Information of Schematic Diagram -------- 90

12.1. Terminal Guide of ICs, Transistors and Diodes -- 90

13 Exploded View and Replacement Parts List----------- 92

13.1. Cabinet and Electrical Parts Location -------------- 92
13.2. Accessories and Packing Materials  ---------------- 93
13.3. Replacement Parts List -------------------------------- 94

3

Danger of explosion if the battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the
manufacturer. Dispose of used batteries according to the manufacturer’s Instructions.

The lithium battery is a critical component (type No. CR2032/H9B (BAT601)). Please observe for the proper polarity and the
exact location when replacing it and soldering the replacement lithium battery in.

4

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn),
Silver, (Ag), and Copper, (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.

• PbF solder has a melting point that is 50

° F ~ 70°  F (30° C ~ 40° C) higher than Pb solder. Please use a soldering iron with tem-

perature control and adjust it to 700

° F ± 20° F (370° C ± 10°C).

• Exercise care while using higher temperature soldering irons.:

Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100

°F, (600°C).

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See figure, below).

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufacturer’s
specific instructions for the melting points of their products and any precautions for using their product with other materials. The fol-
lowing lead free (PbF) solder wire gauge are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.