LG 26LH1DC1 Service Manual ▷ View online
-5-
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the
5. Inspect (on the circuit board copper side) the solder joints of the
two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION : Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION : Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION : Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
-6-
Item
Specification
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
1.1 This spec sheet is applied all of the 26" LCD TV with PPV&PILLOW SPEAKER.
1.2 Not included spec and each product spec in this spec sheet apply correspondingly to thefollowing each country standard and
1.2 Not included spec and each product spec in this spec sheet apply correspondingly to thefollowing each country standard and
requirement of Buyer.
2. Specification
Each part is tested as below without special appointment.
2.1 Temperature : 20
±
5°C
2.2 Relative Humidity : 65
±
10%
2.3 Power Voltage : input voltage(100~240V@50/60Hz)
* Standard Voltage of each product is marked by models.
2.4 Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM.
2.5 The receiver must be operated for about 20 minutes prior to the adjustment.
2.5 The receiver must be operated for about 20 minutes prior to the adjustment.
3. General Specification(TV)
Input Signal
Receiving System
Digital : ATSC/64&256QAM, Analog : NTSC
Sound Effect
Dolby Digital(AC-3)
Available Channel
Air
CH2~CH69
Cable
CH1~CH135
Input Voltage
AC 100~240V(50/60Hz)
Market
Screen Size
26 inch Wide
Aspect Ratio
16:9
Tuning System
FS
LCD Module
LC260WX2-SLB2
LPL
LC260WX2-SLB1
LPL
LC260WX2-SLA1
LPL
Video
Stream Compression
MPEG2 MP@HL
Receiving Signal
8VSB, Clear QAM(64, 256), NTSC
Display Interface
LVDS 1366X768
Digital Comb-filter
Support : 3D Y/C-NTSC Signal
Audio
Demodulation
Dolby Digital(AC3)
Speaker Power
RMS 7.5W+7.5W(8Ω load)
Antenna
Impedance
75Ω Unbalanced, F-Type Jack, VHF/UHF Tuner
External Input
AV Input
CVBS : 3, L/R Audio : 3, Auto-Cam port(AV2)
S-Video Input
Y/C : 1
Component Input
YPbPr(480i~1080i) : 2, L/R Audio : 2
PC Input
D-sub15(Max 1366X768 pixel, 60Hz), Phone Jack(Audio)
HDMI Input
480i, 480p, 720p, 1080i
Service Port
DSUB 9P Jack(RS-232)
PILLOW SPEAKER Input
DIGITAL PILLOW SPEAKER
MPI Input
RJ11 Jack
Digital Audio Output
SPDIF(Optical)
Function
OSD Language
English, Spanish, French
Program Guide
MINI-EPG
Digital Noise Reduction
Support
Caption
EIA608, EIA708
Channel Add/Delete
Support
Channel Preview
Support
Signal strength Display
Support
PPV&PRO : IDIOM
Support
-7-
Item
Min
Typ
Max
Unit
Remark
Dynamic Range
-82
-5
dBm
2CH, 3CH, UHF : -80dBm
