LG 47LM6700 (CHASSIS:LA22E) Service Manual ▷ View online
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EPI Interface (mini-LVDS vs. EPI)
Comparison
HF mini-LVDS
What to change
EPI (Embedded clock P-to-P Interface)
-Difficult to upgrade bandwidth limit
-Multiple number of wires needed for higher bandwidth
-Multiple number of wires needed for higher bandwidth
HF mini-
LVDS
FHD (10bit)
60Hz
120Hz
240Hz
No. of Signal
36
36
72
Connector
60pin
(2ea)
60pin
(2ea)
80pin
(2ea)
-Better reliability on common noise
-No data skew. Better EMI margin
-Lower cost ( Cable, Connector )
-No data skew. Better EMI margin
-Lower cost ( Cable, Connector )
-Slim S-PCB design (14mm
Æ 10mm) helps slimmer TV
EPI
FHD (10bit)
60Hz
120Hz
240Hz
960ch
960ch
720ch
No. of Signal
12
12
32
Connector
-
50 pin
(2ea)
70pin
(2ea)
LCM (T-con to S-Driver IC)
TCON
2
LOCK
VCC
1
TCON
18
VCC
1
18
HF mini-LVDS
EPI
* Bandwidth Capability
- FHD 120Hz 10Bit : 594Mbps@36Lines → 1.65Gbps@12Lines
- FHD 240Hz 10Bit : 594Mbps@72Lines → 1.25Gbps@32Lines
- FHD 240Hz 10Bit : 594Mbps@72Lines → 1.25Gbps@32Lines
(FHD 120Hz)
(FHD 120Hz)
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HF mini-LVDS
EPI
Topology
Protocol
Features
@10bit, FHD120
• Multi Drop
• Data rate: 660Mbps
• External clock
• Data rate: 660Mbps
• External clock
• Point to Point
• Data rate : 1.8Gbps
• Embedded clock, Control
• Data rate : 1.8Gbps
• Embedded clock, Control
Merit
• Simple structure
• Standardization
• Standardization
• Fewer Lines : 12
• Embedded clock
• Embedded clock
: low EMI, Clock skew free
• Easy to PCB design
Demerit
• Too many lines : 36
• Clock skew
• EMI due to clock lines
• Bandwidth limit
• Clock skew
• EMI due to clock lines
• Bandwidth limit
• Transmission Overhead
: 4bit delimiter
TCON
Lock
2
1
TCON
EPI Interface (mini-LVDS vs. EPI)
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◈ CONTENT ◈
1. ‘2011 Product line-up and features
2. Model naming and tool option
3. New features
4. Main PCBs
5. Block Diagrams, IIC Map
6. Structure of TV set and connection of sub ass’ys
7. New sub ass’ys
- Instruction of new sub ass’ys
- How to use tool
- Download
8. Adjust way of new features
9. Repair guide
10. The latest issue and concerning issue
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Main PCB for Broadband
To PSU
1
2
3
1
Main processor, DDR Memory
eMMC Memory
2
3
4
Micom for Key/IR sensing
Audio AMP (10W+10W)
LVDS &EPI Wafer
xxLS5700-UA
Soft touch +IR
Front Spk
To module
4
All model
1
Only for Dev
1
2
Chassis : LA22E
PCB P/No : EAX64434205
PCB P/No : EAX64434205
WIFI
RF Assy
2
2
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