LG 52LG50FD-SA (CHASSIS:LJ82B) Service Manual ▷ View online
C
2008
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5.
5.
Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
C
2008
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. General Specification(TV)
1. Application Range.
This spec sheet is applied to the 47"/52" LCD TV used LJ81A,
LJ82A/B chassis.
LJ82A/B chassis.
2. Specification
Each part is tested as below without special appointment
2.1 Temperature : 25±5°C(77±9°F), CST : 40±5°C
2.2 Relative Humidity : 65±10%
2.3 Power Voltage : Standard input voltage
2.2 Relative Humidity : 65±10%
2.3 Power Voltage : Standard input voltage
(100~240V@ 50/60Hz)
• Standard Voltage of each products is marked by models
• Standard Voltage of each products is marked by models
2.4 Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM .
accordance with BOM .
2.5 The receiver must be operated for about 20 minutes prior
to the adjustment.
3. Test method
3.1 Performance : LGE TV test method followed.
3.2 Demanded other specification
3.2 Demanded other specification
Safety : CE, IEC specification
EMC : CE, IEC
LC470WU5-SLA1
47LB7DF-SB
LC470WUN-SAB1
47LB7DF-SB
(V3)
9. Operating Environment
1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
10. Storage Environment
1) Temp : -20 ~ 60 deg
2) Humidity : ~ 85 %
No Item
Specification
Remark
1. Receiving System
1) SBTVD / NTSC / PAL-M / PAL-N
2. Available Channel
1) VHF : 02~13
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
3. Input Voltage
1) AC 100 ~ 240V 50/60Hz
4. Market
Central and South AMERICA
47 inch Wide (1366 ◊ 768)
47LG50D-SA
52 inch Wide (1920 ◊ 1080)
52LG50FD-SA
5. Screen Size
47 inch Wide (1920 ◊ 1080)
47LB7DF-SB
6. Aspect Ratio
16:9
7. Tuning System
FS
8. Module
LK520D3LZ1x
52LG50FD-SA
C
2008
- 7 -
5. Chrominance & Luminance Specification
5-1. 47LB7DF-SB
Warm
28. Color Distortion, DG
10.0
%
29. Color Distortion, DP
10.0
deg
30. Color S/N, AM/FM
43.0
dB
31. Color Killer Sensitivity
-80
dBm
No Item
Min
Typ
Max
Unit
Remark
16. White peak brightness
(Center 1-point / Full White Pattern)
400
500
cd/m
LC470WU5-SLA2
17. Brightness uniformity
80
%
Full white
18. 0.638
19.
19.
RED X
Y
Y
Y
X
X
X
0.340
20. 0.279
21.
21.
GREEN
0.611
22. 0.146
23.
23.
BLUE
0.062
24.
0.272
25.
Color
coo
coo
r
dinate
WHITE
Y
Typ.
-0.03
0.292
Typ.
+0.03
26. Color coordinate uniformity
N/A
700:1 900:1
NORMAL
Contrast ratio
7000:1 9000:1
DCR
Cool
11000
27. Color
Temperature
Standard
Typ.
-1000
9300
6500
6500
Typ.
+1000
<Test Condition>
HDMI Input
HDMI Input
Warm
28. Color Distortion, DG
10.0
%
29. Color Distortion, DP
10.0
deg
30. Color S/N, AM/FM
43.0
dB
31. Color Killer Sensitivity
-80
dBm
No Item
Min
Typ
Max
Unit
Remark
16. White peak brightness
(Center 1-point / Full White Pattern)
400
500
cd/m
LC470WUN-SAB1
(Vitiaz3)
(Vitiaz3)
Fresh Contrast/
Color-OFF
Color-OFF
17. Brightness uniformity
80
%
Full white
18. 0.638
19.
19.
RED X
Y
Y
Y
X
X
X
0.335
20. 0.289
21.
21.
GREEN
0.609
22. 0.145
23.
23.
BLUE
0.063
24.
0.279
25.
Color
coo
coo
r
dinate
WHITE
Y
Typ.
-0.03
0.292
Typ.
+0.03
26. Color coordinate uniformity
N/A
900:1 1300:1
NORMAL
Contrast ratio
8000:1 15000:1
DCR
Cool
11000
27. Color
Temperature
Standard
Typ.
-1000
9300
6500
6500
Typ.
+1000
<Test Condition>
HDMI Input
HDMI Input
5-2. 47LB7DF-SB(V3)
- 8 -
C
2008
Warm
28. Color Distortion, DG
10.0
%
29. Color Distortion, DP
10.0
deg
30. Color S/N, AM/FM
43.0
dB
31. Color Killer Sensitivity
-80
dBm
No Item
Min
Typ
Max
Unit
Remark
16. White peak brightness
(Center 1-point / Full White Pattern)
400
500
cd/m
LC470WXN-SAA1
Fresh Contrast/
Color-OFF
Color-OFF
17. Brightness uniformity
80
%
Full white
18. 0.634
19.
19.
RED X
Y
Y
Y
X
X
X
0.334
20. 0.291
21.
21.
GREEN
0.611
22. 0.146
23.
23.
BLUE
0.061
24.
0.279
25.
Color
coo
coo
r
dinate
WHITE
Y
Typ.
-0.03
0.292
Typ.
+0.03
26. Color coordinate uniformity
N/A
800:1 1100:1
NORMAL
Contrast ratio
8000:1 12000:1
DCR(Dimming25%)
Cool
11000
27. Color
Temperature
Standard
Typ.
-1000
9300
6500
6500
Typ.
+1000
<Test Condition>
HDMI Input
HDMI Input
5-3. 47LG50D-SA
Warm
28. Color Distortion, DG
10.0
%
29. Color Distortion, DP
10.0
deg
30. Color S/N, AM/FM
43.0
dB
31. Color Killer Sensitivity
-80
dBm
No Item
Min
Typ
Max
Unit
Remark
16. White peak brightness
(Center 1-point / Full White Pattern)
360
450
cd/m
LK520D3LZ1x
17. Brightness uniformity
80
%
Full white
18. 0.640
19.
19.
RED X
Y
Y
Y
X
X
X
0.330
20. 0.280
21.
21.
GREEN
0.600
22. 0.150
23.
23.
BLUE
0.060
24.
0.272
25.
Color
coo
coo
r
dinate
WHITE
Y
Typ.
-0.03
0.277
Typ.
+0.03
26. Color coordinate uniformity
1000:1 1500:1
NORMAL
Contrast ratio
8000:1 10000:1
DCR
Cool
11000
27. Color
Temperature
Standard
Typ.
-1000
9300
6500
6500
Typ.
+1000
<Test Condition>
HDMI Input
HDMI Input
5-4. 52LG50D-SA
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