DOWNLOAD LG 19LS4R (CHASSIS:LP69C) Service Manual ↓ Size: 4.36 MB | Pages: 35 in PDF or view online for FREE

Model
19LS4R (CHASSIS:LP69C)
Pages
35
Size
4.36 MB
Type
PDF
Document
Service Manual
Brand
Device
TV / LCD
File
19ls4r-chassis-lp69c.pdf
Date

LG 19LS4R (CHASSIS:LP69C) Service Manual ▷ View online

- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1.  Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2.  Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1.  Carefully insert the replacement IC in the circuit board.
2.  Carefully bend each IC lead against the circuit foil pad and
solder it.
3.  Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1.  Remove the defective transistor by clipping its leads as close as
possible to the component body.
2.  Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3.  Bend into a "U" shape the replacement transistor leads.
4.  Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1.  Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3.  Carefully remove the transistor from the heat sink of the circuit
board.
4.  Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6.  Replace heat sink.
Diode Removal/Replacement
1.  Remove defective diode by clipping its leads as close as
possible to diode body.
2.  Bend the two remaining leads perpendicular y to the circuit
board.
3.  Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4.  Securely crimp each connection and solder it.
5.
Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1.  Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2.  Securely crimp the leads of replacement component around
notch at stake top.
3.  Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1.  Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2.  carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3.  Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4.  Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1.  Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2.  Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3.  Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
- 6 -
1. Application range
This specification is applied to the 19”/ 22” Wide LCD TV used
LP69C chassis.
2. Requirement for Test
Testing for standard of each part must be followed in below
condition.
(1) Power : Standard input voltage (100-240V~, 50/60Hz)
*Standard Voltage of each products is marked by models.
(2) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
(3) The receiver must be operated for about 20 minutes prior
to the adjustment.
3. Test method
(1) Performance : LGE TV test method followed
(2) Demanded other specification
Safety : CE, IEC Specification
EMC : CE, IEC
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. General Specification(TV)
No
Item
Specification
Remark
1
Video input applicable system
PAL-D/K, B/G, I, SECAM L, NTSC, NTSC. 4.43
(ZA)
2
Receivable Broadcasting System
PAL/SECAM BG
(ZA/TA)
PAL/SECAM DK
EU/Non-EU
PAL I/I
(PAL Market)
SECAM L/L’
3
RF Input Channel
VHF    : E2 ~ E12
PAL
UHF    : E21 ~ E69
CATV   : S1 ~ S20
HYPER  : S21~ S41 
L/L’   : B, C, D
FRANCE
4
Input Voltage
100-240V~, 50/60Hz 
5
Market
EU
6
Tuning System
FVS 100 program
PAL, 200 PR.(Option)
FS
NTSC
7
Operating Environment
Temp  : 0 ~ 40 deg
Humidity : 10~90 %RH
8
Storage Environment
Temp  : -20 ~ 50 deg
Humidity : 10~90 %RH
9
Display
LCD Module
1
Viewing Angle
R/L
85/85
<CR≥10>
U/D
80/80
2
Luminance
Luminance (cd/m2)
190
250
PSM:Dynamic, CSM:Cool, White(100 IRE)
3
Contrast Ratio
CR
500
850
All white / All black
4
CIE Color Coordinates
WHITE
Wx
Typ.
0.285
Typ.
Wy
-0.015
0.293
+0.015
PSM : Dynamic
RED
Rx
0.640
CSM : Cool
Ry
0.334
White
GREEN
Gx
0.286
(85 IRE)
Gy
0.599
BLUE
Bx
0.154
By
0.077
5. Module Specification
5.1. 19” LCD MODULE (CMO M190A1-L02)
5.2. Electro optical characteristic specifications(module standard)
- 7 -
1. 
Display area
410.4 (H) *265.5 (V)
mm
2. 
Outline dimension
427.2 (H) x 277.4 (V) x 17.0 (D)
mm
Typ
3. 
Number of Pixels
1440 (H) x 900 (V)
1Pixel=3RGB Cells
4. 
Cell pitch
0.285mm (H) x 0.285mm (V)
mm
1Pixel=3RGB Cells
5. 
Color arrangement
RGB vertical stripe
6. Weight(net)
2.5
Kg
Max
7. 
Operating Environment
Temperature
0  ~  50
deg
Humidity
10 ~    90
%
8
Storage Environment
Temperature
-20  ~  60
deg
Humidity
10  ~  90
%
9
Electrical Interface
LVDS
10
Back light Unit
4 CCFL (4 lamps)
11
R/T
5ms
Typ.
No.
Item
Min
Typ.
Max
Unit
Remark
No.
Item
Specification
Min
Typ.
Max
Remark
- 8 -
7. Component Video Input  (Y, PB, PR)
No
Resolution
H-freq(kHz)
V-freq.(kHz)
Pixel clock(MHz)
Proposed
720*480
15.73
59.94
13.500
SDTV, DVD 480I(525I)
2
720*480
15.75
60.00
13.514
SDTV, DVD 480I(525I)
3
720*576
15.625
50.00
13.500
SDTV, DVD 576I(625I)
4
720*480
31.47
59.94
27.000
SDTV 480P
5
720*480
31.50
60.00
27.027
SDTV 480P
6 720*576
31.25
50.00
27.000
SDTV 
576P
7 1280*720
44.96
59.94
74.176
HDTV 
720P
8 1280*720
45.00
60.00
74.250
HDTV 
720P
1280*720
37.50
50.00
74.250
HDTV 720P 50Hz
10 1920*1080
33.72
59.94
74.176
HDTV 
1080I
11 1920*1080
33.75
60.00
74.250
HDTV 
1080I
12
1920*1080
28.125
50.00
74.250
HDTV 1080I 50Hz
8. RGB Input (PC)
No
Resolution
H-freq(kHz)
V-freq.(Hz)
Pixel clock(MHz) Proposed
Remark
1
720*400
31.469
70.08
28.32
DOS
2
640*480
31.469
59.94
25.17
VESA(VGA)
3
640*350
31.468
70.090
25.175
DOS
4
800*600
37.879
60.31
40.00
VESA(SVGA)
5
1024*768
48.363
60.00
65.00
VESA(XGA)
6
1280*1024
63.981
60.02
108.0
VESA(WXGA)
7
1440*900
55.5
59.90
88.75
WXGA+
19LS4R-ZA only
8
1680*1050
65.290
59.954
146.25
WXGA+
22LS4R-ZA only
6. Model Specification
No
Item
Specification
Remark
1.
Market
EU
2.
Broadcasting system
PAL BG/I/DK, SECAM-L/L’,
SECAM BG/DK
3
RF Input Channel
VHF    : E2 ~ E12
PAL
UHF    : E21 ~ E69
CATV   : S1 ~ S20
HYPER  : S21~ S41
L/L’ : B, C, D
FRANCE
4.
SCART Jack(1EA)
PAL, SECAM, NTSC
5.
Video Input (1EA)
PAL, SECAM, NTSC
4 System(Rear) :PAL50, SECAM, NTSC, PAL60
6.
S-Video Input (1EA)
PAL, SECAM, NTSC
4 System(Rear) : PAL50, SECAM, NTSC, PAL60
7.
Component Input (1EA)
Y/ Pb/Pr
480i/576i/480P/720P/1080i
8.
RGB Input (1EA)
RGB-PC, RGB-DTV
9.
HDMI Input (1EA)
HDMI-PC
HDMI-DTV
10.
Audio Input (3 EA)
3EA : CVBS, Scart, PC Audio
L/R Input
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