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5

Disconnect AC power, discharge Power Supply Capacitors for : 
Main Unit (SU-ZT1)
(C5501, C5502, C5509) through a 10

Ω, 1W resistor to ground.

DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices.
After repairs are completed, restore power gradually using a variac, to avoid overcurrent.

• Current consumption at AC 220-240 V, 50 Hz in NO SIGNAL mode should be 200~800 mA (GN).
• Current consumption at AC 110-240 V, 50/60 Hz in NO SIGNAL mode should be 200~800 mA (GS).

Speaker Unit (SB-ZT1)
(C5700, C5701, C5703, C5704) through a 10

Ω, 1W resistor to ground.

DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices.
After repairs are completed, restore power gradually using a variac, to avoid overcurrent.

• Current consumption at AC 220-240 V, 50 Hz in NO SIGNAL mode should be 100~800 mA (GN).
• Current consumption at AC 110-240 V, 50/60 Hz in NO SIGNAL mode should be 100~800 mA (GS).

The protection circuitry may have operated if either of the following conditions are noticed:

• No sound is heard when the power is turned on.
• Sound stops during a performance.

The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are
"shorted", or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used.
If this occurs, follow the procedure outlines below:

1. Turn off the power.
2. Determine the cause of the problem and correct it.
3. Turn on the power once again after one minute.

Note:
When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again.

There are special components used in this equipment which are important for safety.
These parts are marked by   in the Schematic Diagrams, Exploded View & Replacement Parts List. It is essential that these
critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards. Do not modify the
original design without permission of manufacturer.

6

Safety

Ref. No.

Part No.

Part Name & Description

Remarks

11

RGR0393A-D

REAR PANEL

GS

11

RGR0393A-E

REAR PANEL

GN

30

RKM0613-K

TOP CABINET

A2

K2CJ2DA00010

AC CORD

GN

A2

K2CP2CA00001

AC CORD

GS

A2

K2CQ2CA00007

AC CORD

GS

A2

K2CZ3YY00005

AC CORD

GS

A3

RQT9462-E

O/I BOOK (En)

A9

K2DAYYY00002

AC PLUG ADAPTER

GS

PCB1

RD-DWKX006JM

TX MODULE P.C.B

(RTL)

DZ5501

ERZV10V511CS

ZNR

T5501

ETS25AD1V6AG

MAIN TRANSFORMER

T5551

G4D1A0000117

SWITCHING TRANSFORMER

PC5501

B3PBA0000402

PHOTO COUPLER

F701

K5D202BK0005

FUSE

IP5501

K5H7512A0010

PROTECTOR

P5501

K2AA2B000011

AC INLET

C5501

ECQU2A104MLC

0.1uF

C5502

ECQU2A104MLC

0.1uF

C5509

F1BAF1020020

1000pF

Safety

Ref. No.

Part No.

Part Name & Description

Remarks

100

REX1346-1

BLACK WIRE  (SMPS-AC)

101

REX1356-1

RED WIRE (SMPS-AC)

113

RGN2979C-K

SPEC SHEET

GS

113

RGN2979D-K

SPEC SHEET

GN

114

RGN2980C-K

CAUTION LABEL

GS

114

RGN2980D-K

CAUTION LABEL

GN

PCB1

REP4527D-P

SMPS P.C.B

(RTL)

PCB2

RD-DWKX009JM

RX MODULE P.C.B

(RTL)

PCB6

REP4527D-P

AC INLET P.C.B

(RTL)

DZ5701

ERZV10V511CS

ZNR

L5702

ELF19H010A

LINE FILTER

T5701

ETS28BH166AC

MAIN TRANSFORMER

T5751

ETS19AB2C6AG

SUB TRANSFORMER

PC5701

B3PBA0000402

PHOTO COUPLER

PC5720

B3PBA0000402

PHOTO COUPLER

PC5799

B3QAZ0000062

PHOTO COUPLER

F1

K5D202BNA005

FUSE

TH5702

D4CAA5R10001

THERMISTOR

P5701

K2AA2B000011

AC INLET

C5700

F1BAF2220023

2200pF

C5701

ECQU2A104MLC

0.1uF

C5703

ECQU2A224MLC

0.22uF

C5704

F1BAF1020020

1000pF

7

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equiped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equiped with ES devices, place the assembly on a conductive surface such as alumin-

ium foil, to prevent electrostatic charge build up or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder remover device. Some solder removal devices not classified as “anti-static (ESD protected)” can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or compara-
ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.
Caution:

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).

8

The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.

The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86

°F) more than that

of the normal solder.

• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.

(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)

• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the

lead free solder.

• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30 degrees

C (662±86

°F).

• The following 3 types of lead free solder are available through the service parts route.

RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)

* Ingredient: Tin (Sn), 96.5%, Silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%

The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.
(See right figure)