LG 32LV3700-ZC / 32LV375G-ZC / 32LV375S-ZC / 32LV375W-ZC (CHASSIS:LD12B) Service Manual ▷ View online
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+3.5V_ST
EDID_WP
C602
13pF
50V
R645
270K
OPT
SCART_MUTE
KEY2
NEC_ISP_Rx
C607
15pF
R624
10K
10YEAR_TOOL
NEC_RXD
MICOM_RESET
R619
22
SIDE_HP_MUTE
R612
10K
LCD/OLED
X601
10MHz
POWER_ON/OFF1
R613
10K
TOUCH_KEY
R616
22
+3.5V_ST
R622
10K
I2C LED
R628
4.7K
+3.5V_ST
R644
47K
KEY1
+3.5V_ST
+3.5V_ST
+3.5V_ST
R617
22
R615
22
R641
0
MODEL1_OPT_0
MODEL1_OPT_1
C609
1uF
C604
0.1uF
0.1uF
RL_ON
R626
4.7K
R647
20K
1/16W
1%
1%
+3.5V_ST
OCD1A
EEPROM_SCL
INSTANT_MODE
MODEL1_OPT_1
R642
4.7M
OPT
AMP_RESET_N
S/T_SCL
C605
0.1uF
FLMD0
EEPROM_SDA
LED_B/LG_LOGO
R
6
3
8
2
2
OPT
R
6
0
1
4
7
K
AMP_MUTE
R625
10K
11YEAR_TOOL
R646
20K
1/16W
1%
GND
R632
22
MODEL1_OPT_2
MODEL1_OPT_0
R614
10K
TACT_KEY
R602
100
R637
47K
OPT
NEC_ISP_Tx
C606
15pF
R610
10K
R611
10K
PDP/3D
X602
32.768KHz
OCD1B
R605
100
MODEL1_OPT_2
R621
22
INV_CTL
R629
22
NEC_ISP_Tx
R639
10K
R606
10K
NEC_TXD
R607
10K
+3.5V_ST
R603
100
PANEL_CTL
MODEL1_OPT_3
MICOM_DOWNLOAD
+3.5V_ST
POWER_ON/OFF2_1
GND
R631
22
NEC_ISP_Rx
R604
100
R643
22
S/T_SDA
LED_R/BUZZ
C603
13pF
50V
C608
0.1uF
16V
0.1uF
16V
R
6
4
0
1
0
K
R623
10K
PWM_LED
FLMD0
EEPROM_SDA
HDMI_CEC
SDA2_3.3V
R630
22
WIRELESS_DET
NEC_ISP_Rx
IC602
uPD78F0514
NEC_MICOM
1
P60/SCL0
2
P61/SDA0
3
P62/EXSCL0
4
P63
5
P33/TI51/TO51/INTP4
6
P75
7
P74
8
P73/KR3
9
P72/KR2
10
P71/KR1
11
P70/KR0
12
P32/INTP3/OCD1B
13
P31/INTP2/OCD1A
14
P30/INTP1
15
P17/TI50/TO50
16
P16/TOH1/INTP5
17
P15/TOH0
18
P14/RXD6
19
P13/TXD6
20
P12/SO10
21
P11/SL10/RXD0
22
P10/SCK10/TXD0
23
AVREF
24
AVSS
25
ANI7/P27
26
ANI6/P26
27
ANI5/P25
28
ANI4/P24
29
ANI3/P23
30
ANI2/P22
31
ANI1/P21
32
P20/ANI0
33
P130
34
P01/TI010/TO00
35
P00/TI000
36
P140/PCL/INTP6
37
P120/INTP0/EXLVI
38
P41
39
P40
40
RESET
41
P124/XT2/EXCLKS
42
P123/XT1
43
FLMD0
44
P122/X2/EXCLK/OCD0B
45
P121/X1/OCD0A
46
REGC
47
VSS
48
VDD
POWER_ON/OFF2_2
R649
0
OPT
OCD1A
MICOM_DOWNLOAD
+3.5V_ST
IR
POWER_DET
MICOM_RESET
MODEL1_OPT_3
P601
12505WS-12A00
1
2
3
4
5
6
7
8
9
10
11
12
13
OCD1B
IC601
M24C16-WMN6T
3
NC/E2
2
NC/E1
4
VSS
1
NC/E0
5
SDA
6
SCL
7
WC
8
VCC
NEC_ISP_Tx
EEPROM_SCL
R627
4.7K
SCL2_3.3V
+3.5V_ST
R636
4.7K
R633
22
22
OPT
SOC_RESET
WIRELESS_PWR_EN
Q601
2SC3052
2SC3052
E
B
C
SW1
JTP-1127WEM
1
2
4
3
R648
10K
BCM35230
MICOM
EEPROM for Micom
30
MODEL_OPT_2
MICOM MODEL OPTION
PWM_LED
LOW
11
MODEL_OPT_0
PIN NAME
31
8
HIGH
For Debug
11YEAR_TOOL
(11 SENSOR)
(11 SENSOR)
10YEAR_TOOL
(10 SENSOR)
(10 SENSOR)
50
PDP/3D
6
MODEL OPTION
MODEL_OPT_3
TACT_KEY
10Mhz Crystal
LCD/OLED
MODEL_OPT_1
I2C_LED
TOUCH_KEY
PIN NO.
