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C

2008

- 5 -

IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.

Removal
1.  Desolder and straighten each IC lead in one operation by gently

prying up on the lead with the soldering iron tip as the solder
melts.

2.  Draw away the melted solder with an anti-static suction-type

solder removal device (or with solder braid) before removing the
IC.

Replacement
1.  Carefully insert the replacement IC in the circuit board.
2.  Carefully bend each IC lead against the circuit foil pad and

solder it.

3.  Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement
1.  Remove the defective transistor by clipping its leads as close as

possible to the component body.

2.  Bend into a "U" shape the end of each of three leads remaining

on the circuit board.

3.  Bend into a "U" shape the replacement transistor leads.
4.  Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.

Power Output, Transistor Device
Removal/Replacement
1.  Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3.  Carefully remove the transistor from the heat sink of the circuit

board.

4.  Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6.  Replace heat sink.

Diode Removal/Replacement
1.  Remove defective diode by clipping its leads as close as

possible to diode body.

2.  Bend the two remaining leads perpendicular y to the circuit

board.

3.  Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.

4.  Securely crimp each connection and solder it.
5.

Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.

Fuse and Conventional Resistor
Removal/Replacement
1.  Clip each fuse or resistor lead at top of the circuit board hollow

stake.

2.  Securely crimp the leads of replacement component around

notch at stake top.

3.  Solder the connections.

CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.

At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).

1.  Carefully remove the damaged copper pattern with a sharp

knife. (Remove only as much copper as absolutely necessary).

2.  carefully scratch away the solder resist and acrylic coating (if

used) from the end of the remaining copper pattern.

3.  Bend a small "U" in one end of a small gauge jumper wire and

carefully crimp it around the IC pin. Solder the IC connection.

4.  Route the jumper wire along the path of the out-away copper

pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.

At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.

1.  Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.

2.  Trace along the copper pattern from both sides of the pattern

break and locate the nearest component that is directly
connected to the affected copper pattern.

3.  Connect insulated 20-gauge jumper wire from the lead of the

nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

C

2008

- 6 -

NOTE : Specifications and others are subject to change without notice for improvement.

No

Item

Specification

Measurement

Result

Remark

1. 

Display Screen Device

42" wide Color Display Module

Resolution:1920x1080(FHD+100Hz)

47" wide Color Display Module

Resolution:1920x1080(FHD+100Hz)

52" wide Color Display Module

Resolution:1920x1080(FHD+100Hz)

2. Aspect 

Ratio

16:9

3. 

LCD Module

42" TFT WUXGA LCD

42" FHD MAKER : LPL

47" TFT WUXGA LCD

47" FHD MAKER : LPL

52" TFT WUXGA LCD

52" FHD MAKER : SHARP

4. 

Operating Environment

1) Temp.   : 0 ~ 40 deg

LGE SPEC

2) Humidity : 0 ~ 85%

5. 

Storage Environment

1) Temp.   : -20 ~ 60 deg

2) Humidity : 0 ~ 85 %

6. 

Input Voltage

AC100 ~ 240V, 50/60Hz

7.

Power Consumption

Power on (Blue) : LG50

≤

260W

42"

FHD

≤

320W

47"

FHD

≤

360W

52" FHD

St-By (Red)  

≤

1.0 W  (All)

8

LCD Module

Maker

Inch

(H)x(V)x(D)

unit

Remark

(Maker : LPL, SHARP)

LPL

Outline Dimension

42"

983 x 576 x 51

mm

[w/o inverter]/(with inverter)

Pixel Pitch

0.4845 x 0.4845

mm

Back Light

mm

Outline Dimension

47"

1096 x 640 x 51

mm

[w/o inverter]/(with inverter)

Pixel Pitch

0.5415 x 0.5415

mm

Back Light

mm

SHARP

Outline Dimension

52"

1152 x 648

mm

(W) x (H) x (D)

Pixel Pitch

0.600 x 0.600

mm

(H) x (V)

Back Light

-

Display Colors

16.7M (16,777,216)

Coating

3H,AG

This spec sheet is applied to the 42”/47"/52" LCD TV used
LP81D chassis.  

Each part is tested as below without special appointment  

2.1 Temperature :  25±5°C(77±9°F), CST : 40±5°C
2.2 Relative Humidity : 65±10% 
2.3 Power Voltage :  Standard input voltage 

(100~240V@ 50/60Hz)  
• Standard Voltage of each products is marked by models 

2.4 Specification and performance of each parts are followed

each drawing and specification by part number in
accordance with BOM .  

