DOWNLOAD LG 37LV3500-DA (CHASSIS:LT01U) Service Manual ↓ Size: 24.07 MB | Pages: 63 in PDF or view online for FREE

Model
37LV3500-DA (CHASSIS:LT01U)
Pages
63
Size
24.07 MB
Type
PDF
Document
Service Manual
Brand
Device
TV / LCD
File
37lv3500-da-chassis-lt01u.pdf
Date

LG 37LV3500-DA (CHASSIS:LT01U) Service Manual ▷ View online

- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1.  Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2.  Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1.  Carefully insert the replacement IC in the circuit board.
2.  Carefully bend each IC lead against the circuit foil pad and
solder it.
3.  Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1.  Remove the defective transistor by clipping its leads as close as
possible to the component body.
2.  Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3.  Bend into a "U" shape the replacement transistor leads.
4.  Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1.  Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3.  Carefully remove the transistor from the heat sink of the circuit
board.
4.  Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6.  Replace heat sink.
Diode Removal/Replacement
1.  Remove defective diode by clipping its leads as close as
possible to diode body.
2.  Bend the two remaining leads perpendicular y to the circuit
board.
3.  Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4.  Securely crimp each connection and solder it.
5.
Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1.  Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2.  Securely crimp the leads of replacement component around
notch at stake top.
3.  Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1.  Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2.  carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3.  Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4.  Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1.  Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2.  Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3.  Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. Electrical specification
4.1. Module Specification
1. Application range
This specification is applied to LCD TV used LT01U chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature :  25 ºC ± 5 ºC (77 ºF ± 9 ºF), CST : 40ºC  ± 5 ºC
2) Relative Humidity :  65 ± 10 %
3) Power Voltage : Standard input voltage (100-240V~50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed 
2) Demanded other specification 
- Safety: CE / IEC / BSMI specification
EMI: CE / IEC / BSMI
No
Item Specification
Remark
1
Screen Device
32”/37”/42”/47”/55” wide Color Display module 
LCD
2
Aspect Ratio
16:9
3
LCD Module 
31.5" Color TFT-LCD Module 
T315HW04 V9(AUO) 
37” Color WUXGA TFT-LCD Module 
LC370WUE-SCA1(LGD) 
42” Color WUXGA TFT-LCD Module 
LC420WUE-SCA2(LGD) 
42” Color WUXGA TFT-LED Module 
V420H2-LE5(CMI) 
47” Color WUXGA TFT-LCD Module 
LC470WUF-SCA2(LGD) 
55” Color WUXGA TFT-LCD Module 
LC550EUF-SDA1(LGD) 
4
Operating Environment
1) Temp.   : 0 ~ 40 deg 
2) Humidity : 0 ~ 80%   
5
Storage Environment 
1) Temp.: -20 ~ 60  deg
2) Humidity : 0 ~ 85 %   
6
Input Voltage 
AC100-240V~, 50/60Hz
7
Power Consumption
105W         32”      FHD   
T315HW04 V9(AUO) 
148W         37”      FHD   
LC370WUE-SCA1(LGD) 
176W         42”      FHD  
LC420WUE-SCA2(LGD)  
125W         42”      FHD   