HIGH
LOW_SMALL
MODEL_OPT_3
TBD
1
LCD
1
0
0
1
0
MODEL_OPT_2
MODEL_OPT_1
OLED
3D
0
0
1
0
1
PDP
LOW
1
NEC MICOM
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SCL2_3.3V
R1602
33
LPB_42/47/55
SDA2_3.3V
R1601
33
LPB_42/47/55
L/DIM0_MOSI
L/DIM0_SCLK
L/DIM0_VS
P1601
12507WR-08L
1
2
3
4
5
6
7
8
9
50
BCM35230
16
L_DIMMING
[Local Dimming Block]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
CI_TS_DATA[1]
NAND_DATA[6]
FE_TS_DATA[3]
PCM_MDI[3]
NAND_DATA[5]
CI_DATA[1]
PCM_ADDR[2]
PCM_ADDR[4]
PCM_ADDR[9]
FE_TS_DATA[2]
CI_TS_DATA[5]
CI_DATA[6]
FE_TS_DATA[1]
PCM_TS_DATA[2]
CI_DATA[7]
PCM_ADDR[12]
CI_ADDR[1]
NAND_DATA[2]
CI_MDI[5]
PCM_MDI[5]
PCM_MDI[7]
CI_DATA[2]
PCM_TS_DATA[4]
CI_DATA[0]
CI_MDI[4]
CI_MDI[0]
CI_TS_DATA[7]
CI_MDI[1]
CI_DATA[6]
CI_MDI[5]
NAND_DATA[4]
CI_MDI[0]
FE_TS_DATA[0]
CI_ADDR[14]
CI_ADDR[10]
CI_TS_DATA[2]
PCM_MDI[6]
PCM_MDI[2]
PCM_TS_DATA[5]
CI_DATA[0]
CI_TS_DATA[6]
CI_MDI[3]
CI_MDI[6]
PCM_TS_DATA[3]
NAND_DATA[0]
CI_MDI[6]
CI_ADDR[8]
PCM_TS_DATA[6]
FE_TS_DATA[4]
PCM_MDI[4]
PCM_MDI[0]
PCM_TS_DATA[1]
CI_TS_DATA[0]
CI_ADDR[6]
NAND_DATA[7]
CI_MDI[2]
PCM_ADDR[3]
CI_DATA[7]
CI_DATA[5]
CI_MDI[7]
FE_TS_DATA[6]
CI_MDI[4]
PCM_ADDR[7]
PCM_TS_DATA[7]
CI_ADDR[0]
PCM_ADDR[11]
CI_TS_DATA[4]
PCM_TS_DATA[0]
CI_MDI[1]
FE_TS_DATA[5]
CI_DATA[3]
CI_MDI[7]
CI_DATA[3]
CI_DATA[2]
CI_ADDR[5]
CI_DATA[1]
CI_DATA[4]
CI_TS_DATA[3]
CI_DATA[5]
CI_DATA[4]
CI_MDI[2]
CI_MDI[3]
PCM_MDI[1]
FE_TS_DATA[7]
NAND_DATA[3]
PCM_ADDR[13]
NAND_DATA[1]
CI_TS_SYNC
R1954
22
CI
R1970
22
CI
R1961
22
CI
P1901
10067972-000LF CI
G1
G2
57
TS_OUT_CLK
21
ADDR12
52
VPP
16
/IRQA
10
ADDR11
47
TS_IN0
41
TS_OUT7
5
DAT6
36
/CI_DET1
59
CI_WAIT
23
ADDR6
45
IOWR
54
TS_IN5
18
VPP
49
TS_IN2
43
VS1
13
ADDR13
7
/CARD_EN1
38
TS_OUT4
2
DAT3
25
ADDR4
56
TS_IN7
20
TS_IN_CLK
51
VCC
15
/WR_EN
9
/O_EN
46
TS_IN_SYN
40
TS_OUT6
4
DAT5
35
GND
58
CI_RESET
22
ADDR7
53
TS_IN4
