JBL SB 150 Service Manual ▷ View online
3-1
•
Special information for BGA-ICs:
• For sets produced before 1.1.2005 (except products
of 2004), containing leaded solder-alloy and
components, all needed spare-parts will be available
till the end of the service-period. For repair of such
sets nothing changes.
components, all needed spare-parts will be available
till the end of the service-period. For repair of such
sets nothing changes.
• BGA-de-/soldering (+ baking instructions)
You will find this and more technical information within
the “magazine”, chapter “workshop news”.
the “magazine”, chapter “workshop news”.
For additional questions please contact your local
repair-helpdesk.
repair-helpdesk.
How to Remove / Install Flat Pack-IC
Special Information of BGA IC & Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
1. Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
(about 5 to 6 seconds). (Fig. S-1-1)
2. Remove the flat pack-IC with tweezers while
applying the hot air.
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
CAUTION:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the chip parts around the
flat pack-IC for over 6 seconds because damage
to the chip parts may occur. Put masking tape
around the flat pack-IC to protect other parts from
damage. (Fig. S-1-2)
to the chip parts may occur. Put masking tape
around the flat pack-IC to protect other parts from
damage. (Fig. S-1-2)
Fig. S-1-1
3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when
removing it.
pin or the solder lands under the IC when
removing it.
With Soldering Iron:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
With Iron Wire:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
3. While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA
contact pads as shown in Fig. S-1-5.
melts so as to lift the IC leads from the CBA
contact pads as shown in Fig. S-1-5.
4. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
5. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
Note: When
using
a soldering iron, care must be
taken to ensure that the flat pack-IC is not
being held by glue. When the flat pack-IC is
removed from the CBA, handle it gently
because it may be damaged if force is applied.
being held by glue. When the flat pack-IC is
removed from the CBA, handle it gently
because it may be damaged if force is applied.
Hot-air
Flat Pack-IC
Desoldering
Machine
Flat Pack-IC
Desoldering
Machine
CBA
Flat Pack-IC
Tweezers
Masking
Tape
Tape
Fig. S-1-2
Flat Pack-IC
Desoldering Braid
Soldering Iron
Fig. S-1-3
Fine Tip
Soldering Iron
Soldering Iron
Sharp
Pin
Pin
Fig. S-1-4
To Solid
Mounting Point
Mounting Point
Soldering Iron
Iron Wire
or
Hot Air Blower
Fig. S-1-5
Fine Tip
Soldering Iron
Soldering Iron
CBA
Flat Pack-IC
Tweezers
Fig. S-1-6
3-2
Special Information of BGA IC & Flat Pack- IC
3-3
2. Installation
1. Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA
so you can install a replacement flat pack-IC more
easily.
so you can install a replacement flat pack-IC more
easily.
2. The “ ” mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be sure this mark matches the 1
on the PCB when positioning for installation. Then
presolder the four corners of the flat pack-IC. (See
Fig. S-1-8.)
on the PCB when positioning for installation. Then
presolder the four corners of the flat pack-IC. (See
Fig. S-1-8.)
3. Solder all pins of the flat pack-IC. Be sure that
none of the pins have solder bridges.
Instructions for Handling Semi-
Special Information BGA IC & Flat Pack-IC
conductors
Electrostatic breakdown of the semi-conductors may
occur due to a potential difference caused by
electrostatic charge during unpacking or repair work.
occur due to a potential difference caused by
electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1 MΩ) that is
properly grounded to remove any static electricity that
may be charged on the body.
properly grounded to remove any static electricity that
may be charged on the body.
2. Ground for Workbench
Be sure to place a conductive sheet or copper plate
with proper grounding (1 MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escape through the body grounding
band, be careful to avoid contacting semi-conductors
with your clothing.
with proper grounding (1 MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escape through the body grounding
band, be careful to avoid contacting semi-conductors
with your clothing.
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
is indicated by a " " mark.
Fig. S-1-7
Presolder
CBA
Flat Pack-IC
Fig. S-1-8
<Incorrect>
CBA
Grounding Band
Conductive Sheet or
Copper Plate
Copper Plate
1MΩ
1MΩ
<Correct>
CBA
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ZUURYOTYKXZKJOTZUZNKMGVZUVXOKJOXUTMXORR
ZUURYOTYKXZKJOTZUZNKMGVZUVXOKJOXUTMXORR
2UUYKTZNKHGIQVGTKRYIXK]YV[RRU[ZZNKHGIQVGTKRGTJRUUYKTZNK6)(YIXK]Y!
H:GQK
U[ZZNK3GOTHUGXJ
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Disassemble
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Disassembly procedure
G:UURY
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Screw driver or electric screw driver
=NOZKUOR(
n-hexane or isopropanol)
4-1
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