LG 50LN5310-UB (CHASSIS:LA32B) Service Manual ▷ View online
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
This spec sheet is applied LED TV with LA32Bchassis
2. Test condition
Each part is tested as below without special notice.
1) Temperature : 25 ºC ± 5 ºC(77 ± 9 ºF) , CST : 40 ºC±5 ºC
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
Market
Input voltage
Frequency
Remark
USA
110~240V
50/60Hz
Standard Voltage of each
product is marked by
models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM
5) The receiver must be operated for about 20 minutes prior to
the adjustment
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : UL, CSA, IEC specification
- EMC: FCC, ICES, IEC specification
4. General Specification
No
Item
Specification
Result
Remark
1.
Receiving System
1) ATSC / NTSC-M / 64 QAM / 256 QAM
2.
Available Channel
1) VHF : 02~13
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
5) CADTV : 01~135
3.
Input Voltage
AC 100 ~ 240V 50/60Hz
Mark : 110V, 60Hz (N.America)
4.
Market
NORTH AMERICA
5.
Screen Size
42/47/50/55inch Wide (1920 × 1080)
FHD + T120Hz 55LN5310-UB
50LN5310-UB
47LN5310-UB
6.
Aspect Ratio
16:9
7.
Tuning System
FS
8
Module
POLA
LC550DUK-SEE1
LGD
55LN5310-UB
Direct
LC500DUE-SFR2
LGD
50LN5310-UB
Direct
LC470DUE-SFR1
LGD
47LN5310-UB
9
Operating Environment
1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
10
Storage Environment
1) Temp : -20 ~ 60 deg
2) Humidity : ~ 85 %
- 7 -
5. Supported video resolutions
5.1. Component input(Y, CB/PB, CR/PR)
No
Resolution
H-freq(kHz)
V-freq.(kHz)
Pixel clock
Proposed
1.
720*480
15.73
60.00
13.5135
SDTV ,DVD 480I
2.
720*480
15.73
59.94
13.50
SDTV ,DVD 480I
3.
720*480
31.50
60.00
27.027
SDTV 480P
4.
720*480
31.47
59.94
27.00
SDTV 480P
5.
1280*720
45.00
60.00
74.25
HDTV 720P
6.
1280*720
44.96
59.94
74.176
HDTV 720P
7.
1920*1080
33.75
60.00
74.25
HDTV 1080I
8.
1920*1080
33.72
59.94
74.176
HDTV 1080I
9.
1920*1080
67.50
60.00
148.50
HDTV 1080P
10.
1920*1080
67.432
59.94
148.352
HDTV 1080P
11.
1920*1080
27.00
24.00
74.25
HDTV 1080P
12.
1920*1080
26.97
23.94
74.176
HDTV 1080P
13.
1920*1080
33.75
30.00
74.25
HDTV 1080P
14.
1920*1080
33.71
29.97
74.176
HDTV 1080P
5.2. HDMI Input (DTV)
No
Resolution
H-freq(kHz)
V-freq.(kHz)
Pixel clock
Proposed
DTV
1.
720*480
31.47
60.00
27.027
SDTV 480P
2.
720*480
31.47
59.94
27.00
SDTV 480P
3.
1280*720
45.00
60.00
74.25
HDTV 720P
4.
1280*720
44.96
59.94
74.176
HDTV 720P
5.
1920*1080
33.75
60.00
74.25
HDTV 1080I
6.
1920*1080
33.72
59.94
74.176
HDTV 1080I
7.
1920*1080
67.50
60.00
148.50
HDTV 1080P
8.
1920*1080
67.432
59.94
148.352
HDTV 1080P
9.
1920*1080
27.00
24.00
74.25
HDTV 1080P
10.
1920*1080
26.97
23.976
74.176
HDTV 1080P
11.
1920*1080
33.75
30.00
74.25
HDTV 1080P
12.
1920*1080
33.71
29.97
74.176
HDTV 1080P
- 8 -
ADJUSTMENT INSTRUCTION
1. Application
This spec. sheet applies to LA32B Chassis applied LED TV all
models manufactured in TV factory
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5 ºC of temperature and 65±10% of relative humidity if
there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) At first Worker must turn on the SET by using Power Only
key.
(6) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15 ºC
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
※
Caution
When still image is displayed for a period of 20 minutes or
longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch), there
can some afterimage in the black level area
3. Adjustment items
3.1. Main PCBA Adjustments
(1) ADC adjustment : ADC adjustment is OTP (Auto ADC)
(2) EDID download : HDMI
■ Above adjustment items can be also performed in Final
Assembly if needed.
Both Board-level and Final assembly adjustment items can
be check using In-Start Menu (1.Adjust Check).
3.2. Final assembly adjustment
(1) White Balance adjustment
(2) RS-232C functionality check
(3) Factory Option setting per destination
(4) Shipment mode setting (In-Stop)
(5) GND and HI-POT test
3.3. Appendix
(1) Shipment conditions
(2) Tool option menu
(3) USB Download (S/W Update, Option and Service only)
(4) Preset CH Information
4. MAIN PCBA Adjustments
* Download
(1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
(2) Set as below, and then click “Auto Detect” and check “OK”
message
If display “Error”, Check connect computer, jig, and set.
(3) Click “Connect” tab. If display “Can’t ”, Check connect
computer, jig, and set.
(4) Click “Read” tab, and then load download file(XXXX.bin) by
clicking “Read”
(5) Click “Auto” tab and set as below.
(6) Click “Run”.
(7) After downloading, check “OK” message.
(1)
(2)
OK
(3)
Please Check the Speed :
To use speed between from 200KHz to 400KHz
(4)
filexxx.bin
(5)
(6)
(7) ……….OK
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