DOWNLOAD LG 20HIZ20 (CHASSIS:LP69F) Service Manual ↓ Size: 1.54 MB | Pages: 30 in PDF or view online for FREE

- 5 -

IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.

Removal
1.  Desolder and straighten each IC lead in one operation by gently

prying up on the lead with the soldering iron tip as the solder
melts.

2.  Draw away the melted solder with an anti-static suction-type

solder removal device (or with solder braid) before removing the
IC.

Replacement
1.  Carefully insert the replacement IC in the circuit board.
2.  Carefully bend each IC lead against the circuit foil pad and

solder it.

3.  Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement
1.  Remove the defective transistor by clipping its leads as close as

possible to the component body.

2.  Bend into a "U" shape the end of each of three leads remaining

on the circuit board.

3.  Bend into a "U" shape the replacement transistor leads.
4.  Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.

Power Output, Transistor Device
Removal/Replacement
1.  Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3.  Carefully remove the transistor from the heat sink of the circuit

board.

4.  Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6.  Replace heat sink.

Diode Removal/Replacement
1.  Remove defective diode by clipping its leads as close as

possible to diode body.

2.  Bend the two remaining leads perpendicular y to the circuit

board.

3.  Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.

4.  Securely crimp each connection and solder it.
5.

Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.

Fuse and Conventional Resistor
Removal/Replacement
1.  Clip each fuse or resistor lead at top of the circuit board hollow

stake.

2.  Securely crimp the leads of replacement component around

notch at stake top.

3.  Solder the connections.

CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.

At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).

1.  Carefully remove the damaged copper pattern with a sharp

knife. (Remove only as much copper as absolutely necessary).

2.  carefully scratch away the solder resist and acrylic coating (if

used) from the end of the remaining copper pattern.

3.  Bend a small "U" in one end of a small gauge jumper wire and

carefully crimp it around the IC pin. Solder the IC connection.

4.  Route the jumper wire along the path of the out-away copper

pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.

At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.

1.  Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.

2.  Trace along the copper pattern from both sides of the pattern

break and locate the nearest component that is directly
connected to the affected copper pattern.

3.  Connect insulated 20-gauge jumper wire from the lead of the

nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

- 6 -

NOTE : Specifications and others are subject to change without notice for improvement.

NO

Item

Content

Remark

1

User Model Name

20LS1RH-ZK : PAL/SECAM (EU)

2

Feature

20.1” LCD TV

3

Chassis Name

LP 69F

4

General Scope

External SW

PR(

D

/

E

), VOL(

F

/

G

), OK, MENU, INPUT, POWER

8Keys

& Adj.

5

Power Cord

Length : 1.87±0.05 M

NATION

Shape  : Wall-out,

Color  : BLACK

6

Power Adapter

No

7

LCD Module Feature

Type

TFT Color LCD Module

Active Display Area

640(H) x 480(V)

Pixel Pitch [mm]

0.6375mm(H) x 0.2125mm(V) x RGB

Electrical interface

TTL

LPL

Color Depth

8BIT, 16.7M colors

P/N : 

Size [mm]

432(W) x 331.5(H) x 25.0(D)

EAJ30338001

Surface Treatment

Hard Coating(3H) & Anti Glare

treatment of the front polarizer

Operating Mode

Normally Black

Back light Unit

6 CCFL (6 lamps)

R/T

Typ

25ms(R.T : 12ms + F.T. : 13ms)

No.

1

Product Dimension

Width (W)

Length (D)

Height (H)

Before Packing

573.2

189.7

453.5

After Packing

635

177

470

2

Product Weight

Only SET

6.9kg(LPL)

With BOX

8.7kg(LPL)

3

Container

Individual or Palletizing

20ft

40ft

Loading

Indi.             Wooden

Indi.

Wooden

Quantity

546                 480

1118

1008

4

Stand  Assy

Type

Base detachable

Size (W x D x H)

399.9(W) x 189.7(D) x 67.4(H)

Tilt Degree

-3(-0/+3) ~ +10(±2) dgree

Tilt force

Target 1.5Kgf (0.8Kgf ~ 2.0Kgf)

Swivel Degree

—NON

Swivel Force

—NON

5

Appearance

General 

Refer to Standard of LG(55)G1-1020

Item

Content

- 7 -

No

Item

Condition

1

Power

Off

2

Volume Level

30

3

Main Picture Input

TV

4

Main Last Channel

Pr 01

5

Mute

Off

6

STATION

Auto Programme

To set

System

Storage from

Search

Manual Programme

To set

Storage

System

Band

Channel

Fine

Search

Name

Programme Edit

To set

Favourite Programme

Off

7

PICTURE

PSM

Dynamic

Standard

Mild

Game

User

Contrast

100

Brightness

50

Colour

60

Sharpness

50

Tint

0

CSM

Cool

Normal

Warm

User

Red

0

Green

0

Blue

0

XD

Auo

Manual

Reset

To set

8

SOUND

SSM

Flat, Music, Movie, Sports, User

AVL

Off

Balance

0

9

TIME

Time

-- : --

Off time

-- : -- Off

On time

-- : --

Pr.1

Vol. 30

Off

Auto sleep

Off

10

SPECIAL

Language

English

16 Language

Country

Others

30 Teletext Language

Child Lock

Off

XD Demo

To start

- 8 -

No

Item

Specification

Remark

Min

Tpy

Max

1

Viewing Angle 

R/L

89/89

<CR≥10>

U/D

89/89

2

Luminance

Luminance (cd/m

2

)

250

320

PSM : Dynamic, CSM: Cool

White luminance uniformity

75%

80%

3

Contrast Ratio

CR

500

600

All white/ All black

4

CIE Color Coordinates

White

Wx

0.298

0.313

0.328

In AV input

(Warm)

Wy

0.314

0.329

0.344

PSM : Dynamic

White

Wx

0.268

0.283

0.298

(85 IRE)

(Normal)

Wy

0.283

0.298

0.313

White

Wx

0.259

0.274

0.289

(Cool)

Wy

0.271

0.286

0.301