17
VCC
11
ADDR10
48
TS_IN1
42
CARD_EN2
12
ADDR8
6
DAT6
37
TS_OUT3
1
GND
24
ADDR5
55
TS_IN6
19
TS_IN_VAL
50
TS_IN3
44
IORD
14
ADDR14
8
ADDR10
39
TS_OUT5
3
DAT4
26
ADDR3
60
INPACK
27
ADDR2
61
REG
28
ADDR1
62
TS_OUT_VAL
29
ADDR0
63
TS_OUT_SYN
30
DAT0
64
TS_OUT0
31
DAT1
32
DAT2
33
/IO_BIT
34
GND
65
TS_OUT1
66
TS_OUT2
67
/CI_DET2
68
GND
69
R1902
22
CI
R1933
10K
OPT
R1917
22 OPT
L1901
BLM18PG121SN1D
CI
R1909
22
OPT
R1953
22
CI
R1919
22 OPT
CI_TS_DATA[3]
+3.3V_CI
AR1903
22
OPT
R1986
22
CI
NIM_TS_SYNC
/PCM_WE
CI 15
/CI_EN1
CI_ADDR[5]
CI_ADDR[0]
R1960
22
CI
PCM_ADDR[13]
NIM_VAL_ERR
R1929
10K
OPT
/PCM_IRQA
C1909
4.7uF
16V
4.7uF
16V
OPT
C1914
0.1uF
16V
0.1uF
16V
CI
CI_TS_DATA[6]
PCM_TS_CLK
R1922
22
CI
+5V_CI_ON
/CI_CE1
R1957
22
CI
CI_ADDR[11]
/CI_CE1
C1912
0.1uF
16V
CI
R1941
10K
CI
R1927
22
CI
R1967
22 CI
NAND_REb
+3.3V_Normal
R1938
62
CI
+5V_CI_ON
R1971
10K
CI
R1951
22
CI
CI_MDI[0-7]
R1907
22
CI
+3.3V_CI
/CI_CD2
+5V_CI_ON
/CI_CD1
R1940
10K
10K
OPT
NIM_TS_CLK
C1901
0.1uF
16V
OPT
+5V_Normal
PCM_TS_DATA[0-7]
R1946
10K
OPT
+3.3V_CI
PCM_ADDR[9]
NAND_WEb
R1910
22
OPT
R1901
22
CI
C1902
0.1uF
16V
OPT
/PCM_IORD
Q1902
AO3407A
CI
G
D
S
/CI_CD2
CI_ADDR[1]
CI_TS_CLK
C1911
0.1uF
16V
OPT
R1969
10K
CI
CI_ADDR[9]
C1915
0.1uF
16V
0.1uF
16V
OPT
R1980
100 CI
R1945
10K
OPT
R1966
10K
CI
R1985
10K
CI
R1936
0
OPT
R1949
22
CI
R1937
62
CI
R1959
22
CI
PCM_MCLKI
PCM_TS_SYNC
C1904
0.1uF
0.1uF
CI
CI_MIVAL_ERR
CI_ADDR[13]
CI_MISTRT
R1947
22
CI
PCM_ADDR[4]
PCM_MDI[0-7]
PCM_ADDR[9]
+3.3V_CI
R1931
22 CI
CI_ADDR[12]
R1918
22 OPT
R1903
22
CI
PCM_MIVAL_ERR
R1939
10K
CI
PCM_ADDR[12]
PCM_ADDR[12]
IC1903
74LVC245A
CI
3
A1
2
A0
4
A2
1
DIR
6
A4
5
A3
7
A5
8
A6
9
A7
10
GND
11
B7
12
B6
13
B5
14
B4
15
B3
16
B2
17
B1
18
B0
19
OE
20
VCC
CI_TS_DATA[0-7]
NAND_REb
PCM_ADDR[13]
R1956
22
CI
/PCM_OE
CI 9
CI_ADDR[2]
CI_ADDR[0]
PCM_ADDR[3]
+3.3V_CI
IC1904
74LVC1G32GW
CI
3
GND
