LG 32LV3400-SG (CHASSIS:LJ01M) Service Manual ▷ View online
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5.
5.
Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
1. Application range
This spec sheet is applied LCD TV with LJ01M/P/R chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 ºC ± 5 ºC
2) Relative Humidity: 65 ± 10 %
3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz)
2) Relative Humidity: 65 ± 10 %
3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz)
* Standard Voltage of each product is marked by models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
2) Demanded other specification
- Safety : UL, CSA, IEC specification
- EMC: FCC, ICES, IEC specification
- EMC: FCC, ICES, IEC specification
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
- 7 -
4. General Specification(TV)
No
Item
Specification
Remark
1
Receivable System
1) SBTV/NTSC/PAL-M/PAL-N
2
Available Channel
1) VHF : 02 ~ 13
2) UHF : 14 ~ 69
3) DTV : 07 ~ 69
4) CATV : 01 ~ 135
3
Input Voltage
1) AC 100 - 240V~ 50/60Hz
4
Market
Central and South AMERICA
5
Screen Size
19 inch Wide (1366 x 768)
19LV2500
22 inch Wide (1366 x 768)
22LV2500
26 inch Wide (1366 x 768)
26LV2500
32 inch Wide (1366 x 768)
32LV2500
32 inch Wide (1920 x 1080)
32LV3500, 32LV3400, 32LK450, 32LK430
37 inch Wide (1920 x 1080)
37LV3500
42 inch Wide (1920 x 1080)
42LV3500, 42LV3400 42LK450
47 inch Wide (1920 x 1080)
47LV3500
6
Aspect Ratio
16:9
7
Tuning System
FS
8
LCD Module
T260XW04-V9
HD, 60Hz
AUO 26LK330
T315XW03-VF HD,
60Hz
AUO
32LK330
LC320WXN-SCA2 LGD
LC320WXE-SCA1 LGD
VVX32H109G00 IPS
T315HW04-V9 FHD,
60Hz
AUO
32LK430
T315HW04-V9 FHD,
60Hz
AUO
32LK450
LC320WUN-SDA1 LGD
LC320WUE-SCA1 LGD
T315XW06-V3 HD,
60Hz
AUO
32LV2500
LC320EXN-SDA1 LGD
VVX32H110G00 IPS
LC320EUN-SDV2 FHD,
60Hz
LGD
32LV3400
V315H3-LE7 FHD,
60Hz
CMI
32LV3500
T315HW07-V8 AUO
LC320EUN-SDV2 LGD
LC370WUE-SCA1 FHD,
60Hz
LGD
37LK450
T370HW05-V1 FHD,
60Hz
AUO
37LV3500
LC370EUN-SDV2
LGD
T420HW09-V0 FHD,
60Hz
AUO
42LK450
LC420WUE-SCA2
LGD
LC420EUN-SDV3
FHD, 60Hz
LGD 42LV3400, 42LV3500
T420HW08-V1
FHD, 60Hz
AUO 42LV3500
LC470WUE-SCA2 FHD,
60Hz
LGD
47LK450
LC470EUE-SDV1 FHD,
60Hz
LGD
47LV3500
M185XW01-VD HD,
60Hz
AUO
19LV2500
M215HGE-L10 FHD,
60Hz
CMI
22LV2500
M215HW01-VB AUO
T260XW06-V3 HD,
60Hz
AUO
26LV2500
LC260EXN-SDA1 LGD
9
Operating Environment
Temp : 0 ~ 40 deg
Humidity : ~ 80 %
10
Storage Environment
Temp : -20 ~ 60 deg
Humidity : -85 %
- 8 -
5. Chrominance & Luminance (32LV3500-SG, 32LV3400-SG)
No
Item
Min
Typ
Max
Unit
Remark
1
Max Luminance
Module
290
360
cd/m
2
LGD
(Center 1-point /
320
400
AUO
Full White Pattern)
360
450
CMI
SET
250
320
cd/m
2
LGD
280
360
AUO
310
400
CMI
2
Luminance uniformity
1.3
3
Color coordinate
RED
X
Typ.
0.637
Typ.
LGD
-0.03
0.630
+0.03
AUO
0.635
CMI
Y
0.341
LGD
0.330
AUO
0.323
CMI
GREEN
X
0.320
LGD
0.320
AUO
0.288
CMI
Y
0.606
LGD
0.620
AUO
0.600
CMI
BLUE
X
0.152
LGD
0.150
AUO
0.148
CMI
Y
0.055
LGD
0.040
AUO
0.050
CMI
WHITE
X
0.279
LGD
0.280
AUO
0.280
CMI
Y
0.292
LGD
0.290
AUO
0.290
CMI
3. Contrast
ratio
1000
1400
LGD
3200
4000
AUO
3500
5000 CMI
4.
Color Temperature
Cool
0.254
0.269
0.284
<Test Condition>
0.258
0.273
0.288
* The W/B Tolerance is ± 0.015 for
Standard 0.270
0.285
0.300 Adjustment
0.278 0.293 0.308
Warm 0.298
0.313
0.324
0.314 0.329 0.344
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