LG 47LM960V / 47LM960W (CHASSIS:LD23E) Service Manual ▷ View online
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
This specification is applied to the LCD TV used LD23E
chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC
- Wireless : Wireless HD Specification (Option)
4. Model General Specification
No.
Item
Specification
Remarks
1
Market
EU(PAL Market-36Countries)
DTV & Analog (Total 37 countries)
DTV(MPEG2/4,DVB-T/T2/S)
Albania/Austria/Belarus/Belgium/Bosnia/Bulgaria/Croatia/
Czech/Estonia/France/Germany/Greece/Hungary/Ireland/
Italy/Kazakhstan/Latvia/Lithuania/Luxembourg/Morocco/
Netherlands/Poland/Portugal/Romania/Russia/Serbia/Slov-
enia/Spain/Slovakia/Switzerland/Turkey/UK/Ukraine/Den-
mark/Finland/Norway/Sweden
Supported satellite : 29 satellites
ABS1 75.0E/ AMOS 4.0W/ ASIASATS 105.5E/ ASTRA1L-
HMKR 19.2E/ ASTRA2ABD 28.2E/ ASTRA3AB 23.5E/
ASTRA4A 4.8E/ ATLANTICBIRD2 8.0W/ ATLANTICBIRD3
5.0W/ BADR 26.0E/ EUROBIRD3 33.0E/ EUROBIRD9A
9.0E/ EUTELSATW2A 10.E/ EUTELSATW3A 7.0E/ EUTEL-
SATW4W7 36.0E/ EUTELSESAT 16.0E/ EXPRESSAM1
40.0E/ EXPRESAM3 140.0E/ EXPRESSAM33 96.5E/ HEL-
LASAT2 39.0E/ HISPASAT1CDE 30.0W/ HOTBIRD 13.0E/
INTELSAT10&7 68.5E/ INTELSAT15 85.2E/ INTELSAT904
60.0E/ NILESAT 7.0W/ THOR 0.8W/ TURKSAT 42.0E/
YAMAL201 90.0E
2
Broadcasting system
1) PAL-BG
2) PAL-DK
3) PAL-I/I’
4) SECAM L/L’, DK, BG, I
5) DVB-T
6) DVB-C
7) DVB-T2
8) DVB-S
9) DVB-S2
DVB-S: Satellite
- 7 -
No.
Item
Specification
Remarks
3
Receiving system
Analog : Upper Heterodyne
Digital : COFDM, QAM
► DVB-T
- Guard Interval(Bitrate_Mbit/s)
1/4, 1/8, 1/16, 1/32
- Modulation : Code Rate
QPSK : 1/2, 2/3, 3/4, 5/6, 7/8
16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
► DVB-T2
- Guard Interval(Bitrate_Mbit/s)
1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,
- Modulation : Code Rate
QPSK : 1/2, 2/5, 2/3, 3/4, 5/6
16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
► DVB-C
- Symbolrate :
4.0Msymbols/s to 7.2Msymbols/s
- Modulation :
16QAM, 64-QAM, 128-QAM and 256-QAM
► DVB-S/S2
- symbolrate
DVB-S2 (8PSK / QPSK) : 2 ~ 45Msymbol/s
DVB-S (QPSK) : 2 ~ 45Msymbol/s
- viterbi
DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8
DVB-S2 mode : 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10
4
Input Voltage
AC 100 ~ 240V 50/60Hz
5
Screen Size
46.96 inches
1046.68(H) x 594.02(V) x 1.5(D)mm (Typ.)
FHD+240Hz
6
Aspect Ratio
16:9
7
Tuning System
8
Operating Environment
1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
9
Storage Environment
1) Temp : -20 ~ 60 deg
2) Humidity : ~ 85 %
- 8 -
5. Component Video Input (Y, C
b
/P
b
, C
r
/P
r
)
6. RGB input (PC)
No.
Resolution
H-freq(kHz)
V-freq(Hz)
Pixel clock
1.
720×480
15.73
60.00
SDTV, DVD 480i
2.
720×480
15.63
59.94
SDTV, DVD 480i
3.
720×480
31.47
59.94
480p
4.
720×480
31.50
60.00
480p
5.
720×576
15.625
50.00
SDTV 576i
6.
720×576
31.25
50.00
SDTV 576p
7.
1280×720
45.00
50.00
HDTV 720p
8.
1280×720
44.96
59.94
HDTV 720p
9.
1280×720
45.00
60.00
HDTV 720p
10.
1920×1080
31.25
50.00
HDTV 1080i
11.
1920×1080
33.75
60.00
HDTV 1080i
12.
1920×1080
33.72
59.94
HDTV 1080i
13.
1920×1080
56.250
50
HDTV 1080p
14.
1920×1080
67.5
60
HDTV 1080p
No.
Resolution
H-freq(kHz)
V-freq.(Hz)
Pixel clock(MHz)
Proposed
PC
DDC
1
640*350
31.468
70.09
25.17
EGA
Х
2
720*400
31.469
70.08
28.32
DOS
O
3
640*480
31.469
59.94
25.17
VESA(VGA)
O
4
800*600
37.879
60.31
40.00
VESA(SVGA)
O
5
1024*768
48.363
60.00
65.00
VESA(XGA)
O
6
1152*864
54.348
60.053
80
VESA (WXGA)
Х
7
1360*768
47.712
60.015
85.5
WUXGA
O
8
1920*1080
67.5
60.00
148.5
WUXGA(CEA861D)
O
Click on the first or last page to see other 47LM960V / 47LM960W (CHASSIS:LD23E) service manuals if exist.