LG 17LS5R (CHASSIS:LP68A) Service Manual ▷ View online
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5.
5.
Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
- 6 -
SPECIFICATION
1. General Specification
NOTE : Specifications and others are subject to change without notice for improvement.
NO
Item
Content
Remark
1
User Model Name
17LS5R-ZA : PAL/SECAM (EU)
2
Feature
17” LCD TV
3
Chassis Name
LP68A
4
General Scope
External SW
PR(
D
/
E
), VOL(
F
/
G
), OK, MENU, INPUT, POWER
8Keys
& Adj.
5
Power Cord
Length : 1.87±0.04 M
NATION
Shape : Wall-out,
Color : BLACK
6
Power Adapter
No
7
LCD Module Feature
Maker
AUO
Type
TFT Color LCD Module
Active Display Area
17.0 inches(432mm) diagonal(Aspect 4:3)
Pixel Pitch [mm]
0.264mm(H) x 0.264mm(V)
Electrical interface
LVDS
Color Depth
6BIT WITH FRC, 16.2M colors
Size [mm]
385.5(W) x 396.5(H) x 15.8(D) Max
Surface Treatment
Hard Coating(3H) & Anti Glare (HAZE 3%)
Operating Mode
Normally Black
Back light Unit
4 CCFL (6 lamps)
R/T
Typ
5ms(Typ), 9ms(Max)
No.
1
Product Dimension
Width (W)
Length (D)
Height (H)
Before Packing
463.3
166.3
353.5
After Packing
527
175
470
2
Product Weight
Only SET
3.94 kg(CPT)
With BOX
5.04 kg(CPT)
3
Container
Individual or Palletizing
20ft
40ft
Loading
Indi. Wooden
Indi.
Wooden
Quantity
858 720
1716
1584
4
Stand Assy
Type
Base detachable
Size (W x D x H)
302.2 x 166.3 x 68
Tilt Degree
-3º(-0/+3º) ~ +10º(±2)
Tilt force
Target 1.5Kgf (0.8Kgf ~ 2.0Kgf)
Swivel Degree
- NON
Swivel Force
- NON
5
Appearance
General
Refer to Standard of LG(55)G1-1020
Item
Content
Remark
2. Mechanical specification
- 7 -
3. Engineering Specification
No.
ITEM
Specification
Remark
1
ENERGY
SYNC(V/H)
VIDEO
POWER
LED COLOR
Normal
On/On
Active
≤ 40W Green
Sleep Mode
Off/On
Off
≤ 1W
Red
Off Mode
-
Off
≤ 1W
Off
2
Audio output
Source
Min
Typ
Max
PC
2.7W
3W
3.9W
Min : -10%
AV
2.7W
3W
3.9W
Max : +30%
TV
2.7W
3W
3.9W
3
D-SUB
1 : RED
2 : Green
10 : Digital GND
Pin configuration
3 : Blue
4 : ID2 (GND)
5 : S.T (GND)
6 : RED GND
7 : Green GND
8 : Blue GND
9 : N.C
10 : D-GND
11: ID0(GND)
12 :SDA
13: H-Sync
14 : V-Sync
15: SCL
Shell : GND
4
MTBF
Hours(Min)
Lamp Life : 50,000 Hours(MIN)
5
Operating Environment
Temp : 10 ~ 35 deg
Humidity : 20 ~ 80 %
6
Storage Environment
Temp : -10 ~ 60 deg
Non condensing
Humidity : 5 ~ 90 %
Non condensing
4. Optical Characteristic
No
Item
Specification
Remark
Min
Tpy
Max
1
Viewing Angle
R/L
89/89
<CR≥10>
U/D
89/89
2
Luminance
Luminance (cd/m
2
)
320
400
PSM : Dynamic, CSM: Cool
White luminance uniformity
75%
80%
White (100 IRE)
3
Contrast Ratio
CR
2400
3000
All white/ All black
4
CIE Color Coordinates
White
Wx
0.298
0.313
0.328
In AV input
(Warm)
Wy
0.314
0.329
0.344
PSM : Dynamic
White
Wx
0.270
0.285
0.300
White (85 IRE)
(Normal)
Wy
0.278
0.293
0.308
White
Wx
0.261
0.276
0.291
(Cool)
Wy
0.268
0.283
0.298
- 8 -
5. Outgoing Condition
No
Item
Condition
Remark
1
Power
Off
2
Volume Level
30
3
Main Picture Input
TV
4
Main Last Channel
Pr 01
5
Mute
Off
6
STATION
Auto Programme
To set
System
Storage from
Search
Manual Programme
To set
Storage
System
Band
Channel
Fine
Search
Name
Programme Edit
To set
Favourite Programme
Off
7
PICTURE
PSM
Dynamic
Standard
Mild
Game
User
Contrast
100
Brightness
50
Colour
60
Sharpness
50
Tint 0
CSM
Cool
Normal
Warm
User
Red
0
Green
0
Blue
0
Reset
To set
8
SOUND
SSM
Flat
Music
Movie
Sports
User
AVL
Off
Balance
0
9
TIME
Clock
-- : --
Off time
-- : -- Off
On time
-- : --
Pr.1
Vol. 30
Off
Auto sleep
Off
10
SPECIAL
Language
English
16 Language
Country
Others
30 Teletext Language
Child Lock
Off
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