Sony CDX-H910UI / CDX-HR910UI Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
CDX-H910UI/HR910UI
SPECIFICATIONS
9-889-372-01
2008L04-1
©
2008.12
US Model
Canadian Model
CDX-H910UI
AEP Model
UK Model
CDX-HR910UI
E Model
CDX-H910UI
Ver. 1.0 2008.12
Model Name Using Similar Mechanism
CDX-GT930UI/GT937UI/
GT980UI
GT980UI
CD Drive Mechanism Type
MG-101Z-188//Q
Optical Pick-up Name
DAX-25A
• The tuner and CD sections have no adjustments.
(Photo: CDX-HR910UI)
CDX-H910UI
FM/AM COMPACT DISC PLAYER
CDX-HR910UI
FM/MW/LW COMPACT DISC PLAYER
CD Player section
Signal-to-noise ratio: 120 dB
Frequency response: 10 – 20,000 Hz
Wow and fl utter: Below measurable limit
Frequency response: 10 – 20,000 Hz
Wow and fl utter: Below measurable limit
Tuner section
CDX-H910UI:
FM
Tuning range:
FM
Tuning range:
87.5 – 108.0 MHz (at 50 kHz step)
87.5 – 107.9 MHz (at 200 kHz step)
FM tuning interval:
50 kHz/200 kHz switchable
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 150 kHz
Usable sensitivity: 10 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 70 dB (mono)
Separation: 40 dB at 1 kHz
Frequency response: 20 – 15,000 Hz
Usable sensitivity: 10 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 70 dB (mono)
Separation: 40 dB at 1 kHz
Frequency response: 20 – 15,000 Hz
AM
Tuning range:
Tuning range:
531 – 1,602 kHz (at 9 kHz step)
530 – 1,710 kHz (at 10 kHz step)
AM tuning interval: 9kHz/10kHz switchable
Antenna (aerial) terminal:
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 25 kHz
Sensitivity: 26
Sensitivity: 26
μV
CDX-HR910UI:
FM
Tuning range: 87.5 – 108.0 MHz
Antenna (aerial) terminal:
FM
Tuning range: 87.5 – 108.0 MHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 150 kHz
Usable sensitivity: 10 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 70 dB (mono)
Separation: 40 dB at 1 kHz
Frequency response: 20 – 15,000 Hz
Usable sensitivity: 10 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 70 dB (mono)
Separation: 40 dB at 1 kHz
Frequency response: 20 – 15,000 Hz
MW/LW
Tuning range:
Tuning range:
MW: 531 – 1,602 kHz
LW: 153 – 279 kHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 25 kHz
Sensitivity: MW: 26
Sensitivity: MW: 26
μV, LW: 45 μV
USB Player section
Interface: USB (Full-speed)
Maximum current: 500mA
Maximum current: 500mA
– Continued on next page –
AUDIO POWER SPECIFICATIONS (CDX-H910UI only)
CEA2006 Standard
Power Output: 17 Watts RMS
CEA2006 Standard
Power Output: 17 Watts RMS
× 4 at 4 Ohms < 1% THD+N
SN Ratio: 82 dBA (reference: 1 Watt into 4 Ohms)
Power amplifi er section
Outputs: Speaker outputs (sure seal connectors)
Speaker impedance: 4 – 8 ohms
Maximum power output: 52 W
Speaker impedance: 4 – 8 ohms
Maximum power output: 52 W
× 4 (at 4 ohms)
General
Outputs:
Audio outputs terminal (front/rear)
Subwoofer output terminal (mono)
Power antenna (aerial) relay control terminal
Power
amplifi er control terminal
Inputs:
Remote controller input terminal
Antenna (aerial) input terminal
Telephone ATT control terminal
Illumination control terminal
BUS control input terminal
BUS audio input terminal
AUX input terminal
USB signal input terminal
CDX-H910UI/HR910UI
2
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
If the optical pick-up block is defective, please replace the whole
optical pick-up block.
Never turn the semi-fi xed resistor located at the side of optical
pick-up block.
optical pick-up block.
Never turn the semi-fi xed resistor located at the side of optical
pick-up block.
TEST DISCS
Please use the following test discs for the check on the CD section.
Please use the following test discs for the check on the CD section.
YDES-18 (Part No. 3-702-101-01)
PATD-012 (Part No. 4-225-203-01)
This label is located on the bottom of the chassis.
Tone controls:
Low: ±10 dB at 60 Hz (XPLOD)
Mid: ±10 dB at 1 kHz (XPLOD)
High: ±10 dB at 10 kHz (XPLOD)
Power requirements: 12 V DC boat battery
(negative ground (earth))
Dimensions: Approx. 197
× 89 × 187 mm
(7
7/8
× 3
5/8
× 7
3/8
in) (w/h/d)
Mounting dimensions: Approx. 181 × 52 × 144 mm
(7
(7
1/4
× 2
1/8
× 5
3/4
in) (w/h/d)
Mass: Approx. 1.8 kg (4 lb)
Supplied accessories:
Supplied accessories:
Card remote commander: RM-X151
Parts for installation and connections (1 set)
Design and specifi cations are subject to change
without notice.
without notice.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
SERVICE NOTES
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
optical pick-up
semi-fixed resistor
CDX-H910UI/HR910UI
3
1.