2.5 The receiver must be operated for about 20 minutes prior

to the adjustment.

3.1 Performance : LGE TV test method followed.
3.2 Demanded other specification 

Safety : CE, IEC specification

3.3 EMC : CE, IEC

C

2008

- 7 -

No

Item

Min

Typ

Max

Unit

Maker

Remark

1

Luminance

400

500

cd/m

2

LPL

FHD

(W/O PC mode)

360

450

SHARP 52" FHD

2

View angle(R/L, U/D)

178/178

CR>10

3

Color Coordinate

White

X

Typ.

0.279

Typ.

LPL

42LC470WUD-SAA1

Y

-0.03

0.292

+0.03

Red

X

0.640

Y

0.335

Green

X

0.289

Y

0.610

Blue

X

0.144

Y

0.066

White

X

Typ.

0.279

Typ.

LPL

47LC470WUD-SAA1

Y

-0.03

0.292

+0.03

Red

X

0.638

Y

0.335

Green

X

0.289

Y

0.609

Blue

X

0.145

Y

0.063

White

X

Typ.

0.272

Typ.

SHARP

LK520D3LZ9x

Y

-0.03

0.277

+0.03

Red

X

0.640

Y

0.330

Green

X

0.280

Y

0.600

Blue

X

0.150

Y

0.060

4

Luminance Variation

1.3

LPL

1.25

SHARP

- 8 -

C

2008

6.1. General feature

- Measurement Condition: Full white/ Vivid => Measure the black luminance after 30 seconds.

No

Parameter

Symbol

Value

Unit

Remark

Min

Typ

1 

42 inch

Contrast Ratio

Dynamic CR

40000:1

50000:1

Except PC Mode

(FHD&120Hz)

CR

500:1

800:1

PC Mode

LPL

Surface Luminance,  LWH(AV/Component/HDMI)

360

450

Cd/m

2

white

LWH(PC)

250

Cd/m

2

2

47 inch

Contrast Ratio

Dynamic CR

40000:1

50000:1

Except PC Mode

(FHD&120Hz)

CR

500:1

800:1

PC Mode

LPL

Surface Luminance,  LWH(AV/Component/HDMI)

360

450

Cd/m

2

white

LWH(PC)

250

Cd/m

2

3

52 inch

Contrast Ratio

Dynamic CR

12000:1

15000:1

Except PC Mode

(FHD&120Hz)

CR

500:1

800:1

PC Mode

SHARP

Surface Luminance,  LWH(AV/Component/HDMI)

320

400

Cd/m

2

white

LWH(PC)

250

Cd/m

2

No.

Specification 

Remark

Resolution H-freq(kHz) 

V-freq(Hz) 

Pixek 

clock

1. 

720*480

15.73

59.94

13.500

SDTV, DVD 480I(525I)

2. 

720*480

15.75

60.00

13.514

SDTV, DVD 480I(525I)

3. 

720*576

15.625

50.00

13.500

SDTV, DVD 576I(625I) 50Hz

4. 720*480

31.47

59.94

27.000

SDTV 

480P

5. 720*480

31.50

60.00

27.027

SDTV 

480P

6. 

720*576

31.25

50.00

27.000

SDTV 576P 50Hz

7. 1280*720

44.96

59.94

74.176

HDTV 

720P

8. 1280*720

45.00

60.00

74.250

HDTV 

720P

9. 

1280*720

37.50

50.00

74.25

HDTV 720P 50Hz

10. 

1920*1080

28.125

50.00

74.250

HDTV 1080I 50Hz, 

11. 1920*1080

33.72

59.94

74.176

HDTV 

1080I

12. 1920*1080

33.75

60.00

74.25

HDTV 

1080I

13. 1920*1080

56.25

50

148.5

HDTV 

1080P

14

1920*1080

67.432

59.94

148.350

HDTV 1080P

15

1920*1080

67.5

60.00

148.5

HDTV 1080P 

No. 

Resolution 

H-freq(kHz) 

V-freq(Hz)  

Pixel clock(MHz)

Proposed   

Remark 

1

720*400

31.469

70.08

28.32

DOS

2

640*480

31.469

59.94

25.17

VESA(VGA)

3

800*600

37.879

60.31

40

VESA(SVGA)

4

1024*768

48.363

60

65

VESA(XGA)

5

1280*768

47.776

59.87

79.5

VESA(WXGA)

6

1360*768

47.72

59.799

84.75

VESA(WXGA)

7

1280*1024

63.668

59.895

109.00

SXGA

8

1920*1080

66.587

59.934

138.50

WUXGA (Reduced Blanking)