LG 32LV2500-DG (CHASSIS:LT01M) Service Manual ▷ View online
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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5.
5.
Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
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SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
This specification is applied to LCD TV used LT01P chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature : 25 ºC ± 5 ºC
2) Relative Humidity : 65 ± 10 %
3) Power Voltage : Standard input voltage (100-240V~50/60Hz)
2) Relative Humidity : 65 ± 10 %
3) Power Voltage : Standard input voltage (100-240V~50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
2) Demanded other specification
- Safety: CE / ICE / BSMI specification
EMI: CE / ICE / BSMI
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4. General Specification(TV)
No
Item
Specification
Remark
1
Screen Size
26 inch
T260XW04-V9(AUO)
31.5 inch
T315XW03-VF(AUO)
T315XW06-VD(AUO)
31.55 inch
T315HW04 V9(AUO)
LC320EUN-SDV2(LGD)
LC320WUN-SCA2(LGD)
31.51inch
LC320EXN-SDA1(LGD)
LC320WXN-SCA2(LGD)
32inch T315HW07-V8(AUO)
37inch
LC370WUE-SCA1(LGD)
LC370EUN-SDV2(LGD)
42inch LC420WUE-SCA2(LGD)
T420HW08-V1(AUO)
42.02inch LC420EUN-SDV3(LGD)
46.96inch LC470EUE-SDV1(LGD)
2
LCD Module
26" Color WXGA TFT-LCD Module
T260XW04 V9(AUO)
31.5" Color WXGA TFT-LCD Module
T315HW04 V9,
T315XW03-VF(AUO)
T315XW06 VD(AUO-CI)
32” Color WXGA TFT-LCD Module
T315HW07-V8(AUO)
31.55” Color WUXGA TFT-LCD Module
LC320EUN-SDV2
LC320WUN-SCA2(LGD)
31.51” Color WXGA TFT-LCD Module
LC320EXN-SDA1
LC320WXN-SCA2(LGD)
37” Color WUXGA TFT-LCD Module
LC370WUE-SCA1
LC370EUN-SDV2(LGD)
42” Color WUXGA TFT-LCD Module
LC420WUE-SCA2(LGD)
42.02” Color WUXGA TFT-LCD Module
LC420EUN-SDV3(LGD)
42” Color WUXGA TFT-LCD Module
V420H2-LE5(CMI)
42” Color WUXGA TFT-LCD Module
T420HW08 V1(AUO)
T420HW08 V9(AUO CI)
46.96” Color WUXGA TFT-LCD Module
LC470EUE-SDV1(LGD)
3
Operating Environment
Temp : 0 ~ 50 deg
Humidity :10 ~ 90 %
4
Storage Environment
Temp : -20 ~ 60 deg
Humidity : 10 ~ 90 %
5
Input Voltage
AC100 ~ 240V, 50/60Hz
All
6
Power Consumption
90W
26”
HD(CCFL)
T260XW04 V9(AUO)
65W
32”
HD(LED)
LC320EXN-SDA1(LGD)
105W
31.5”
HD(CCFL)
T315XW03-VF(AUO)
105W
31.51”
HD(CCFL)
LC320WXN-SCA2(LGD)
105W
32”
FHD(CCFL)
T315HW04 V9(AUO)
61W
32”
FHD(LED)
T315HW07-V8(AUO)
70W
31.55”
FHD(LED)
LC320EUN-SDV2(LGD)
105W
31.55”
FHD(EEFL)
LC320WUN-SCA2(LGD)
150W
37”
FHD(EEFL)
LC370WUE-SCA1(LGD)
80W
37”
FHD(LED)
LC370EUN-SDV2(LGD)
175W
42”
FHD
LC420WUE-SCA2(LGD)
85W
42”
FHD
T420HW08 V1(AUO)
110W
42.02”
FHD
LC420EUN-SDV3(LGD)
130W
46.96”
FHD
LC470EUE-SDV1(LGD)
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No
Item
Specification
Remark
8
LCD Module
Maker
Inch
(H)x(V)x(D)
Unit: mm
(Outline Demension)
AUO
26”
626.0 (H) x 373.0 (V) x 43.5 (D)
T260XW04 V9(AUO)
LGD
32”
735.4 (H) x 433.0 (V) x 10.8 (D)
LC320EXN-SDA1(LGD)
LGD
31.51”
760.0 (H) x 450.0 (V) x 43.0 (D)
LC320WXN-SCA2(LGD)
AUO
32”
760.0 (H) x 450.0 (V) x 46.9 (D)
T315XW03-VF(AUO)
AUO
31.5”
735.4 (H) x 433.8 (V) x 10.8 (D)
T315XW06 VD(AUO CI)
AUO
32”
760.0 (H) x 450.0 (V) x 46.9 (D)
T315HW04 V9(AUO)
AUO
32”
735.4 (H) x 433.0 (V) x 20.9 (D)
T315HW07-V8(AUO)
LGD
31.55”
735.4 (H) x 433.0 (V) x 23.6 (D)
LC320EUN-SDV2(LGD)
LGD
31.55”
760.0 (H) x 450.0 (V) x 48.0 (D)
LC320WUN-SCA2(LGD)
LGD
37”
877.0 (H) x 516.8 (V) x 36.4 (D)
LC370WUE-SCA1(LGD)
LGD
37”
856.4 (H) x 501.0 (V) x 23.6 (D)
LC370EUN-SDV2(LGD)
LGD
42”
983.0 (H) x 576.0 (V) x 46.0 (D)
LC420WUE-SCA2(LGD)
LGD
42.02”
968.4 (H) x 564.0 (V) x 18.3 (D)
LC420EUN-SDV3(LGD)
AUO
42”
968.4 (H) x 576.0 (V) x 25.1 (D)
T420HW08 V1(AUO),
T420HW08 V9(AUO CI)
CMI
42”
968.4 (H) x 564.0 (V) x 10.8 (D)
V420H2-LE5(CMI)
LGD
46.96”
1078.6 (H) x 626.0 (V) x 22.9 (D)
LC470EUE-SDV1(LGD)
5. LCD Module
5.1. 26” LCD Module (AUO) T260XW04-V9
No.
Item Specification
Min.
Typ.
Max.
Remark
1.
Viewing Angle<CR>10>
Right/Left/Up/Down
89/89/89/89
CR > 10
Luminance (cd/m
2
)
360 450
2.
Luminance
Variation -
1.3
3.
Contrast Ratio
CR
2400
3000
All white/ All black
White WX
0.280
WY Typ
0.290
Typ
RED Xr
-
0.03
0.640
+0.03
4.
CIE Color Coordinates
Yr
0.330
Green Xg
0.281
Yg
0.590
Blue Xb
0.150
Yb
0.050
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