LG 32CL20-UA (CHASSIS:LA92A) Service Manual ▷ View online
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5.
5.
Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. Electrical specification
4.1 General Specification
1. Application range
This specification is applied to the LCD TV used LA92A
chassis.
chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC
2) Relative Humidity : 65±10%
3) Power Voltage : Standard input voltage(100~240V@50/60Hz)
2) Relative Humidity : 65±10%
3) Power Voltage : Standard input voltage(100~240V@50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
2) Demanded other specification
- Safety: UL, CSA, IEC specification, CE
- EMC: FCC, ICES, IEC specification, CE
- EMC: FCC, ICES, IEC specification, CE
No
Item Specification
Remark
1
Receiving System
ATSC/ NTSC-M
2
Aspect Ratio
16:9
3
LCD Module
LC320WXN-SBA1
LGD(V4)
32CL20-UA
4
Available Channel
1) VHF : 02 ~ 13
2) UHF : 14 ~ 69
3) DTV : 02 ~ 69
4) CATV : 01 ~135
5) CADTV : 01 ~ 135
5
Operating Environment
Temp.:0 ~ 40 deg
Humidity : ~ 80 %
6
Storage Environment
Temp.:-20 ~ 60 deg
Humidity : ~ 85 %
7
Input Voltage
AC100 ~240V,50/60Hz
8
Tuning system
FS
4.2 EyeQ-Green Motion Characters.
Ambient
Calculative Sensor
Backlight UI
Contrast
Brightness
Sharpness
Color
Illumination Illumination
500 300 100 100 50 70
70
300
180 55
90
50
62
50
200 120 25 90 50 58
54
50 42 0 90
50 52
65
- 7 -
5 Safety and Regulation
No
Item Min
Typ
Max
Unit
Remark
1. Force Stability –Incline Plane Tip Test
10
deg
IEC60065
2. Force Stability –Level Tip Test
weigthx 0.13x9.8
N
3. Isolation Gap,AC-AC
3
mm
4. Isolation Gap,AC-DC
3
mm
5. Isolation Gap,Primary <-> GND
3
mm
Isolation Gap,Primary <-> Secondary
6.0
mm
6. Power Consumption,Max
259W
42CL40-UA
(1/8W non-clipped
max.audio signal &Input voltage
International VideoSignal)
7. Power Consumption,Stand by (Input
0.5
1W
(ST-BY power saving circuit)
8. Power Consumption,Switch off
0.02 W
9. Energy
Saving Off
100
%
<Test Condition>
Minimum
65
75
85
%
Full white pattern
Medium 43
53
63
%
Maximum 17
27
37 %
Screen Off
15
%
10. OPC Black luminance
75
%
150 Gray Input
<Test Condition>
difference of OPC
-white No Luminance
Vivid mode,4% window white pattern
on/off mode
difference
*255 Gray Input Case:white/black
No Luminance difference
11. Dielectric Voltage
GND
1500 V/min at 100mA
1.5KV
IEC60065
SIGNAL
3000 V/min at 100mA
3KV
12. Isolation Resistance
4
∞
M
Ω
13. Leakage Current
0.35
mA rms
14. UL Compliance
Safety
UL1492
EMC
FCC Class B
15. CSA Compliance
Safety
CSA C22.2.
EMC
IC Class B
6. DIGITAL Part
No Item Standard
Unit
Remark
1.
VSB Receiving
CH.2 ~69CH
1 ~135CH(CATV)
1 ~135CH(CADTV))
2.
Video Resolution
ATSC 18 FORMAT
3.
Audio Bit Resolution
32,40,48,56,64,80,96,112,128,160,
Kbps
192,224,256,320,384,448,512,576,640
4.
VSB RF Input
75
Ω
unbalanced, F type Connector input
5.
Sync Stable Time
Under 3.0
<None>SEC
- 8 -
7. Chroma& Brightness
7.1 Module optical specification
7.2Max Luminance &Contrast measure standard specification
- Max Luminance measure specification
1) In non-impressed condition, measure peak brightness displayable as much as possible LCD module.
2) Measuring instrument: CA-210 or a sort of Color Analyzer.
3) Pattern Generator :VG- 828 or a sort of digital pattern generator (displayable Full White &1/25 White Window pattern)
4) Measure condition
• Test pattern: in center,1/5(H)*1/5(V) of Window Pattern (white pattern in non-impressed condition)
• SET condition: Contrast &Brightness Level 100%
• Environment condition : Dark room in the non outside light
• Video menu option condition
1) In non-impressed condition, measure peak brightness displayable as much as possible LCD module.
2) Measuring instrument: CA-210 or a sort of Color Analyzer.
3) Pattern Generator :VG- 828 or a sort of digital pattern generator (displayable Full White &1/25 White Window pattern)
4) Measure condition
• Test pattern: in center,1/5(H)*1/5(V) of Window Pattern (white pattern in non-impressed condition)
• SET condition: Contrast &Brightness Level 100%
• Environment condition : Dark room in the non outside light
• Video menu option condition
5) Measurement
• Do heat-run LCD module at 30minutes in normal temperature (25°C)by using full white pattern of 15%signal level(38 gray level).
• Impress test pattern signal in 1/5(H)*1/5(V)White Window of 100%(255Gray Level)
• measure 3 times brightness of central white window,and mark peak brightness in max brightness degree
• measure the same condition in video signal /RGB signal.
• Do heat-run LCD module at 30minutes in normal temperature (25°C)by using full white pattern of 15%signal level(38 gray level).
• Impress test pattern signal in 1/5(H)*1/5(V)White Window of 100%(255Gray Level)
• measure 3 times brightness of central white window,and mark peak brightness in max brightness degree
• measure the same condition in video signal /RGB signal.
- Luminance uniformity measure specification
1) Impress 100%(255Gray Level) full white pattern at the same peak brightness measurement.
2) Measure average brightness in 5 points.
1) Impress 100%(255Gray Level) full white pattern at the same peak brightness measurement.
2) Measure average brightness in 5 points.
Signal
Picture Mode
Dynamic Contrast
Dynamic Color
Black Level
OPC
RF
NTSC-M
Vivid
High High Low
Off
AV NTSC-J Vivid
High
High High
Off
Component 720P
Vivid
High
High
High
Off
RGB 1024x768
Vivid
High
NA
NA
Off
HDMI DTV
720P
Vivid
High
High
Low
Off
No.
Item Specification
Min.
Typ.
Max.
Remark
1.
Max Luminance
Modele
400
500
cd/m2
(Center1-point/ Ful white pattern)
2.
Luminance uniformity
Luminance
77
3. Contrast Ratio
1000: 1
1300: 1
40000: 1(DCR) 50000:1(DCR)
4.
Color Coordinates
WX
Typ
0.279
Typ
White
WY
-0.03
0.292
+0.03
Xr
0.639
RED
Yr
0.333
Xg 0.292
Green
Yg 0.604
Xb 0.145
Blue
Yb
0.062
5. Color
Temperatue
Cool
Typ
0.276
Typ
85% Full white pattern
-0.015
0.283
+0.015
**The W/B Tolerance is
Medium
0.285
± 0.015 for Adjustment
0.293
Dynamic contrast :off
Warm
0.313
Dynamic color :off
0.329
Energy saving mode :off
6.
Color Distortion, DG
10.0
%
7.
Color Distortion,DP
10.0 deg
8.
Color S/N,AM/FM
43.0
dB
9.
Color Killer Sensitivity
-80
dB
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