2
A
4
Y
1
B
5
VCC
+3.3V_CI
CI_MDI[0-7]
CI_TS_VAL
PCM_ADDR[2]
CI_TS_DATA[0]
R1948
22
CI
CI_ADDR[10]
C1908
0.1uF
CI
CI_ADDR[3]
C1906
0.1uF
16V
OPT
R1958
22
CI
R1942
4.7K
4.7K
CI
R1934 10K OPT
/PCM_IOWR
R1965
47
CI
FE_TS_DATA[0-7]
/PCM_OE
/PCM_WAIT
CI_TS_DATA[1]
NAND_REb
NAND_RBb
R1962
22
CI
C1907
0.1uF
CI
AR1904 100 CI
/PCM_IOWR
CI 45
PCM_5V_CTL
CI_MISTRT
CI_TS_VAL
R1963
22
CI
L1902
BLM18PG121SN1D
CI
PCM_TS_VAL
GND
+3.3V_CI
CI_MCLKI
R1952
22
CI
PCM_ADDR[7]
R1935
0 CI
R1904
22
CI
CI_TS_DATA[5]
/CI_EN1
/CI_EN1
Q1901
2SC3052
2SC3052
CI
E
B
C
CI_DATA[0-7]
R1964
22
CI
NAND_DATA[0-7]
NAND_CLE
CI_ADDR[8]
PCM_MISTRT
CI_TS_CLK
R1928
22
CI
R1932
10K
CI
R1972
10K
CI
CI_ADDR[4]
/CI_CD1
R1973
10K
CI
CI_MIVAL_ERR
+5V_CI_ON
CI_ADDR[6]
+5V_CI_ON
/PCM_CE1
PCM_ADDR[7]
PCM_RST
/CI_EN1
R1976
22
CI
R1974
22
CI
NAND_WEb
CI_ADDR[7]
+5V_CI_ON
CI_ADDR[1]
+3.3V_CI
CI_TS_DATA[2]
CI_DATA[0-7]
CI_ADDR[14]
PCM_ADDR[2]
PCM_ADDR[11]
PCM_ADDR[4]
R1920
22
CI
R1926
22 CI
R1905
22
CI
C1905
10uF
10V
10uF
10V
CI
R1943
22K
22K
CI
C1903
0.1uF
16V
OPT
R1915
22
OPT
AR1905
100 CI
IC1901
74LVC125APW
CI
3
1Y
2
1A
4
2OE
1
1OE
6
2Y
5
2A
7
GND
8
3Y
9
3A
10
3OE
11
4Y
12
4A
13
4OE
14
VCC
/PCM_WE
/PCM_IORD
CI 44
+5V_CI_ON
R1906
22
CI
R1955
22
CI
CI_TS_SYNC
C1910
0.1uF
CI
PCM_ADDR[11]
R1968
10K
CI
/CI_CE2
/PCM_CE1
CI 7
R1944
0
OPT
R1950
22
CI
R1921
22
CI
/CI_CE2
CI_TS_DATA[7]
R1908
22
CI
+5V_CI_ON
CI_DET
CI_TS_DATA[4]
CI_MCLKI
PCM_ADDR[3]
IC1905
74LVC245A
CI
3
A1
2
A0
4
A2
1
DIR
6
A4
5
A3
7
A5
8
A6
9
A7
10
GND
11
B7
12
B6
13
B5
14
B4
15
B3
16
B2
17
B1
18
B0
19
OE
20
VCC
R1916
22 OPT
C1913
0.1uF
16V
CI
R1930
10K
OPT
R1975
10K
CI
IC1902
74AHC08PW
CI
3
1Y
2
1B
4
2A
1
1A
6
2Y
5
2B
7
GND
8
3Y
9
3A
10
3B
11
4Y
12
4A
13
4B
14
VCC
C1916
12pF
50V
12pF
50V
OPT
R1987
2.2K
2.2K
CI
AR1901
100 CI
AR1902
100 CI
R1924
100 CI
R1925
100 CI
R1923
220 CI
R1977
10K
OPT
