DOWNLOAD Panasonic RR-US550PP / RR-US550E Service Manual ↓ Size: 5.75 MB | Pages: 62 in PDF or view online for FREE

Model
RR-US550PP RR-US550E
Pages
62
Size
5.75 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio / IC RECORDER
File
rr-us550pp-rr-us550e.pdf
Date

Panasonic RR-US550PP / RR-US550E Service Manual ▷ View online

4
2 Warning
2.1.
Prevention of Electro Static Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equiped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equiped with ES devices, place the assembly on a conductive surface such as alumin-
ium foil, to prevent electrostatic charge build up or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder remover device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
5
2.2.
Service caution based on Legal restrictions
2.2.1.
General description about Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86
°F) more than that
of the normal solder.
Definition of PCB Lead Free Solder being used
Service caution for repair work using Lead Free Solder (PbF)
• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.
(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)
• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the
lead free solder.
• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30 degrees
C (662±86
°F).
Recommended Lead Free Solder (Service Parts Route.)
• The following 3 types of lead free solder are available through the service parts route.
RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)
Note
* Ingredient: Tin (Sn), 96.5%, Silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%
The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.
(See right figure)
6
3 Service Navigation
3.1.
Service Information
This service manual contains technical information which will allow service personnel’s to understand and service this model.
If the circuit is changed or modified, this information will be followed by supplement service manual to be filled with original service
manual.
3.2.
Service Hint
3.2.1.
Flash NAND ROM IC
Flash NAND ROM IC, IC701 is supplied as service part.
(512MB) - RFKWNUS550E
3.2.2.
USB Serial Number
Serial Number is required to obtain the Firmware Updates.
3.2.3.
Firmware Version
To obtain updated Firmware version and procedures for updating, please refer to item 6.2. 
7
4 Specifications
Power
Batteries
DC 3.0 V (2 AAA LR03 batteries)
Audio
Sampling Frequency 
(Stereo/Monaural) 
XP: 44.1 kHz
LP: 16 kHz
SLP: 8 kHz
Recording Format
MP3
Playable Bit Rate (MUSIC 
folder)
8 kbps to 320 kbps
Playable Sampling 
Frequency (MUSIC folder)
8 kHz to 48 kHz
Frequency Response 
(-10 dB, Rec-Play, 
Monaural)
XP: 180 Hz to 15,100 Hz
LP: 180 Hz to 6,700 Hz
SLP: 180 Hz to 2,900 Hz
Built-in Microphone S/N 
Ratio
40.5 dB (XP) Filter (JIS A)
USB
USB2.0 (Hi-Speed)
Audio Output Earphone
ø 3.5 mm (1/8”), 16 
Ω, Max: 3 mW
Speaker 
output
ø 20 mm (25/32”), 8 
Ω, Max: 330 mW
Audio Input
External 
Microphone
ø 3.5 mm (1/8”),
0.80 mV plug in power
Built-in Memory
512 MB*
1
Operating Temperature
0
°C to 40°C (32°F to 104°F)
Operating Humidity
20% to 80% (non-condensing)
*
1  
MB means one million bytes. Usable capacity will be less.
Battery life (may be less depending on the operating conditions.)
Battery (AAA 
LR03)
Recording mode
Rec*
3
Play*
4
Alkaline 
battery*
2
XP
approx. 32 h.
approx. 35 h.
LP
approx. 42 h.
approx. 35 h.
SLP
approx. 45 h.
approx. 35 h.
*
2  
Using Panasonic Alkaline battery.
*
3  
When zoom microphone is off.
*
4  
When audio is output from speaker (Volume: 13, EQ: off, playback 
speed control: x 1).
Standard recordable time
Recording mode
Time
Bit rate
XP
17 h, 50 min.
64 kbps
LP
35 h, 40 min.
32 kbps
SLP
142 h, 50 min.
8 kbps
Max. Dimensions (WxHxD)
40.4 mm x 110.6 mm x 16.8 mm
(1-19/32” x 4-11/32” x 21/32”)
Cabinet Dimensions 
(WxHxD)
39 mm x 110.3 mm x 15.1 mm
(1-17/32” x 4-11/32” x 19/32”)
Mass (Weight)
Approx. 65 g (2.29 oz.) with battery
Approx. 43 g (1.51 oz.) without battery
Specifications are subject to change without notice.
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Panasonic RR-US550PP / RR-US550E Service Manual ▷ Download

  • DOWNLOAD Panasonic RR-US550PP / RR-US550E Service Manual ↓ Size: 5.75 MB | Pages: 62 in PDF or view online for FREE
  • Here you can View online or download the Service Manual for the Panasonic RR-US550PP / RR-US550E in PDF for free, which will help you to disassemble, recover, fix and repair Panasonic RR-US550PP / RR-US550E Audio. Information contained in Panasonic RR-US550PP / RR-US550E Service Manual (repair manual) includes:
  • Disassembly, troubleshooting, maintenance, adjustment, installation and setup instructions.
  • Schematics, Circuit, Wiring and Block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Exploded View and Parts List.