LG 37LC3R (CHASSIS:LP62A) Service Manual ▷ View online
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5.
5.
Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
- 6 -
1. Application range
This specification is applied to LP62A chassis.
2. Requirement for Test
Testing for standard of each part must be followed in below
condition.
condition.
(1) Temperature : 25°C±5°C(77±9°F), CST : 40±5
(2) Humidity : 65%±10%
(3) Power : Standard input voltage (AC 100-240V, 50/60Hz)
(2) Humidity : 65%±10%
(3) Power : Standard input voltage (AC 100-240V, 50/60Hz)
*Standard Voltage of each products is marked by models
(4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
accordance with BOM.
(5) The receiver must be operated for about 20 minutes prior
to the adjustment.
3. Test method
3.1 Performance : LGE TV test method followed
3.2 Demanded other specification
3.2 Demanded other specification
Safety : CE, IEC Specification
EMC : CE, IEC
EMC : CE, IEC
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. General TV Specification
No
Item
Specification
Remark
1.
Video input applicable system
PAL-D/K, B/G, I, NTSC-M, SECAM,
NTSC 4.43
2.
Receivable Broadcasting System
1) PAL/SECAM BG
2) PAL/SECAM DK
3) PAL I/I
4) SECAM L/L'
only ZH
5) PAL-N/M
6) NTSC M
only TH
3.
RF Input Channel
VHF : E2 ~ E12
PAL
UHF : E21 ~ E69
CATV : S1 ~ S20
HYPER : S21~ S47
L/L' : B, C, D
FRANCE
VHF : 2~13
NTSC
UHF : 14~69
CATV : 1~125
4.
Input Voltage
AC 100 ~ 240 V/50Hz, 60Hz
5.
Market
Worldwide
6.
Active Screen Size
940.3 mm(diagonal)
37.02 inches
1067.308 mm (diagonal)
42.02 inches
7.
Tuning System
FVS 100 program
FS
8.
Operating Environment
1) Temp : 0 ~ 40 deg
2) Humidity : 10 ~ 90 %RH
9.
Storage Environment
1) Temp : -20 ~ 50 deg
2) Humidity : 10 ~ 90 %RH
10.
Display
LCD Module
32"/42" : LPL
37" : AUO, LPL
- 7 -
5. General Specification
6. Set Optical Feature
6.1. 37LC2R-ZH(Only LPL Module)/42LC2R-ZH
No
Item
Specification
Remark
1
Panel
37", 42" TFT WXGA LCD
2
Frequency range
H : 31 ~ 61KhzV : 56 ~ 75Hz
PC Input
3
Control Function
1) Contrast/Brightness
2) H-Position / V-Position
3) Tracking : Clock / Phase
4) Auto Configure
5) Reset
4
Component Jack
Y/Pb/Pr : 1EA
ZH
(480i/576i/480p/576p/720p/1080i)
Y/Pb/Pr : 2EA
TH
5
Power ON
LED
Power consumption
White
≤
190W(37")
≤
230W(42")
Stand by
RED
≤
1W
6
LCD Module
Outline
37"
877.0 x 516.8 x 55.5
(H)mmx(V)mmx(D)mm
Dimension
42"
1006 x 610 x 56
Pixel Pitch
37"
0.200 x 0.600 x RGB
42"
0.227 x 0.681 x RGB
Pixel Format
1366 x 768 Pixels RGB strip arrangement
Coating
Hard coating(3H), Anti-glare treatment of
the front polarizer,
Back Light
37"
16CCFL
42"
20CCFL
No
Parameter
Symbol
Value
Unit
Remark
Min
Typ
Max
1.
Contrast Ratio
CR
37"
800
1200
(*) Normal Mode
42"
700
1000
- 100IRE Full white window pattern
- APC : Clear (Dynamic)
2.
Surface Luminance,
LWH
360
450
Cd/m
2
(*) Normal Mode
white
- 100IRE Full white window pattern
- APC : Clear (Dynamic)
3.
White Coordinate
Normal
X axis
0.280
0.283
0.286
- 85IRE Full White Pattern
Y axis
0.295
0.298
0.301
- APC : Standard
Cool
X axis
0.271
0.274
0.277
Y axis
0.283
0.286
0.289
Warm
X axis
0.300
0.303
0.306
Y axis
0.316
0.319
0.322
4.
Color Temperature
Normal
8300
9300
10300
- 85IRE Full White Pattern
Warm
6200
7200
8200
- APC : Standard
Cool
10000
11000
12000
5.
Color pull in Range
PAL
-500
+500
Hz
NTSC
-500
+500
Hz
6.
Color killer Sensitivity
-80
dBm
- 8 -
6.2. 37LC2R-ZH(Only AUO Module)
No
Parameter
Symbol
Value
Unit
Remark
Min
Typ
Max
1.
Contrast Ratio
CR
32", 37"
800
1200
(*) Normal Mode
42"
700
1000
- 100IRE Full white window pattern
- APC : Clear (Dynamic)
2.
Surface Luminance,
LWH
360
450
Cd/m
2
(*) Normal Mode
white
- 100IRE Full white window pattern
- APC : Clear (Dynamic)
3.
White Coordinate
Normal
X axis
0.280
0.283
0.286
- 85IRE Full White Pattern
Y axis
0.295
0.298
0.301
- APC : Standard
Cool
X axis
0.271
0.274
0.277
Y axis
0.283
0.286
0.289
Warm
X axis
0.300
0.303
0.306
Y axis
0.316
0.319
0.322
4.
Color Temperature
Normal
8300
9300
10300
- 85IRE Full White Pattern
Warm
6200
7200
8200
- APC : Standard
Cool
10000
11000
12000
5.
Color pull in Range
PAL
-500
+500
Hz
NTSC
-500
+500
Hz
6.
Color killer Sensitivity
-80
dBm
7. Model Specification
No
Item
Specification
Remark
1.
Market
EU
2.
Broadcasting system
PAL BG/I/DK, SECAM
3.
Available Channel
BAND
PAL
VHF/UHF
C1 ~ C69
CATV
S1 ~ S47
4.
Receiving system
Upper Heterodyne
5.
SCART Jack(2EA)
PAL, SECAM, NTSC
4 System :
PAL, SECAM, NTSC, PAL60
6.
Video Input (2EA)
PAL, SECAM, NTSC
4 System :
PAL, SECAM, NTSC, PAL60
7.
S-Video Input (2EA)
PAL, SECAM, NTSC
4 System :
PAL, SECAM, NTSC, PAL60
8.
Component Input (1EA)
Y/Cb/Cr, Y/ Pb/Pr
9.
RGB Input (1EA)
RGB-PC,
RGB-DTV
10.
HDMI Input (2EA)
HDMI-PC
HDMI-DTV
11.
Audio Input (4 EA)
PC Audio, Component (1EA),
AV (2EA)
L/R Input
12.
Wired Control (1EA)
13.
Audio variable out(1EA)
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