Panasonic CY-BT200N Service Manual ▷ View online
ORDER NO. ACED080113C8
AUTOMOTIVE AFTERMARKET
Model No. CY-BT200N
Hands-Free Kit with Audio Streaming
featuring Bluetooth technology
featuring Bluetooth technology
TABLE OF CONTENTS
PAGE
PAGE
1 Service Navigation ----------------------------------------------- 2
2 Specifications ----------------------------------------------------- 3
3 Features ------------------------------------------------------------- 4
4 Technical Descriptions ----------------------------------------- 5
5 Block Diagram----------------------------------------------------- 7
6 Wiring Connection Diagram ---------------------------------- 8
7 Schematic Diagram ---------------------------------------------- 9
8 Schematic Diagram --------------------------------------------- 11
9 Printed Circuit Board-------------------------------------------12
2 Specifications ----------------------------------------------------- 3
3 Features ------------------------------------------------------------- 4
4 Technical Descriptions ----------------------------------------- 5
5 Block Diagram----------------------------------------------------- 7
6 Wiring Connection Diagram ---------------------------------- 8
7 Schematic Diagram ---------------------------------------------- 9
8 Schematic Diagram --------------------------------------------- 11
9 Printed Circuit Board-------------------------------------------12
10 Exploded View and Replacement Parts List -----------15
11 Schematic Diagram for Printing with A4 Size----------19
2
1 Service Navigation
1.1.
About Lead Free Solder(PbF)
Distinction of PbF PCB
• PCBs(manufacture)using lead free solder will have a PbF
stamp on the PCB.
Caution
• Pb free solder has a higher melting point than standard sol-
der; Typically the melting point is 50 - 70
°
F (30 - 40
°
C)
higher. Please use a soldering iron with temperature control
and adjust it to 700 ± 20
and adjust it to 700 ± 20
°
F (370 ± 10
°
C). In case of using
high temperature soldering iron, please be careful not to
heat too long.
heat too long.
• Pb free solder will tend to splash when heated too high
(about 1100
°
F/600
°
C)
3
2 Specifications
2.1.
Specfications
2.2.
Dimensions
General
Power Supply
Power Supply
DC 12V (11V-16V). Test Voltage
14.4V Negative Ground
(Supplied From a head unit or a
Expansion Module)
14.4V Negative Ground
(Supplied From a head unit or a
Expansion Module)
Current Consumtion
Less than 1.0A
Communication Frequency
2,402MHz - 2,480MHz
Number of channels
79 channels
Channel width
1.0MHz
Communication mode
Frequency hopped spread spec-
trum communication
trum communication
RF Output
-1 dBm (0.8mW)
Service area
Within 10m
Applicable Bluetooth version
Ver. 1.2
Supported profile
HFP(Hands-Free Pro-
file),OPP(Object Push Pro-
file),A2DP(Advanced Audio
Distribution Profile),AVRCP(Audio/
Video Remote Control Profile)
file),OPP(Object Push Pro-
file),A2DP(Advanced Audio
Distribution Profile),AVRCP(Audio/
Video Remote Control Profile)
Microphone impedance
600
Ω
Dimensions (W x H x D)**
72.8 x 102 x 24mm
(Excluding Switch Unit and Micro-
phone)
(Excluding Switch Unit and Micro-
phone)
Weight**
0.5kg
(Excluding Switch Unit and Micro-
phone)
(Excluding Switch Unit and Micro-
phone)
*Specifications and the design are subject to possible modification
without notice due to improments
** Dimensions and Weight shown are approximate
***Above specfications comply with EIA standards.
without notice due to improments
** Dimensions and Weight shown are approximate
***Above specfications comply with EIA standards.
4
3 Features
• Connection between this unit and head unit allows users to
“receive calls”, “call back”,and “reject incoming calls” without
direct operation of Bluetooth-ready mobile phone.
direct operation of Bluetooth-ready mobile phone.