White Noise(SNR)
15.5
dB
Channel Pull-in Range
-250
250
KHz
N/D Co-channel
DTV(-30dBm)
5
dB
Ps=7Db , Color Bar
400Hz, 25kHz Dev
400Hz, 25kHz Dev
DTV(-60dBm)
5
dB
N/D Upper Adj-Ch
PS=75Db, Color Bar
PS=75Db, Color Bar
DTV(-60dBm)
35
42
dB
400Hz, 25kHz Dev
N/D Lower Adj-Ch
PS=75Db , Color Bar
N/D Lower Adj-Ch
PS=75Db , Color Bar
DTV(-60dBm)
35
42
dB
400Hz, 25kHz Dev
<TEST EQUIPMENT>
Ensemble Ghost
A~G
OK
ROHDE & SCHWARZ
(ATTC recommend)
TV TEST TRANSMETER
Static Ghost
0°
2
(0.1usec)
90°
2
dB
180°
2
Static Ghost
0°
2
(0.2usec)
90°
2
dB
180°
2
Static Ghost
0°
2
(0.3usec)
90°
2
dB
180°
2
Static Ghost
0°
2
(1.0usec)
90°
2
dB
180°
2
Static Ghost
0°
2
(5.0usec)
90°
2
dB
180°
2
Doppler Ghost
0.2Hz
4
(0.1 usec)
0.5Hz
4
1.0Hz
4
dB
2.0Hz
4
5.0Hz
4
Doppler Ghost
0.2Hz
4
(0.2 usec)
0.5Hz
4
1.0Hz
4
dB
2.0Hz
4
5.0Hz
4
Item
Specification
Unit
Remark
4. DTV Characteristics
4.1 General Specification
4.2 Digital Receive Part : 8T VSB Standard
VSB Reception Channel
2 ~ 69CH(DTV)
QAM Reception Channel
1 ~ 135CH(CADTV)
Video Resolution
ATSC 18 FORMAT
QAM Resolution
Sanoff OpenCable FORMAT
VSB / QAM RF Input
75Ω unbalanced input
F-type CONNECTOR input
F-type CONNECTOR input
CH UP/DOWN :
Under 3.0
Sec.
Time for stable Sync
RF Dynamic Range
RF Dynamic Range
0~-80
dBm
VSB AFC Range
Fo +/-250
KHz
QAM AFC Range
Fo +/-170
KHz
-8-
Content
Unit
Spec
Remark
Min
Typ
Max
VIDEO
Item
Min
Typ
Max
Unit
Remark
Doppler Ghost
0.2Hz
4
(0.3 usec)
0.5Hz
4
(1.0 usec)
1.0Hz
4
dB
(5.0 usec)
2.0Hz
4
5.0Hz
4
Item
Min
Typ
Max
Unit
Remark
Dynamic Range
64 QAM
-69.0
-32.0
dBm
256 QAM
-63.0
-32.0
dBm
White Noise(SNR)
64 QAM
27
dB
Input RF Level : -50.0 dBm
256 QAM
34
dB
Channel Pull-in Range (64/256 QAM)
-170
170
KHz
N/D Upper Adj-Ch
64 QAM
21
dB
DTV(-40dBm)
PS=75Db, Color Bar
400Hz, 25kHz Dev
400Hz, 25kHz Dev
256 QAM
16
dB
DTV(-40dBm)
4.3 Digital Receive Part : 64/256 QAM
Input
CVBS
1V
480i
-Active Video
mV
644
714
786
-Sync
258
286
314
S-Video
1V
-Active Video
mV
644
714
786
-Sync
258
286
314
-Color Burst
258
286
314
Component
1V
480i/480p/720p/1080i
-Y/Pb/Pr
mV
630
700
770
-Sync
270
300
330
RGB Input
DTV : 480i/480p/720p/1080i
-R/G/B
mV
630
700
770
PC : *See 5. Signal Timing
-H/V
TTL
4.4 Video Inputs
4.5 Audio
Content
Unit
Spec
Remark
Min
Typ
Max
AUDIO (Dolby Digital 2CH Out)
OPTICAL
UI(EYE PATTERN)
%
20
IEC958 COMPOSITE AC-3
OUTPUT
CATEGORY
64(HEX)
CODE
ANALOG
REF. LEVEL
@1kHz, -20dBFs
AUDIO
-LEFT
mVrms
200
OUT
-RIGHT
200
MAX. LEVEL
-LEFT
-LEFT
Vrms
2
-RIGHT
2
SEPERATION
-LEFT
-LEFT
dB
-60
-RIGHT
-60
FREQ.
@20Hz~20kHz
RESPONSE
-19.5
-21
@ 0.5dB ~ -1.0dB
-LEFT
dB
-RIGHT
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