LG 47LG5000 (CHASSIS:LD84D) Service Manual ▷ View online
C
2008
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5.
5.
Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
C
2008
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. General Specification
No
Item
Specification
Remark
1
Display Screen Device
37/42/47/52" wide Color Display Module
LCD
2
Aspect Ratio
16:9
3
LCD Module
37" TFT LCD FHD
MAKER : 37"- LPL
42" TFT LCD FHD
42"- AUO
47" TFT LCD FHD
47"- CMO
52" TFT LCD FHD
52"- SHARP
4
Operating Environment
Temp. : 0 ~ 40 deg
Humidity : 0 ~ 85%
LGE SPEC
5
Storage Environment
Temp. : -20 ~ 60 deg
Humidity : 0 ~ 85 %
6
Input Voltage
AC100 ~ 240V, 50/60Hz
7
Power Consumption
Power on (Green)
37"
≤
132W ( 7.86 + 125 W)
LG5000
42"
≤
197W (13.2 + 184 W)
LCD + Backlight
47"
≤
242W (26.4 + 216.1 W)
52"
≤
335W (20.16 + 315 W)
8
Type Size
37"
877(H) x 516.8(V) x 55.5(D)
LG5000
42"
983.0(H) x 576.0(V) x 52.7(D)
With inverter
47"
1096.0(H) x 640.0(V) x 51.0(D)
52"
1219.0(H) x 706.7(V) x 64.6(D)
9
Pixel Pitch
37"
0.42675(H) x 0.42675(V)
LG5000
42"
0.4845
47"
0.5415 (H) x 0.1805(V)
52"
0.600(H) x 0.600(V)
10
Back Light
37"
TBD(EEFL), Straight type
LG5000
42"
18pcs, Straight type
47"
20CCFL, Straight type
52"
24CCFTs, direct type
11
Display Colors
16.7M (16,777,216)
12
Coating
3H, AG
1. Application Range.
This spec sheet is applied to the 37"/42"/47"/52" LCD TV used
LA84A chassis.
LA84A chassis.
2. Specification
Each part is tested as below without special appointment
2.1 Temperature : 25±5°C(77±9°F), CST : 40±5°C
2.2 Relative Humidity : 65±10%
2.3 Power Voltage : Standard input voltage
2.2 Relative Humidity : 65±10%
2.3 Power Voltage : Standard input voltage
(100~240V@ 50/60Hz)
• Standard Voltage of each products is marked by models
• Standard Voltage of each products is marked by models
2.4 Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM .
accordance with BOM .
2.5 The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
3.1 Performance : LGE TV test method followed.
3.2 Demanded other specification
3.2 Demanded other specification
Safety : CE, IEC specification
EMC : CE, IEC
EMC : CE, IEC
5. MODEL General Specification
- 7 -
C
2008
No
Item
Specification
Remarks
1
Broadcasting system
1) PAL-BG
2) PAL-DK
3) PAL-I/I’
4) SECAM L/L’
5) DVB-T (ID TV)
2
Receiving system
Analog : Upper Heterodyne
Digital : COFDM
3
Scart Jack (2EA)
PAL, SECAM
Scart 1 Jack is Full scart and support
RF-OUT(analog)
Scart 2 jack is Half scart and support
MNT/DTV-OUT.
4
Video Input RCA(1EA)
PAL, SECAM, NTSC
4 System :
PAL, SECAM, NTSC, PAL60
5
S-Video Input (1EA)
PAL, SECAM, NTSC
4 System :
PAL, SECAM, NTSC, PAL60
6
Component Input (1EA)
Y/Cb/Cr
Y/Pb/Pr
7
RGB Input
RGB-PC
Analog(D-SUB 15PIN)
8
HDMI Input (3EA)
HDMI1-DTV/DVI
PC(HDMI version 1.3)
HDMI2-DTV
Support HDCP
HDMI3-DTV
9
Audio Input (3EA)
RGB/DVI Audio
L/R Input
Component
AV
10
SDPIF out (1EA)
SPDIF out
11
Earphone out (1EA)
Antenna, AV1, AV2, AV3, Component,
RGB, HDMI1, HDMI2, HDMI3
12
USB (1EA)
For service only
C
2008
- 8 -
6. Chroma & Brightness
6.1 37"LCD Module
1) Standard Test Condition (The unit has been ‘ON’)
2) Stable for approximately 30 minutes in a dark environment at 25±2_
3) The values specified are at approximate distance 50Cm from the LCD surface
4) Ta= 25±2°C, VLCD=12.0V, fV=60Hz, Dclk=148.5MHz VBR_A=1.6V, ExtVBR_B=100%
2) Stable for approximately 30 minutes in a dark environment at 25±2_
3) The values specified are at approximate distance 50Cm from the LCD surface
4) Ta= 25±2°C, VLCD=12.0V, fV=60Hz, Dclk=148.5MHz VBR_A=1.6V, ExtVBR_B=100%
6.2 42"LCD Module
1) Standard Test Condition(The unit has been ‘ON’)
2) Stable for approximately 60 minutes in a dark environment at 25_
3) The values specified are at approximate distance 50Cm from the LCD surface
2) Stable for approximately 60 minutes in a dark environment at 25_
3) The values specified are at approximate distance 50Cm from the LCD surface
No.
Item
Specification
Min.
Typ.
Max.
Remark
1.
Viewing Angle<CR>10>
Right/Left/Up/Down
89
2.
Luminance
Luminance (cd/m2)
400
500
Variation
-
1.3
MAX / MIN
3.
Contrast Ratio
CR
1000
1500
4.
CIE Color Coordinates
White
WX
Typ
0.280
Typ
AUO(42")
WY
-0.03
0.290
+0.03
RED
Xr
0.640
Yr
0.330
Green
Xg
0.290
Yg
0.600
Blue
Xb
0.150
Yb
0.060
No.
Item
Specification
Min.
Typ.
Max.
Remark
1.
Viewing Angle<CR>10>
Right/Left/Up/Down
89
2.
Luminance
Luminance (cd/m2)
400
500
Variation
-
1.3
MAX / MIN
3.
Contrast Ratio
CR
1000
1400
4.
CIE Color Coordinates
White
WX
Typ
0.279
Typ
LPL(37")
WY
-0.03
0.292
+0.03
RED
Xr
0.641
Yr
0.334
Green
Xg
0.291
Yg
0.614
Blue
Xb
0.145
Yb
0.062
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