LG 15EL950N-ZA / 15EL9500-ZA (CHASSIS:OD01J) Service Manual ▷ View online
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
This specification is applied to the OLED TV used OD01J chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 ºC ± 5 ºC(77 ºF ± 9 ºF), CST: 40 ºC ± 5 ºC
2) Relative Humidity : 65 % ± 10 %
3) Power Voltage
2) Relative Humidity : 65 % ± 10 %
3) Power Voltage
: Standard input voltage (AC 100-240 V~ 50 / 60 Hz)
* Standard Voltage of each products is marked by models.
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with
BOM.
5) The receiver must be operated for about 5 minutes prior to the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
2) Demanded other specification
- Safety: CE, IEC specification
- EMC:CE, IEC
- EMC:CE, IEC
4. Module specification(General)
No.
Item Specification
Measurement
Remark
1
Screen Size
15 inch
Diagonal
2
Aspect Ratio
16:9
3
AMOLED
15 inch WXGA AMOLED
HD
4
Storage Environment
Temp.: -20 deg ~ 60 deg
Humidity : 10 % ~ 90 %
5
Input Voltage
-0.3 ~ 14 Vdc
At 25 ºC
6
Power Consumption
32 W
Typica (Logic : 6 W, EL= 26 W)
- 7 -
5. Model General Specification
No.
Item
Specification
Remarks
1. Market
EU(PAL
Market-36Countries)
DTV & Analog (Total 36 countries)
(UK/Italy/Germany/France/Spain/Sweden/Finland/Netherland/Belgium/
Luxemburg/Greece/Denmark/Czech/Austria/Hungary/Switzerland/Croatia
Turkey/Norway/Slovenia/Poland/Portugal/Ireland/Moroco/Latvia/Estonial/
Lithuania/Rumania)
DTV (MPEG2/4, DVB-C) : 2 Countries
Swenden/ Finland
Analog Only - 7 countries
(Russia/Slovakia/Bosnia/Serbia/Bulgaria/Latvia/Albania/Kazakhstan)
2.
Broadcasting system
1) PAL-BG
2) PAL-DK
3) PAL-I/I’
4) SECAM L/L’
5) DVB-T/C (ID TV)
3.
Receiving system
Analog : Upper Heterodyne
G
DBV-T
Digital : COFDM , QAM
- Guard Interval(Bitrate Mbit/s)
1/4, 1/8, 1/16, 1/32
- Modulation : Code Rate
QPSK : 1/2, 2/3, 3/4, 4/5, 5/6, 7/8
16-QAM : 1/2, 2/3, 3/4, 4/5, 5/6, 7/8
64-QAM : 1/2, 2/3, 3/4, 4/5, 5/6, 7/8
G
DVB-C
- Symbolrate :
4.0Msymbols/s to 7.2Msymbols/s
- Modulation
16QAM, 64-QAM, 128-QAM and 256-QAM
4.
Mini - HDMI Input (1EA)
HDMI1-DTV
Support HDCP
5. USB
DVIX
6.
USB B
For Service
- 8 -
6. Module optical specification
1) Contrast Ratio(CR) is defined mathematically as :
CR = Surface Luminance at all white pixels / Surface Luminance at all black pixels
It is measured at center 1 point.
It is measured at center 1 point.
2) Surface luminance is determined after the unit has been ‘ON’ and 3minutes after lighting the module in a dark environment at
25°C ± 2 °C. Surface luminance is the luminance value at center 1 point across the AMOLED surface 50 cm from the surface with
all pixels displaying white.
all pixels displaying white.
3) The variation in surface luminance , d WHITE is defined as :
- d WHITE(9P) = Minimum(Lon1,Lon2,..., Lon9) / Maximum(Lon1,Lon2..., Lon9)
Where Lon1 to Lon9 are the luminance with all pixels displaying white at 9 locations.
Where Lon1 to Lon9 are the luminance with all pixels displaying white at 9 locations.
4) Image sticking
When it changes into pattern-B after a 1 hour drive by pattern-A, it disappears within 5 seconds.
No.
Item Specification
Min.
Typ.
Max.
Remark
1.
Viewing Angle [CR>10]
Right/Left(Up/Down)
Free
Degree
2.
Luminance Luminance
(cd/m
2
)
180
200
Uniformity Variation
70
80
3.
Contrast Ratio
CR
50,000
100,000
4.
CIE Color Coordinates
White
Wx
0.285
Wy 0.299
RED Rx
0.667
Ry
Typ.
0.333
Typ.
Green Gx
-0.03
0.230
+0.03
Gy
0.675
Blue Bx
0.145
By
0.065
7. HDMI Input
(1) DTV Mode
No.
Resolution
H-freq(kHz)
V-freq.(Hz)
Pixel clock(MHz)
Proposed
Remark
1.
720*480
31.469 / 31.5
59.94 / 60
27.00 / 27.03
SDTV 480P
2.
720*576 31.25
50
54
SDTV
576P
3.
1280*720 37.500
50
74.25 HDTV
720P
4.
1280*720
44.96 / 45
59.94 /60
74.17 / 74.25
HDTV 720P
5.
1920*1080
33.72 / 33.75
59.94 /60
74.17 / 74.25
HDTV 1080I
6.
1920*1080 28.125 50.00
74.25
HDTV
1080I
7.
1920*1080
26.97 / 27
23.97 / 24
74.17 / 74.25
HDTV 1080P
8.
1920*1080
33.716 / 33.75
29.976 / 30.00
74.25
HDTV 1080P
9.
1920*1080 56.250 50
148.5
HDTV
1080P
10.
1920*1080
67.43 / 67.5
59.94 / 60
148.35/148.50
HDTV 1080P
Click on the first or last page to see other 15EL950N-ZA / 15EL9500-ZA (CHASSIS:OD01J) service manuals if exist.