LG 42LG53FR (CHASSIS:LP81A) Service Manual ▷ View online
C
2008
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5.
5.
Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
C
2008
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. General Specification(TV)
No
Item
Specification
Measurement
Result
Remark
1.
Display Screen Device
37" wide Color Display Module
Resolution:1366X768(HD)
42" wide Color Display Module
Resolution:1366X768(HD)/1920*1080(FHD)
47" wide Color Display Module
Resolution:1366X768(HD)/1920*1080(FHD)
52" wide Color Display Module
Resolution:1920X1080(FHD)
2. Aspect
Ratio
16:9
3.
LCD Module
37" TFT WXGA LCD
37" HD MAKER :LPL
42" TFT WXGA LCD
42" HD MAKER :AUO, LPL
47" TFT WXGA LCD
47" HD MAKER :LPL
42" TFT WUXGA LCD
42" FHD MAKER : LPL
47" TFT WUXGA LCD
47" FHD MAKER : LPL
52" TFT WUXGA LCD
52" FHD MAKER : SHARP
4.
Operating Environment
1) Temp. : 0 ~ 40 deg
LGE SPEC
2) Humidity : 0 ~ 85%
5.
Storage Environment
1) Temp. : -20 ~ 60 deg
2) Humidity : 0 ~ 85 %
6.
Input Voltage
AC100 ~ 240V, 50/60Hz
1. Application Range.
This spec sheet is applied to the 37"/42"/47"/52" LCD TV used
LP81A chassis.
LP81A chassis.
2. Specification
Each part is tested as below without special appointment
2.1 Temperature : 25±5°C(77±9°F), CST : 40±5°C
2.2 Relative Humidity : 65±10%
2.3 Power Voltage : Standard input voltage
2.2 Relative Humidity : 65±10%
2.3 Power Voltage : Standard input voltage
(100~240V@ 50/60Hz)
• Standard Voltage of each products is marked by models
• Standard Voltage of each products is marked by models
2.4 Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM .
accordance with BOM .
2.5 The receiver must be operated for about 20 minutes prior
to the adjustment.
3. Test method
3.1 Performance : LGE TV test method followed.
3.2 Demanded other specification
3.2 Demanded other specification
Safety : UL, CSA, IEC specification
3.3 EMC : FCC, ICES, IEC specification
C
2008
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No
Item
Specification
Measurement
Result
Remark
7.
Power Consumption
Power on (Blue) : LG30/LG50
Volume: 1/8 volume of
Power on (White) : LG60
sound distortion point
≤
TBD
37" HD
≤
250W
42"
HD
≤
230W
FHD
≤
320W
47"
HD
≤
310W
FHD
≤
350W
52" FHD
St-By (Red)
LG60:St-by Light condition
≤
1.0 W (All)
8
LCD Module
Maker
Inch
(H)x(V)x(D)
unit
Remark
(Maker :
AUO(HD) Outline Dimension
42"
983 x 576 x 52.7
mm
[with inverter]
AUO, CMO, CPT,
Pixel Pitch
0.681 x 0.681
mm
LPL, SHARP)
Back Light
18 CCFL
mm
CMO
Outline Dimension
42"
-
mm
(FHD)
Pixel Pitch
-
mm
Back Light
-
mm
LPL(HD)
Outline Dimension
37"
877 x 516.8 x 55.5
mm
[with inverter]
Pixel Pitch
0.200 x 0.600
mm
Back Light
16 EEFL
mm
Outline Dimension
42"
983 x 576 x 51
mm
[with inverter]
Pixel Pitch
0.227 x 0.681
mm
Back Light
mm
Outline Dimension
47"
1096 x 640 x 51
mm
[with inverter]
Pixel Pitch
0.76125 x 0.76125
mm
Back Light
mm
LPL(FHD) Outline Dimension
42"
983 x 576 x 47.3/(51)
mm
[w/o inverter]/(with inverter)
Pixel Pitch
0.4845 x 0.4845
mm
Back Light
mm
Outline Dimension
47"
1096 x 640 x 50/(51)
mm
[w/o inverter]/(with inverter)
Pixel Pitch
0.5415 x 0.5415
mm
Back Light
mm
SHARP
Outline Dimension
52"
1219.0x706.7x64.64
mm
(W) x (H) x (D)
(FHD)
Pixel Pitch
0.600 x 0.600
mm
(H) x (V)
Back Light
24CCFL
Display Colors
-
-
Coating
3H,AG/ 2H, AG
LPL,CMO,AUO / Sharp
C
2008
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5. Chrominance & Luminance Specification
No
Item
Min
Typ
Max
Unit
Maker
Remark
1
Luminance
400
500
cd/m
2
AUO 42" HD
-50cm from the surface
(W/O PC mode)
400
500
LPL 37" HD
- Full White Pattern
400
500
LPL 42" HD
400
450
LPL 47" HD
400
500
LPL 42" FHD
400
500
LPL 47" FHD
360
450
SHARP 52" FHD
2
Color Coordinate
White
X
Typ.
0.280
Typ.
AUO 42"
42LG30R-TA
Y
-0.03
0.290
+0.03
(HD)
Red
X
0.640
T420XW01-VB
Y
0.330
Green
X
0.290
Y
0.600
Blue
X
0.150
Y
0.060
White
X
Typ.
0.279
Typ.
LPL 37" (HD)
37LG30R/37LG60UR
Y
-0.03
0.292
+0.03
LC370WXN-SAA1
Red
X
0.636
Y
0.335
Green
X
0.284
Y
0.610
Blue
X
0.144
Y
0.063
White
X
Typ.
0.279
Typ.
LPL 42"
42LG30RA-TA
Y
-0.03
0.292
+0.03
(HD)
Red
X
0.635
Y
0.344
Green
X
0.286
Y
0.614
Blue
X
0.146
Y
0.061
White
X
Typ.
0.270.
Typ.
LPL47"
Y
-0.03
0.292
+0.03
(HD)
Red
X
0.638
Y
0.342
Green
X
0.296
Y
0.615
Blue
X
0.144
Y
0.064
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