DOWNLOAD Panasonic SC-HTB10EB / SC-HTB10EG Service Manual ↓ Size: 12.43 MB | Pages: 115 in PDF or view online for FREE

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The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.

The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86

°F) more than that

of the normal solder.

• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.

(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)

• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the

lead free solder.

• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30 degrees

C (662±86

°F).

• The following 3 types of lead free solder are available through the service parts route.

RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)

* Ingredient: Tin (Sn), 96.5%, Silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%

The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.
(See right figure)

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This service manual contains technical information which will allow service perssonnel’s to understand and service this model.
Please place orders using the parts list and not the drawing reference numbers.

If the circuit is changed or modified, this information will be followed by supplement service manual to be filed with original service
manual.

• Micro-processor :

1. The following components are supplied as an assembled part.

• Micro-processor IC, IC604 (RFKWMHTB10PA).
• Micro-processor IC, IC2002 (RFKWMHTB10PB).

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Q

30 W

Approx. 0.2 W

AC 220 V to 240 V, 50 Hz

Dimensions (W x H x D):
(Without wall mount bracket)

800 mm x 108 mm x 58 mm

(With wall mount bracket)

800 mm x 108 mm x 80 mm

Mass:
(Without wall mount bracket)

Approx. 3.2 kg

(With wall mount bracket)

Approx. 3.3 kg

0°C to +40°C

20% to 80% RH (no condensation)

Q

RMS Output Power
Front ch:

30 W per channel (4 

Ω), 1 kHz, 10% THD

Subwoofer ch:

30 W per channel (4 

Ω), 100 Hz, 10% THD

Total RMS Dolby Digital mode power:

120W

Q

FRONT SPEAKERS (BUILT-IN)
Type:

1 way 1 speaker system (Bass Reflex)

Full range:

6.5 cm Cone type x 2

SUBWOOFER (BUILT-IN)
Type:

1 way 1 speaker system (Bass Reflex)

Woofer:

8 cm Cone type x 2

Q

This unit supports “HDAVI Control 5” function.

HDMI input
Input Connector:

Type A (19 pin)

HDMI AV output
Output Connector:

Type A (19 pin)

Digital Audio Input
Optical digital input:

Optical terminal

Sampling frequency:

32 kHz, 44.1 kHz, 48 kHz

Audio Format:

LPCM, Dolby Digital

IR Blaster
Terminal 1:

3.5 mm jack

Note:
1. Specifications are subject to change without notice.
2. Total harmonic distortion is measured by the digital spectrum analyzer.

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