LG RZ-26LZ55H (CHASSIS:ML-041E) Service Manual ▷ View online
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5.
5.
Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
- 6 -
1. Application range
This specification is applied to ML-041E chassis.
2. Requirement for Test
Testing for standard of each part must be followed in below
condition.
condition.
(1) Temperature: 25°C ± 5°C
(2) Humidity: 65% ± 10%
(3) Power: Standard input voltage (AC 100-240V, 50/60Hz)
(4) Measurement must be performed after heat-run more than
(2) Humidity: 65% ± 10%
(3) Power: Standard input voltage (AC 100-240V, 50/60Hz)
(4) Measurement must be performed after heat-run more than
15min.
(5) Adjusting standard for this chassis is followed a special
standard.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
3. General Specification(TV)
No
Item
Specification
Remark
1.
Video input applicable system
PAL-D/K, B/G, I, NTSC-M, SECAM
NTSC 4.43
2.
Receivable
1) PAL/SECAM BG
(RZ)
Broadcasting System
2) PAL/SECAM DK
EU
3) PAL I/I
(PAL Market)
4) SECAM L/L'
5) NTSC M
6) PAL-N/M
6),7) South America Market
7) NTSC M
7) Except South America NTSC Market (RM)
3.
RF Input Channel
VHF : E2 ~ E12
UHF : E21 ~ E69
PAL
CATV : S1 ~ S20
HYPER : S21~ S41
L/L' : B, C, D
FRANCE
VHF : 2~13
UHF : 14~69
NTSC
CATV : 1~125
VHF Low : 1 ~ M10
JAPAN
VHF High : 4~S22
UHF : S23~62
4.
Input Voltage
AC 100 ~ 240 V/50Hz, 60Hz
5.
Picture Size
660.40 mm
26 inch
6.
Tuning System
FVS 100 program
PAL,200 PR.(Option)
FS
NTSC
7.
Operating Environment
1) Temp : 0 ~ 40 deg
2) Humidity : 85 %
8.
Storage Environment
3) Temp : -20 ~ 60 deg
4) Humidity : 85 %
9.
Display
LCD Module
LPL
- 7 -
4.General Specification(Monitor)
No
Item
Specification
Unit
Remark
1
Panel
26" TFT WXGA LCD
2
Frequency range
H : 31 ~ 61Khz
DVI-I Input
V : 56 ~ 75Hz
3
Control Function
1) Contrast/Brightness
2) H-Position / V-Position
3) Tracking : Clock / Phase
4) Auto Configure
5) Reset
4
Component Jack
1 : Y
2 : Pb
3 : Pr
5
H/V-Sync Video Power consumption
LED
Power ON
ON/ON Active
≤
max 170W
W
Green
Stand by
OFF/ON OFF
≤
6.0W
W
Red
DPMS Mode
ON/OFF OFF
≤
typ. 30W
W
Green
Power off
- - -
W
*
6
LCD Module
Type Size LPL 622.0 x 389.0 x 53
mm
(H) x (V) x (D)
Pixel Pitch LPL 0.4425 x 0.1475 x RGB
Pixel Format 1280horiz. By 768 vert. Pixels
RGB strip arrangement
Coating Hard coating(3H), Anti-glare
treatment of the front polarizer,
Back Light LPL 14CCFL
5. Optical Feature(LCD Module)
No
Item
Specification
Remark
LPL
1
Viewing Angle
R/L, U/D
178,178
<CR
≥
10>
2
Luminance
Luminance (cd/m2)
450
Typical
Variation
1.3
MAX / MIN
3
Contrast Ratio
Min 350
All white / All black
Typ 500
4
CIE Color Coordinates
White Wx Typ.
0.283
LPL
Wy Typ.
0.298
RED Xr Typ.
0.640
Yr Typ.
0.341
Green Xg Typ.
0.287
Yg Typ.
0.600
Blue Xb Typ.
0.146
Yb Typ.
0.069
- 8 -
6. Feature and Function
No
Item
Specification
Remark
1.
Teletext
TOP, FLOF
Top(option)
2.
REMOCON
NEC Code
PAL/ NTSC
3.
AV Output
1
Side
4.
S-AV Input
1
Side
5.
Component input
1
Side RZ(HD)
6.
PERI TV Connector
Half SCART : 1
Rear (RZ)
7.
PERI TV Connector
Full SCART : 1
Rear (RZ)
8.
RGB Input
1
DVI
9.
RJ-12
1
6 Pin , SI-Box interface
10.
Discrete IR
1
(RZ)
11.
D-Sub Audio Input
1
Stereo
12.
2 Carrier Stereo
BG, DK
13.
NICAM Stereo
BG, I, LL'
14.
2 Carrier Dual
BG, DK
15.
NICAM Dual
BG, I, LL'
16.
DW(Double Window) Mode
X
17.
MW(Multi Window) Mode
X
18.
Film Mode
0
19.
Noise Reduction
X
20.
Progressive Scan
0
21.
Motion Detection
0
22.
SRS WOW
X
23.
Swivel Speaker
X
24.
Ez-pip
X
25.
Local key
Pr+/-, vol+/-, ok, menu,tv/av, power
26.
Front LED Index
4 Digit Clock/Alarm/Message
For Commercial in Hotel
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