Panasonic DMR-ES18EE / DMR-ES18GC / DMR-ES18GCS / DMR-ES18GCA Service Manual ▷ View online
2008
Model No.
DMR-ES18EE
DMR-ES18GC
DMR-ES18GCS
DMR-ES18GCA
Vol. 1
Colour
(K).......................Black Type
DVD Recorder
ORDER NO.CHM0808037CE
1 Safety Precaution
3
1.1.
General guidelines
3
2 Warning
4
2.1.
Prevention of Electrostatic Discharge (ESD) to
Electrostatic Sensitive (ES) Devices
4
2.2.
Precaution of Laser Diode
5
2.3.
Service caution based on legal restrictions
6
3 Service Navigation
7
3.1.
Service Information
7
3.2.
Caution for DivX
7
4 Specifications
8
5 Location of Controls and Components
10
6 Operation Instructions
12
6.1.
Taking out the Disc from DVD-Drive Unit when the Disc
cannot be ejected by OPEN/CLOSE button
12
7 Service Mode
16
7.1.
Self-Diagnosis and Special Mode Setting
16
8 Service Fixture & Tools
24
9 Disassembly and Assembly Instructions
25
9.1.
Disassembly Flow Chart
25
9.2.
P.C.B. Positions
26
9.3.
Top Case
27
9.4.
Front Panel
27
9.5.
Front (L) P.C.B., Front (R) P.C.B.
28
9.6.
RAM/Digital P.C.B. Module
28
9.7.
DV P.C.B.
29
9.8.
Rear Panel, Fan Motor
30
9.9.
Power P.C.B.
30
9.10. Main P.C.B., SW P.C.B.
31
10 Measurements and Adjustments
32
10.1. Service Positions
32
10.2. Caution for Replacing Parts
35
10.3. Standard Inspection Specifications after Making Repairs 36
11 Block Diagram
37
11.1. Power Supply Block Diagram
37
11.2. Analog Video Block Diagram
39
11.3. Analog Audio Block Diagram
40
11.4. Analog Timer Block Diagram
41
12 Schematic Diagram
43
12.1. Interconnection Schematic Diagram
43
12.2. Power Supply Schematic Diagram
44
12.3. Main Net (1/4) Section (Main P.C.B. (1/4)) Schematic
Diagram (M)
45
12.4. Main Net (2/4) Section (Main P.C.B. (1/4)) Schematic
Diagram (M)
46
12.5. Main Net (3/4) Section (Main P.C.B. (1/4)) Schematic
Diagram (M)
47
12.6. Main Net (4/4) Section (Main P.C.B. (1/4)) Schematic
Diagram (M)
48
12.7. AV I/O (1/4) Section (Main P.C.B. (2/4)) Schematic
Diagram (AV)
50
12.8. AV I/O (2/4) Section (Main P.C.B. (2/4)) Schematic
Diagram (AV)
51
12.9. AV I/O (3/4) Section (Main P.C.B. (2/4)) Schematic
Diagram (AV)
52
12.10. AV I/O (4/4) Section (Main P.C.B. (2/4)) Schematic
Diagram (AV)
53
12.11. Tuner Section (Main P.C.B. (3/4)) Schematic Diagram
(TU)
55
12.12. Timer (1/4) Section (Main P.C.B. (4/4)) Schematic
Diagram (T)
57
12.13. Timer (2/4) Section (Main P.C.B. (4/4)) Schematic
Diagram (T)
58
12.14. Timer (3/4) Section (Main P.C.B. (4/4)) Schematic
Diagram (T)
59
12.15. Timer (4/4) Section (Main P.C.B. (4/4)) Schematic
Diagram (T)
60
12.16. DV Schematic Diagram
61
12.17. SW Schematic Diagram
61
12.18. Front (L) Schematic Diagram
61
12.19. Front (R) Schematic Diagram
61
13 Printed Circuit Board
63
13.1. Power P.C.B.
63
13.2. Main P.C.B.
64
13.3. Front (L) P.C.B., Front (R) P.C.B., SW P.C.B. and DV
P.C.B.
69
14 Appendix for Schematic Diagram
71
14.1. Voltage and Waveform Chart
71
15 Parts and Exploded Views
77
15.1. Exploded Views
77
15.2. Replacement Parts List
79
CONTENTS
Page
Page
2
DMR-ES18EE / DMR-ES18GC / DMR-ES18GCS / DMR-ES18GCA
1.1.1. Leakage current cold check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1M
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1M
W and 5.2MW.
When the exposed metal does not have a return path to the
chassis, the reading must be
chassis, the reading must be
.
1.1.2. Leakage current hot check
(See Figure 1 .)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5k
W, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
.
and a good earth ground such as a water pipe, as shown in
.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliampere. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliampere. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
Figure 1
1 Safety Precaution
1.1. General guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
3
DMR-ES18EE / DMR-ES18GC / DMR-ES18GCS / DMR-ES18GCA
2 Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive
(ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
Electrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient
to damage an ES device).
to damage an ES device).
4
DMR-ES18EE / DMR-ES18GC / DMR-ES18GCS / DMR-ES18GCA