DOWNLOAD Panasonic TH-65PF12WK / TH-65PF12TK Service Manual ↓ Size: 19.81 MB | Pages: 127 in PDF or view online for FREE

Model
TH-65PF12WK TH-65PF12TK
Pages
127
Size
19.81 MB
Type
PDF
Document
Service Manual
Brand
Device
Plasma / GPF12D CHASSIS
File
th-65pf12wk-th-65pf12tk.pdf
Date

Panasonic TH-65PF12WK / TH-65PF12TK Service Manual ▷ View online

5
TH-65PF12WK / TH-65PF12TK
2.2.
About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 
°F (30~40 °C) higher. Please
use a high temperature soldering iron and set it to 700 ± 20 
°F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100 
°F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
6
TH-65PF12WK / TH-65PF12TK
3 Service Navigation
3.1.
Service Hint
Board Name
Function
Board Name
Function
DN
Digital Signal Processor, Microcomputer
SS2
Sustain out (Upper)
D
Format Converter, Plasma AI Processor
Sub-Field Processor
SS3
Sustain out (Lower)
C1 
Data drive (Right)
DS 
Slot Interface (Audio / Video / Sync Input Switch), 
Sync Processor, Audio Processor,
Speaker Out Amplifier, DC-DC Converter
C2
Data drive (Center)
C3
Data drive (Left)
S1
Power switch
SC
Scan drive
V1
Remote receiver, LED-G, R
SU
Scan out (Upper)
Non serviceable.
SU-Board should be exchanged for service.
V2
Key switch
PB
Fan Control
P
Power supply
SD
Scan out (Lower)
Non serviceable.
SD-Board should be exchanged for service.
H3 Speaker 
terminal
HX 
PC / RS-232C_Input terminal
HHH
Dual HDMI terminal
SS
Sustain drive
HL
Component Video terminal (BNC), LAN terminal 
7
TH-65PF12WK / TH-65PF12TK
3.2.
Applicable signals
8
TH-65PF12WK / TH-65PF12TK
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