LG 47LF11 (CHASSIS:LA92G) Service Manual ▷ View online
C
2009
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5.
5.
Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
C
2009
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. General specification
1. Application range
This specification is applied to the LCD TV used LA92G
chassis.
chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC
2) Relative Humidity : 65±10%
3) Power Voltage : Standard input voltage(100~240V@50/60Hz)
2) Relative Humidity : 65±10%
3) Power Voltage : Standard input voltage(100~240V@50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
2) Demanded other specification
- Safety: UL, CSA, IEC specification, CE
- EMC: FCC, ICES, IEC specification, CE
- EMC: FCC, ICES, IEC specification, CE
No
Item Specification
Remark
1
Display Screen Device
47 wide Color Display Module
1920 x1080
2
Aspect Ratio
16:9
3
LCD Module
LC470WUH-SBA1(without inverter )
FHD+Tconless 47LH40-UA
4
Available Channel
1) VHF : 02 ~ 13
2) UHF : 14 ~ 69
3) DTV : 02 ~ 69
4) CATV : 01 ~135
5) CADTV : 01 ~ 135
5
Operating Environment
Temp.:0 ~ 40 deg
Humidity : ~ 80 %
6
Storage Environment
Temp.:-20 ~ 60 deg
Humidity : ~ 85 %
7
Input Voltage
AC100 ~240V,50/60Hz
8
Tuning system
FS
- 7 -
C
2009
5. Chroma& Brightness
5.1 Module optical specification
No.
Item Specification
Min.
Typ.
Max.
Remark
1.
Max Luminance
Modele
400
500
cd/m2
(Center1-point/ Ful white pattern)
2.
Luminance uniformity
Luminance
77
%
3. Contrast Ratio
1000: 1
1400: 1
4000: 1(DCR) 50000:1(DCR)
WX
Typ 0.279
Typ
White
WY
-0.03
0.292
+0.03
4.
Color Coordinates
Xr
636
RED
Yr
334
Xg 290
Green
Yg 608
Xb 145
Blue
Yb
064
5. Color Temperatue
Cool
0.274
0.276
0.278
85% Full white pattern
0.281
0.283
0.285
**The W/B Tolerance is
Medium
0.283
0.285
0.287
± 0.015 for Adjustment
0.291
0.293
0.295
Dynamic contrast :off
Warm
0.311
0.313
0.315
Dynamic color :off
0.327
0.329
0.331
Energy saving mode :off
6.
Color Distortion, DG
10.0
%
7.
Color Distortion,DP
10.0 deg
8.
Color S/N,AM/FM
43.0
dB
9.
Color Killer Sensitivity
-80
dB
* Max Luminance &Contrast measure standard specification
- Max Luminance measure specification
1) In non-impressed condition, measure peak brightness displayable as much as possible LCD module.
2) Measuring instrument: CA-210 or a sort of Color Analyzer.
3) Pattern Generator :VG- 828 or a sort of digital pattern generator (displayable Full White &1/25 White Window pattern)
4) Measure condition
• Test pattern: in center,1/5(H)*1/5(V) of Window Pattern (white pattern in non-impressed condition)
• SET condition: Contrast &Brightness Level 100%
• Environment condition : Dark room in the non outside light
• Video menu option condition
1) In non-impressed condition, measure peak brightness displayable as much as possible LCD module.
2) Measuring instrument: CA-210 or a sort of Color Analyzer.
3) Pattern Generator :VG- 828 or a sort of digital pattern generator (displayable Full White &1/25 White Window pattern)
4) Measure condition
• Test pattern: in center,1/5(H)*1/5(V) of Window Pattern (white pattern in non-impressed condition)
• SET condition: Contrast &Brightness Level 100%
• Environment condition : Dark room in the non outside light
• Video menu option condition
5) Measurement
• Do heat-run LCD module at 30minutes in normal temperature (25°C)by using full white pattern of 15%signal level(38 gray level).
• Impress test pattern signal in 1/5(H)*1/5(V)White Window of 100%(255Gray Level)
• measure 3 times brightness of central white window,and mark peak brightness in max brightness degree
• measure the same condition in video signal /RGB signal.
• Do heat-run LCD module at 30minutes in normal temperature (25°C)by using full white pattern of 15%signal level(38 gray level).
• Impress test pattern signal in 1/5(H)*1/5(V)White Window of 100%(255Gray Level)
• measure 3 times brightness of central white window,and mark peak brightness in max brightness degree
• measure the same condition in video signal /RGB signal.
- Luminance uniformity measure specification
1) Impress 100%(255Gray Level) full white pattern at the same peak brightness measurement.
2) Measure average brightness in 5 points.
1) Impress 100%(255Gray Level) full white pattern at the same peak brightness measurement.
2) Measure average brightness in 5 points.
Signal
Picture Mode
Dynamic Contrast
Dynamic Color
Black Level
RF
NTSC-M
Vivid
High High Low
AV NTSC-J Vivid
High
High High
Component 720P
Vivid
High
High
High
RGB 1024x768
Vivid
NA
NA
NA
HDMI DTV
720P
Vivid
High
High
Low
- Contrast ratio measure specification
1) Test display signal :30*30 dots White Window signal &all Black Raster signal
2) Dark room measure condition: Using touch type Color analyzer CA-210 Dark room in the non outside light
3) Bright room measure condition: In bright room of 150Lx illumination in the panel surface, locate a source of light on the above
1) Test display signal :30*30 dots White Window signal &all Black Raster signal
2) Dark room measure condition: Using touch type Color analyzer CA-210 Dark room in the non outside light
3) Bright room measure condition: In bright room of 150Lx illumination in the panel surface, locate a source of light on the above
45º of the panel surface.
4) Measure method
• In standard test condition,impress 30*30 dots White Window Pattern signal .
• In standard test condition,impress 30*30 dots White Window Pattern signal .
Measure center peak brightness degree Lw of white window
• Impress black Raster signal as contrast ratio measurement signal.
Measure black brightness degree Lb of PDP central
Calculate the following numerical formula.
Contrast ratio =Lw /Lb
Calculate the following numerical formula.
Contrast ratio =Lw /Lb
If it does not use Prior measurement, use generally simple test measurement. The Correct measure specification is followed
by IEC61988-2/CD,JAPAN EIAJ-2710
by IEC61988-2/CD,JAPAN EIAJ-2710
- 8 -
C
2009
A: H/ 4mm
B: V/ 4mm
@ H,V: Active Area
B: V/ 4mm
@ H,V: Active Area
Click on the first or last page to see other 47LF11 (CHASSIS:LA92G) service manuals if exist.