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5

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equiped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equiped with ES devices, place the assembly on a conductive surface such as alumin-

ium foil, to prevent electrostatic charge build up or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder remover device. Some solder removal devices not classified as “anti-static (ESD protected)” can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or compara-
ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.
Caution :

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-

ficient to damage an ES device).

6

The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.

The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86

°F) more than that

of the normal solder.

• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.

(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)

• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the

lead free solder.

• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30 degrees

C (662±86

°F).

• The following 3 types of lead free solder are available through the service parts route.

RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)

* Ingredient: Tin (Sn), 96.5%, Silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%

The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.
(See right figure)

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This service manual contains technical information which will allow service personnel’s to understand and service this model.
Please place orders using the parts list and not the drawing reference numbers.

If the circuit is changed or modified, this information will be followed by supplement service manual to be filled with original service
manual.

• Micro-processor :

1. The following components are supplied as an assembled part.

• Micro-processor IC, IC604 (RFKWMHTB10PA).
• Micro-processor IC, IC2002 (RFKWMHTB10PB).

• Base model :

1. The base for this model is SC-HTB10EB/EGK. You can refer to the original service manual (Order no. PSG1005027CE).

As such this service manual does not contain the following information as below:-

• Location of Controls and Components
• Self diagnostic and special mode setting
• Service Fixture & Tools
• Disassembly and Assembly Instructions
• Service Position
• Voltage Measurement & Waveform Chart
• Illustration of IC’s, Transistors and Diodes
• Overall Simplified Block
• Block Diagram
• Wiring Diagram
• Schematic Diagram Notes
• Schematic Diagram
• Printed Circuit Board
• Terminal Function of IC’s
• Electrical Replacement Parts List

8

Q

30 W

Approx. 0.2 W

AC 220 V to 240 V, 50 Hz

Dimensions (W x H x D):
(Without wall mount bracket)

800 mm x 108 mm x 58 mm

(With wall mount bracket)

800 mm x 108 mm x 80 mm

Mass:
(Without wall mount bracket)

Approx. 3.2 kg

(With wall mount bracket)

Approx. 3.3 kg

0°C to +40°C

20% to 80% RH (no condensation)

Q

RMS Output Power
Front ch:

30 W per channel (4 

Ω), 1 kHz, 10% THD

Subwoofer ch:

30 W per channel (4 

Ω), 100 Hz, 10% THD

Total RMS Dolby Digital mode power:

120W

Q

FRONT SPEAKERS (BUILT-IN)
Type:

1 way 1 speaker system (Bass Reflex)

Full range:

6.5 cm Cone type x 2

SUBWOOFER (BUILT-IN)
Type:

1 way 1 speaker system (Bass Reflex)

Woofer:

8 cm Cone type x 2

Q

This unit supports “HDAVI Control 5” function.

HDMI input
Input Connector:

Type A (19 pin)

HDMI AV output
Output Connector:

Type A (19 pin)

Digital Audio Input
Optical digital input:

Optical terminal

Sampling frequency:

32 kHz, 44.1 kHz, 48 kHz

Audio Format:

LPCM, Dolby Digital

IR Blaster
Terminal 1:

3.5 mm jack

Note:
1. Specifications are subject to change without notice.
2. Total harmonic distortion is measured by the digital spectrum analyzer.