LG 42LG6000 / 42LG6100 (CHASSIS:LD89F) Service Manual ▷ View online
C
2008
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
C
2008
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. General Specification(TV)
No.
Item
Specification
Remark
1.
Video input applicable system
PAL-D/K, B/G, I, SECAM
2.
Receivable Broadcasting System
1) PAL/SECAM B/G
EU(PAL Market)
2) PAL/SECAM D/K
3) PAL I/II
4) SECAM L/L’
5) DVB-T
3.
RF Input Channel
VHF : E2 ~ E12
PAL
UHF : E21 ~ E69
CATV : S1 ~ S20
HYPER : S21~ S47
4.
Input Voltage
AC 100 ~ 240 V/50Hz, 60Hz
5. Picture
Size
37
inch
37LG6000/42LG6000/47LG6000
42 inch
47 inch
6.
Tuning System
FVS 100 program
PAL, 200 PR.(Option)
7.
Operating Environment
1) Temp : 0 ~ 40 deg
LGE SPEC
2) Humidity : 10 ~ 90 %
8.
Storage Environment
3) Temp : -20 ~ 50 deg
LGE SPEC
4) Humidity : 10 ~ 90 %
9. Display
LCD
Module
LPL
- 7 -
C
2008
2. General Specification(LCD Module)
No
Item
Specification
Unit
Remark
1.
Panel
37" TFT WUXGA LCD
37LG6000
42" TFT WUXGA LCD
42LG6000
47" TFT WUXGA LCD
47LG6000
2.
Frequency range
H : 64.1 ~ 67.5Khz, V : 57 ~ 63Hz
37 inch
H : 121.8 ~ 136.4Khz, V : 108.2 ~ 121.2Hz
42 inch
H : 121.8 ~ 136.4Khz, V : 108.2 ~ 121.2Hz
47 inch
3.
Power consumption
37 inch
≤ 10.76 + 132
W
LCD + Backlight
42 inch
9.4(Max) + 160.8(Typ)
W
47 inch
≤ TBD + 240(Max)
W
4.
LCD Module-LPL
Type Size
37"
877 x 516.8 x 55.5
mm
(H)x (V)x(D)
42"
983.0 x 576.0 x 47.3
47"
1096.0 x 640.0 x 50
Pixel Pitch
37"
0.42675 x 0.42675
mm
42"
0.4845 x 0.4845
47"
0.5415 x 0.5415
Pixel Format
1920 horiz. By 1080 vert.
37/42/47 inch
Pixels RGB stripe arrangement
Coating
Hard coating(3H), Anti-glare treatment
of the front polarizer(Haze 13%)
Back Light
37"
16 Lamp(EEFL)
42"
18 Lamp(EEFL)
47"
22 Lamp(CCFL)
C
2008
- 8 -
3. Optical Feature(LCD Module)
No.
Item
Specification
Min.
Typ.
Max.
Remark
1.
Viewing Angle(CR>10)
R/L, U/D
178, 178
2.
Luminance
Luminance (cd/m2)
400
500
42" without PC (PC: min 300)
Variation
-
1.3
MAX / MIN
3.
Contrast Ratio
CR(37")
1000
1400
All white/All black
CR(42")
1000
1400
without PC (PC:min400)
CR(47")
TBD
1500
4.
CIE Color Coordinates
White
WX
Typ
0.279
Typ
37 inch
WY
-0.03
0.292
+0.03
RED
Xr
0.641
Yr
0.334
Green
Xg
0.291
Yg
0.614
Blue
Xb
0.145
Yb
0.062
White
WX
Typ
0.279
Typ
42 inch
WY
-0.03
0.292 +0.03
RED
Xr
0.640
Yr
0.335
Green
Xg
0.289
Yg
0.610
Blue
Xb
0.144
Yb
0.066
White
WX
Typ
0.279
Typ
47 inch
WY
-0.03
0.292
+0.03
RED
Xr
0.636
Yr
0.334
Green
Xg
0.291
Yg
0.613
Blue
Xb
0.146
Yb
0.061
1) Standard Test Condition
2) Surrounding Brightness Level
2) Surrounding Brightness Level
: dark
3) Surrounding Temperature
: 25±2°C
4) warm-up Time
: 30 Min
5) Input Signal
: VESA XGA 60Hz
- Contrast, Brightness : Max.
- Clock/Clock Phase : accurate adjustment
- Clock/Clock Phase : accurate adjustment
Click on the first or last page to see other 42LG6000 / 42LG6100 (CHASSIS:LD89F) service manuals if exist.