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- 5 -

IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.

Removal
1.  Desolder and straighten each IC lead in one operation by gently

prying up on the lead with the soldering iron tip as the solder
melts.

2.  Draw away the melted solder with an anti-static suction-type

solder removal device (or with solder braid) before removing the
IC.

Replacement
1.  Carefully insert the replacement IC in the circuit board.
2.  Carefully bend each IC lead against the circuit foil pad and

solder it.

3.  Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement
1.  Remove the defective transistor by clipping its leads as close as

possible to the component body.

2.  Bend into a "U" shape the end of each of three leads remaining

on the circuit board.

3.  Bend into a "U" shape the replacement transistor leads.
4.  Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.

Power Output, Transistor Device
Removal/Replacement
1.  Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3.  Carefully remove the transistor from the heat sink of the circuit

board.

4.  Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6.  Replace heat sink.

Diode Removal/Replacement
1.  Remove defective diode by clipping its leads as close as

possible to diode body.

2.  Bend the two remaining leads perpendicular y to the circuit

board.

3.  Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.

4.  Securely crimp each connection and solder it.
5.

Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.

Fuse and Conventional Resistor
Removal/Replacement
1.  Clip each fuse or resistor lead at top of the circuit board hollow

stake.

2.  Securely crimp the leads of replacement component around

notch at stake top.

3.  Solder the connections.

CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.

At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).

1.  Carefully remove the damaged copper pattern with a sharp

knife. (Remove only as much copper as absolutely necessary).

2.  carefully scratch away the solder resist and acrylic coating (if

used) from the end of the remaining copper pattern.

3.  Bend a small "U" in one end of a small gauge jumper wire and

carefully crimp it around the IC pin. Solder the IC connection.

4.  Route the jumper wire along the path of the out-away copper

pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.

At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.

1.  Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.

2.  Trace along the copper pattern from both sides of the pattern

break and locate the nearest component that is directly
connected to the affected copper pattern.

3.  Connect insulated 20-gauge jumper wire from the lead of the

nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

This spec sheet is applied LCD TV with 32”, 37”, 42”, 47”, 55”
LA01U chassis. 

Each part is tested as below without special appointment.

1) Temperature:  25 ºC  ± 5 ºC 
2) Relative Humidity:  65  ± 10 %
3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz)

* Standard Voltage of each product is marked by models

4) Specification and performance of each parts are followed

each drawing and specification by part number in
accordance with BOM.

5) The receiver must be operated for about 5 minutes prior to

the adjustment.

1) Performance: LGE TV test method followed 
2) Demanded other specification 

- Safety : UL, CSA, IEC specification 
- EMC: FCC, ICES, IEC specification 

- 6 -

NOTE : Specifications and others are subject to change without notice for improvement.

No

Item

Specification

Remark

1

Receivable System

1) ATSC / NTSC-M 

2

Available Channel

1) VHF : 02 ~ 13

2) UHF : 14 ~ 69

3) DTV : 02 ~ 69

4) CATV : 01 ~ 135

5) CADTV : 01 ~ 135

3

Input Voltage

1) AC 100 - 240V~  50/60Hz   

Mark : 110V, 60Hz (N.Ame

4

Market

5

Screen Size

32 inch Wide (1920x1080) 

FHD + 60Hz 

32LK450-UB 

37 inch Wide (1920x1080) 

FHD + 60Hz 

37LK450-UB 

42 inch Wide (1920x1080)

FHD + 60Hz 

42LK450-UB 

47 inch Wide (1920x1080) 

FHD + 60Hz 

47LK450-UB 

6

Aspect Ratio

16:9

7

Tuning System

FS

8

LCD Module

T315HW04-V9 

AUO 

32LK450-UB 

LC370WUE-SCA1 LGD 

37LK450-UB 

T370HW03-VN AUO 

 

37LK450-UB

LC420WUE-SCA2 LGD 

42LK450-UB

T420HW09-V0 AUO 

 

42LK450-UB

LC470WUE-SCA2 LGD 

47LK450-UB 

9

Operating Environment

Temp  : 0 ~ 40 deg

Humidity : ~ 80 %

10

Storage Environment

Temp  : -20 ~ 60 deg

Humidity : -85 %

- 7 -

No.

Item

Min

Typ

Max

Unit

Remarks

1

Max Luminance 

320

400

cd/m

2

32/37/42LK450-UB(AUO)

(Center 1-point / Full White Pattern) 

360

500

37/42/47LK450-UB(LGD)

2

Luminance uniformity

3

Color coordinate

RED

X

Typ.

0.64

Typ.

32LK450-UB(AUO)

(Default)

Y

-0.03

0.33

+0.03

GREEN

X

0.29

Y

0.60

BLUE

X

0.15

Y

0.06

WHITE

X

0.28

Y

0.29

RED

X

Typ.

0.639

Typ.

37LK450-UB(LGD)

Y

-0.03

0.334

+0.03

GREEN

X

0.289

Y

0.606

BLUE

X

0.145

Y

0.065

WHITE

X

0.279

Y

0.292

RED

X

Typ.

0.640

Typ.

37LK450-UB(AUO)

Y

-0.03

0.330

+0.03

GREEN

X

0.281

Y

0.590

BLUE

X

0.144

Y

0.060

WHITE

X

0.280

Y

0.290

RED

X

Typ.

0.636

Typ.

42LK450-UB(LGD)

Y

-0.03

0.335

+0.03

GREEN

X

0.291

Y

0.603

BLUE

X

0.146

Y

0.061

WHITE

X

0.279

Y

0.292

RED

X

Typ.

0.640

Typ.

42LK450-UB(AUO)

Y

-0.03

0.330

+0.03

GREEN

X

0.281

Y

0.590

BLUE

X

0.144

Y

0.060

WHITE

X

0.280

Y

0.290

- 8 -

RED

X

Typ.

0.639

Typ.

47LK450-UB(LGD)

Y

-0.03

0.334

+0.03

GREEN

X

0.290

Y

0.606

BLUE

X

0.146

Y

0.058

WHITE

X

0.279

Y

0.292

4

Contrast ratio

Module

3200

4000

32/37/42LK450(AUO)

1100

1450

42/47LK450-UB(LGD)

1100

1500

37LK450-UB

DCR

90,000:1

100,000:1

32/37/42/47LK450-UB(LGD) 

30,000:1

40,000:1

32/37/42LK450-UB(AUO)

5

Color Temperature

Cool

0.254 

0.269 

0.284 

13000K The W/B Tolerance is ±0.015

0.258 0.273

0.288

for picture quality by DQA

Medium

0.270

0.285

0.300

9300K

0.278

0.293

0.308

Warm

0.298

0.313

0.324

6500K

0.314

0.329

0.344