V420H2-LE5(CMI) 
233W         47”      FHD   
LC470WUF-SCA2(LGD) 
128.3W      55”      FHD   
LC550EUF-SDA1(LGD) 
8
Module Size
AUO          32”      760.0 (H) x 450.0 (V) x 46.9 (D)   
T315HW04 V9(AUO) 
LGD          37”      877.0 (H) x 516.8 (V) x 36.4 (D)   
LC370WUE-SCA1(LGD) 
LGD          42”      983.0 (H) x 576.0 (V) x 46.0 (D)  
LC420WUE-SCA2(LGD) 
CMI           42”      968.4 (H) x 564 (V) x 10.8 (D)   
V420H2-LE5(CMI) 
LGD          47”      1096.0(H) x 640.0(V) x 35.5 (D)   
LC470WUF-SCA2(LGD) 
- 7 -
5. Chroma& Brightness
5.1. Module optical specification
5.1.1. 32” TFT-LCD Module (AUO) – T315HW04 V9 
1) Optical characteristics are determined after the unit has been ‘ON’ and stable in a dark environment at 25±2°C
2) Surface luminance is the luminance value at center 1-point across the LCD surface 50cm from the surface with all pixels
displaying white.
No.
Item Specification 
Min.
Typ.
Max.
Remark
1.
Viewing Angle<CR>10> 
Right/Left/Up/Down 
89
CR > 10
Luminance (cd/m
2
)
320 400
2.
Luminance
Variation -
1.3 
3.
Contrast Ratio 
CR 
3200 
4000
All white/ All black
White WX
0.28 
WY Typ
0.29
Typ 
RED 
Xr
- 0.03
0.64
+0.03
PSM: Vivid, CSM: Cool
4.
CIE Color Coordinates
Yr
0.33
White (85IRE)
Green Xg
0.29
Yg
0.60
Blue Xb 
0.15
Yb  
0.06
1) Optical characteristics are determined after the unit has been ‘ON’ and stable in a dark environment at 25±2°C
2) Surface luminance is the luminance value at center 1-point across the LCD surface 50cm from the surface with all pixels
displaying white.
No.
Item Specification 
Min.
Typ.
Max.
Remark
1.
Viewing Angle<CR>10> 
Right/Left/Up/Down 
88
CR > 10
Luminance (cd/m
2
)
360
450
2.
Luminance
Variation -
1.3 
3.
Contrast Ratio 
CR 
3750 
5000
All white/ All black
White WX
0.280 
WY Typ
0.290
Typ 
RED 
Xr
- 0.03
0.648
+0.03
PSM: Vivid, CSM: Cool
4.
CIE Color Coordinates
Yr
0.321
White (85IRE)
Green Xg
0.304
Yg
0.617
Blue Xb 
0.149
Yb  
0.063
5.1.2. 32” TFT-LCD Module (CMI) – V315B5-LE3 
- 8 -
1) Optical characteristics are determined after the unit has been ‘ON’ and stable in a dark environment at 25±2°C
2) Surface luminance is the luminance value at center 1-point across the LCD surface 50cm from the surface with all pixels
displaying white.
No.
Item Specification 
Min.
Typ.
Max.
Remark
1.
Viewing Angle<CR>10> 
Right/Left/Up/Down 
88
CR > 10
Luminance (cd/m
2
)
2.
Luminance
Variation -
1.3 
3.
Contrast Ratio 
CR 
700 
1200
All white/ All black
White WX
0.278 
WY Typ
0.285
Typ 
RED 
Xr
- 0.03
0.645
+0.03
PSM: Vivid, CSM: Cool
4.
CIE Color Coordinates
Yr
0.330
White (85IRE)
Green Xg
0.300
Yg
0.620
Blue Xb 
0.153
Yb  
0.065
5.1.4. 32” TFT-LCD Module (IPS) – VVX32H109G00 
1) Optical characteristics are determined after the unit has been ‘ON’ and stable in a dark environment at 25±2°C
2) Surface luminance is the luminance value at center 1-point across the LCD surface 50cm from the surface with all pixels
displaying white.
No.
Item Specification 
Min.
Typ.
Max.
Remark
1.
Viewing Angle<CR>10> 
Right/Left/Up/Down 
88
CR > 10
Luminance (cd/m
2
)
360
450
2.
Luminance
Variation -
1.3 
3.
Contrast Ratio 
CR 
3500 
5000
All white/ All black
White WX
0.280 
WY Typ
0.290
Typ 
RED 
Xr
- 0.03
0.635
+0.03
PSM: Vivid, CSM: Cool
4.
CIE Color Coordinates
Yr
0.323
White (85IRE)
Green Xg
0.288
Yg
0.600
Blue Xb 
0.148
Yb  
0.050
5.1.3. 32” TFT-LCD Module (CMI) – V315H3-LE7 
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