SERVICING NOTES
............................................. 4
2. GENERAL
Location of Controls (CDX-H910UI) ............................. 5
Location of Controls (CDX-HR910UI) .......................... 6
Connection Example (CDX-H910UI) ............................ 7
Connection Example (CDX-HR910UI) .......................... 7
Connections
(CDX-H910UI)
..........................................
8
Connections
(CDX-HR910UI)
.......................................
9
3. DISASSEMBLY
3-1. Front Panel Overall Assy ............................................... 10
3-2. Sub Panel Section .......................................................... 11
3-3. CD Mechanism Block ..................................................... 11
3-4. Main
3-2. Sub Panel Section .......................................................... 11
3-3. CD Mechanism Block ..................................................... 11
3-4. Main
Board
..................................................................... 12
3-5. Servo
Board
.................................................................... 12
3-6. Chassis
(T)
Sub
Assy
...................................................... 13
3-7. Roller Arm Assy .............................................................. 13
3-8. Chassis
3-8. Chassis
(OP)
Assy
........................................................... 14
3-9. Chucking
Arm
Sub
Assy
................................................. 14
3-10. Sled Motor Assy .............................................................. 15
3-11. Optical Pick-up Section .................................................. 16
3-12. Optical Pick-up ............................................................... 16
3-11. Optical Pick-up Section .................................................. 16
3-12. Optical Pick-up ............................................................... 16
4. DIAGRAMS
4-1. Block Diagram –Main Section– ..................................... 18
4-2. Block Diagram –Display Section– ................................. 19
4-3. Printed Wiring Board –Main Section– ............................ 20
4-4. Schematic Diagram –Main Section (1/3)– ...................... 21
4-5. Schematic Diagram –Main Section (2/3)– ...................... 22
4-6. Schematic Diagram –Main Section (3/3)– ...................... 23
4-7. Printed Wiring Board –Sub Section– .............................. 24
4-8. Schematic Diagram –Sub Section– ................................. 25
4-2. Block Diagram –Display Section– ................................. 19
4-3. Printed Wiring Board –Main Section– ............................ 20
4-4. Schematic Diagram –Main Section (1/3)– ...................... 21
4-5. Schematic Diagram –Main Section (2/3)– ...................... 22
4-6. Schematic Diagram –Main Section (3/3)– ...................... 23
4-7. Printed Wiring Board –Sub Section– .............................. 24
4-8. Schematic Diagram –Sub Section– ................................. 25
5.
EXPLODED VIEWS
5-1. Front Panel Section ......................................................... 31
5-2. Sub
5-2. Sub
Panel
Section
........................................................... 32
5-3. Main
Section
................................................................... 33
5-4. CD Mechanism Section (MG-101Z-188//Q) .................. 34
6.
ELECTRICAL PARTS LIST
.............................. 35
TABLE OF CONTENTS
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
PLAYABLE DISCS ON THIS UNIT
This unit can play CD-DA (also containing CD TEXT) and CD-
R/CD-RW (MP3/WMA/AAC fi les).
This unit can play CD-DA (also containing CD TEXT) and CD-
R/CD-RW (MP3/WMA/AAC fi les).
Type of discs
Label on the disc
CD-DA
MP3
WMA
AAC
CDX-H910UI/HR910UI
4
SECTION 1
SERVICING NOTES
EXTENSION CABLE AND SERVICE POSITION
When repairing or servicing this set, connect the jig (extension
cable) as shown below.
When repairing or servicing this set, connect the jig (extension
cable) as shown below.
• Connect the MAIN board (CN201) and the SERVO board
(CN401) with the extension cable (Part No. J-2502-076-1).
NOTE FOR REPLACEMENT OF THE SERVO BOARD
When repairing, the complete SERVO board (Part No. A-1554-
409-A) should be replaced since any parts in the SERVO board
cannot be repaired.
When repairing, the complete SERVO board (Part No. A-1554-
409-A) should be replaced since any parts in the SERVO board
cannot be repaired.
NOTE FOR REPAIRING THE FRONT PANEL
The front panel should never be disassembled since it is water-
proof fi nished.
Replace the front panel overall assembly completely when replac-
ing the key board or other components of the front panel.
The front panel should never be disassembled since it is water-
proof fi nished.
Replace the front panel overall assembly completely when replac-
ing the key board or other components of the front panel.
SERVO BOARD
CN401
CN401
MAIN BOARD
CN201
CN201
J-2502-076-1