1ST : EBK60752501, 2ND : EBK61011501
Close to CI Slot
3,3V_CI POWER
Close to Tuner
Q1901
NAND F/M Data
CI DETECT
1ST : 0TRIY80001A 2ND : 0TR387500AA
Close to CI Slot
Close to BCM35230
Close to BCM35230
CI
BCM INT Demod
CI TS OUTPUT
CI CONTROL INTERFACE
OE DIR CI_DATA NAND_DATA
L L OUTPUT INPUT
L H INPUT OUTPUT
H X Z Z
L L OUTPUT INPUT
L H INPUT OUTPUT
H X Z Z
CI TS INPUT
CI POWER ENABLE CONTROL
DUAL COMPONENT
Q1902
19
IC1904
BCM INT Demod
BCM35230
1ST : 0ISTLPH062A, 2ND : EAN40055001
58
2010.11.11
THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R2302
33
LNB
LNB_TX
L2301
33UH
SP-7850_33
LNB
C2324
68uF
35V
LNB
C2303
0.1uF
50V
0.1uF
50V
LNB
R2303
0
LNB
+3.3V_Normal
C2304 0.1uF
LNB
SCL1_3.3V
C2305
68uF
35V
LNB
D2301
40V
SMAB34
LNB
C2310
27pF
OPT
DCDC_GND
L2302
BLM18PG121SN1D
LNB
A_GND
LNB_OUT
C2308
0.22uF
LNB
+12V
+12V_LNB
D2304
40V
SMAB34
LNB
A_GND
DCDC_GND
C2312
0.1uF
50V
0.1uF
50V
LNB
A_GND
A_GND
A_GND
D2303
40V
SMAB34
LNB
R2314
0
LNB
C2309
27pF
OPT
DCDC_GND
R2313
0
LNB
+12V_LNB
A_GND
A_GND
A_GND
C2311
10uF
25V
10uF
25V
LNB
R2301
33
LNB
C2307
0.01uF
50V
LNB
SDA1_3.3V
C2302
1uF
50V
50V
LNB
LNB_INT
R2304
4.7K
LNB
DCDC_GND
A_GND
C2306
22000pF
LNB
C2301
0.22uF
25V
IC2301
A8290SETTR-T
LNB
1
BOOST
3
TCAP
7
TDI
9
VREG
10
SDA
11
ADD
12
SCL
13
NC_2
14
IRQ
15
NC_3
16
NC_4
17
NC_5
18
NC_6
19
BFC
20
NC_7
21
NC_8
22
BFO
23
NC_9
24
BFI
25
VIN
26
LX
27
GNDLX
28
LNB
5
TDO
8
GND
6
EXTM
4
NC_1
2
VCP
29
[EP]
D2302
1000V
US1M(suzhou)
LNB
DCDC_GND and A_GND are connected in pin#27
LNB
Input trace widths should be sized to conduct at least 3A
close to Boost pin(#1)
57
DVB-S2 LNB Part Allegro
23
close to VIN pin(#25)
2A
DCDC_GND and A_GND are connected
3A
Ouput trace widths should be sized to conduct at least 2A
BCM35230
2.4A
Max 1.3A
(Option:LNB)
PCB_GND and A_GND are connected
2010.11.02
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